DE60039857D1 - Verfahren und vorrichtung zur verarbeitung eines wafers - Google Patents

Verfahren und vorrichtung zur verarbeitung eines wafers

Info

Publication number
DE60039857D1
DE60039857D1 DE60039857T DE60039857T DE60039857D1 DE 60039857 D1 DE60039857 D1 DE 60039857D1 DE 60039857 T DE60039857 T DE 60039857T DE 60039857 T DE60039857 T DE 60039857T DE 60039857 D1 DE60039857 D1 DE 60039857D1
Authority
DE
Germany
Prior art keywords
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60039857T
Other languages
English (en)
Inventor
Michael Ravkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60039857D1 publication Critical patent/DE60039857D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
DE60039857T 1999-03-19 2000-03-08 Verfahren und vorrichtung zur verarbeitung eines wafers Expired - Lifetime DE60039857D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/272,874 US6290780B1 (en) 1999-03-19 1999-03-19 Method and apparatus for processing a wafer
PCT/US2000/006217 WO2000057455A1 (en) 1999-03-19 2000-03-08 Method and apparatus for processing a wafer

Publications (1)

Publication Number Publication Date
DE60039857D1 true DE60039857D1 (de) 2008-09-25

Family

ID=23041660

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039857T Expired - Lifetime DE60039857D1 (de) 1999-03-19 2000-03-08 Verfahren und vorrichtung zur verarbeitung eines wafers

Country Status (8)

Country Link
US (2) US6290780B1 (de)
EP (1) EP1169729B1 (de)
JP (1) JP4879399B2 (de)
KR (1) KR100709737B1 (de)
AU (1) AU3521700A (de)
DE (1) DE60039857D1 (de)
TW (1) TW479264B (de)
WO (1) WO2000057455A1 (de)

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US6540841B1 (en) * 2000-06-30 2003-04-01 Chartered Semiconductor Manufacturing Ltd. Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
KR100672631B1 (ko) * 2001-09-19 2007-01-23 엘지.필립스 엘시디 주식회사 액정패널 제작용 세정장치
US6986185B2 (en) 2001-10-30 2006-01-17 Applied Materials Inc. Methods and apparatus for determining scrubber brush pressure
US20030136431A1 (en) * 2002-01-24 2003-07-24 Semitool, Inc. Method and apparatus for cleaning of microelectronic workpieces after chemical-mechanical planarization
US7067016B1 (en) * 2003-03-31 2006-06-27 Lam Research Corporation Chemically assisted mechanical cleaning of MRAM structures
US8316866B2 (en) * 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US7648584B2 (en) * 2003-06-27 2010-01-19 Lam Research Corporation Method and apparatus for removing contamination from substrate
US7737097B2 (en) * 2003-06-27 2010-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
US7913703B1 (en) 2003-06-27 2011-03-29 Lam Research Corporation Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate
US20040261823A1 (en) * 2003-06-27 2004-12-30 Lam Research Corporation Method and apparatus for removing a target layer from a substrate using reactive gases
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR101119961B1 (ko) * 2003-10-28 2012-03-15 어플라이드 머티어리얼스, 인코포레이티드 스크러버 박스 및 그 사용 방법
US8522799B2 (en) 2005-12-30 2013-09-03 Lam Research Corporation Apparatus and system for cleaning a substrate
US7568490B2 (en) * 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US8043441B2 (en) 2005-06-15 2011-10-25 Lam Research Corporation Method and apparatus for cleaning a substrate using non-Newtonian fluids
US8323420B2 (en) 2005-06-30 2012-12-04 Lam Research Corporation Method for removing material from semiconductor wafer and apparatus for performing the same
US7416370B2 (en) * 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US7862662B2 (en) * 2005-12-30 2011-01-04 Lam Research Corporation Method and material for cleaning a substrate
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
US20060046376A1 (en) * 2004-08-31 2006-03-02 Hofer Willard L Rotating gripper wafer flipper
KR20080005974A (ko) * 2005-04-25 2008-01-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 에지를 세정하기 위한 방법 및 장치
US7115023B1 (en) * 2005-06-29 2006-10-03 Lam Research Corporation Process tape for cleaning or processing the edge of a semiconductor wafer
US8480810B2 (en) * 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
EP2428557A1 (de) * 2005-12-30 2012-03-14 LAM Research Corporation Reinigungslösung
JP4667264B2 (ja) * 2006-02-08 2011-04-06 パナソニック株式会社 半導体基板の洗浄方法及び半導体基板の洗浄装置
US20070212983A1 (en) * 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
TW200809936A (en) * 2006-06-05 2008-02-16 Applied Materials Inc Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning
US20080148595A1 (en) * 2006-12-20 2008-06-26 Lam Research Corporation Method and apparatus for drying substrates using a surface tensions reducing gas
US7897213B2 (en) * 2007-02-08 2011-03-01 Lam Research Corporation Methods for contained chemical surface treatment
JP4928343B2 (ja) * 2007-04-27 2012-05-09 大日本スクリーン製造株式会社 基板処理装置
US8388762B2 (en) * 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
US8084406B2 (en) 2007-12-14 2011-12-27 Lam Research Corporation Apparatus for particle removal by single-phase and two-phase media
JP5661564B2 (ja) * 2011-06-10 2015-01-28 株式会社荏原製作所 洗浄性能予測方法及び基板洗浄方法
JP5775383B2 (ja) * 2011-06-30 2015-09-09 株式会社荏原製作所 基板洗浄方法
US20130111678A1 (en) * 2011-11-08 2013-05-09 Applied Materials, Inc. Brush box module for chemical mechanical polishing cleaner
US8992692B2 (en) 2012-02-03 2015-03-31 Stmicroelectronics, Inc. Adjustable brush cleaning apparatus for semiconductor wafers and associated methods
JP6133120B2 (ja) 2012-05-17 2017-05-24 株式会社荏原製作所 基板洗浄装置
TWI612568B (zh) * 2012-05-17 2018-01-21 Ebara Corp 基板洗淨裝置
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
JP6875154B2 (ja) * 2017-03-06 2021-05-19 株式会社荏原製作所 セルフクリーニング装置、基板処理装置、および洗浄具のセルフクリーニング方法
CN109731819B (zh) * 2018-12-26 2021-07-23 中环艾能(高邮)能源科技有限公司 一种多晶硅片生产装置
US20200391530A1 (en) 2019-06-13 2020-12-17 Illinois Tool Works Inc. Multi-functional print head for a stencil printer
US11318549B2 (en) 2019-06-13 2022-05-03 Illinois Tool Works Inc. Solder paste bead recovery system and method
US11247286B2 (en) 2019-06-13 2022-02-15 Illinois Tool Works Inc. Paste dispensing transfer system and method for a stencil printer
US11664213B2 (en) * 2019-12-26 2023-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Bevel edge removal methods, tools, and systems
CN114815917B (zh) * 2022-04-20 2024-09-10 北京晶亦精微科技股份有限公司 一种晶圆刷洗压力的控制方法、装置、设备及存储介质

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JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
US5624501A (en) 1995-09-26 1997-04-29 Gill, Jr.; Gerald L. Apparatus for cleaning semiconductor wafers
US5861066A (en) 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
US5794299A (en) * 1996-08-29 1998-08-18 Ontrak Systems, Inc. Containment apparatus
US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
US5901399A (en) * 1996-12-30 1999-05-11 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
US5868857A (en) * 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
JPH11625A (ja) * 1997-06-13 1999-01-06 Mitsubishi Materials Corp ウェーハの洗浄装置
JPH1119609A (ja) * 1997-07-08 1999-01-26 Syst Seiko Kk 回転ディスクの表面処理方法および装置
JP3320640B2 (ja) * 1997-07-23 2002-09-03 東京エレクトロン株式会社 洗浄装置
US6059888A (en) * 1997-11-14 2000-05-09 Creative Design Corporation Wafer cleaning system
US5894622A (en) * 1997-12-31 1999-04-20 International Business Machines Corporation Brush conditioner wing

Also Published As

Publication number Publication date
KR100709737B1 (ko) 2007-04-19
WO2000057455A1 (en) 2000-09-28
JP4879399B2 (ja) 2012-02-22
TW479264B (en) 2002-03-11
EP1169729A1 (de) 2002-01-09
EP1169729B1 (de) 2008-08-13
US20010044979A1 (en) 2001-11-29
JP2002540598A (ja) 2002-11-26
KR20020006685A (ko) 2002-01-24
US6425158B2 (en) 2002-07-30
AU3521700A (en) 2000-10-09
US6290780B1 (en) 2001-09-18

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Legal Events

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8364 No opposition during term of opposition