DE19781160T1 - Elektrooptische hybride Verdrahtungsplatine und Verfahren zur Herstellung derselben - Google Patents
Elektrooptische hybride Verdrahtungsplatine und Verfahren zur Herstellung derselbenInfo
- Publication number
- DE19781160T1 DE19781160T1 DE19781160T DE19781160T DE19781160T1 DE 19781160 T1 DE19781160 T1 DE 19781160T1 DE 19781160 T DE19781160 T DE 19781160T DE 19781160 T DE19781160 T DE 19781160T DE 19781160 T1 DE19781160 T1 DE 19781160T1
- Authority
- DE
- Germany
- Prior art keywords
- electro
- manufacturing
- same
- wiring board
- optical hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
- G02B6/2817—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using reflective elements to split or combine optical signals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
- G02B6/3612—Wiring methods or machines
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3809—Dismountable connectors, i.e. comprising plugs without a ferrule embedding the fibre end, i.e. with bare fibre end
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27470096A JP3705873B2 (ja) | 1996-10-17 | 1996-10-17 | 光・電気混在配線板 |
JP8/274700 | 1996-10-17 | ||
PCT/JP1997/003715 WO1998018301A1 (fr) | 1996-10-17 | 1997-10-15 | Tableau de connexion hybride optique/electrique et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19781160T1 true DE19781160T1 (de) | 1999-01-28 |
DE19781160B4 DE19781160B4 (de) | 2005-07-07 |
Family
ID=17545350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19781160T Expired - Fee Related DE19781160B4 (de) | 1996-10-17 | 1997-10-15 | Elektrooptische hybride Verdrahtungsplatine und Verfahren zur Herstellung derselben |
Country Status (9)
Country | Link |
---|---|
US (1) | US6257771B1 (de) |
JP (1) | JP3705873B2 (de) |
KR (1) | KR100272953B1 (de) |
CN (1) | CN1095084C (de) |
DE (1) | DE19781160B4 (de) |
GB (1) | GB2322479B (de) |
MY (1) | MY120706A (de) |
TW (1) | TW363336B (de) |
WO (1) | WO1998018301A1 (de) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6690845B1 (en) | 1998-10-09 | 2004-02-10 | Fujitsu Limited | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making |
US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
US6611635B1 (en) | 1998-10-09 | 2003-08-26 | Fujitsu Limited | Opto-electronic substrates with electrical and optical interconnections and methods for making |
US6301401B1 (en) * | 1999-04-02 | 2001-10-09 | Convergence Technologies, Ltd. | Electro-optical package for reducing parasitic effects |
TW451084B (en) | 1999-06-25 | 2001-08-21 | Toppan Printing Co Ltd | Optical-electro wiring board, mounted board, and manufacturing method of optical-electro wiring board |
WO2001038909A1 (fr) * | 1999-11-24 | 2001-05-31 | Mitsubishi Cable Industries, Ltd. | Fibre optique gainee, ensemble fibre optique, procedes de fabrication et substrat pur fibre optique |
GB0000405D0 (en) * | 2000-01-11 | 2000-03-01 | British Aerospace | Improvements relating to interfacing embedded optical transmission structures |
GB0000415D0 (en) * | 2000-01-11 | 2000-03-01 | British Aerospace | Improvements relating to interfacing embedded optical transmission structures |
US6477303B1 (en) * | 2000-05-15 | 2002-11-05 | Litton Systems, Inc. | MEMS optical backplane interface |
US6600214B2 (en) * | 2000-05-15 | 2003-07-29 | Hitachi Aic Inc. | Electronic component device and method of manufacturing the same |
US6628860B1 (en) * | 2000-06-05 | 2003-09-30 | Infineon Technologies North America Corp. | Fiber optic connector systems |
JP4691758B2 (ja) * | 2000-07-10 | 2011-06-01 | 凸版印刷株式会社 | 光配線基板および製造方法 |
US6588943B1 (en) * | 2000-08-07 | 2003-07-08 | Teradyne, Inc. | Electro-optic connector module |
US6400882B1 (en) * | 2000-08-24 | 2002-06-04 | Molex Incorporated | Apparatus for fabricating optical backplanes |
WO2002031563A1 (de) * | 2000-10-10 | 2002-04-18 | Siemens Aktiengesellschaft | Umlenkende auskopplung in einer leiterplatte eingebetteter lichtleiter |
WO2002061481A2 (en) * | 2000-10-31 | 2002-08-08 | Viasystems Group, Inc. | Fiber optic circuit board connector |
US7178994B2 (en) * | 2000-10-31 | 2007-02-20 | Viasystems Group, Inc. | Fiber optic circuit connector |
US6539157B2 (en) * | 2000-12-28 | 2003-03-25 | Honeywell Advanced Circuits, Inc. | Layered circuit boards and methods of production thereof |
NL1017619C2 (nl) * | 2001-03-16 | 2002-10-07 | Koninkl Kpn Nv | Methode voor het in een gebouw aanbrengen van een breedband infrastructuur door middel van optische vezels. |
US6831301B2 (en) * | 2001-10-15 | 2004-12-14 | Micron Technology, Inc. | Method and system for electrically coupling a chip to chip package |
US6859587B2 (en) * | 2001-12-28 | 2005-02-22 | Intel Corporation | Method and apparatus for wafer level testing of integrated optical waveguide circuits |
US6999644B1 (en) * | 2002-02-15 | 2006-02-14 | Lebby Michael S | Discrete optoelectric package |
DE10214223B4 (de) * | 2002-03-22 | 2004-05-06 | Infineon Technologies Ag | Anordnung mit einem Steckverbindungselement für opto-elektrische Bauelemente oder Baugruppen und einer Leiterplatte |
GB2405724B (en) * | 2002-06-24 | 2006-02-08 | Samsung Electronics Co Ltd | Memory module having a path for transmitting high-speed data and a path for transmitting low-speed data and memory system having the memory module |
GB0217066D0 (en) * | 2002-07-23 | 2002-08-28 | Terahertz Photonics Ltd | Optical backplane connectivity |
KR100460703B1 (ko) * | 2002-08-21 | 2004-12-09 | 한국전자통신연구원 | 일체화된 광송수신 모듈과 광도파로를 구비하는 광백플레인 |
US7149376B2 (en) * | 2002-08-27 | 2006-12-12 | Ibiden Co., Ltd. | Embedded optical coupling in circuit boards |
US20040042705A1 (en) * | 2002-08-27 | 2004-03-04 | Uchida Toshi K. | Embedded optical coupling in circuit boards |
KR100449876B1 (ko) * | 2002-12-05 | 2004-09-22 | 삼성전기주식회사 | 블록형 다채널 광신호를 연결할 수 있는 다층인쇄회로기판 및 그 방법 |
KR100451635B1 (ko) * | 2002-12-10 | 2004-10-08 | 삼성전기주식회사 | 섬유 블록과 파이프 블록, 및 이를 이용하여 다층인쇄회로기판의 층간 광신호를 연결하는 방법 |
US20050063637A1 (en) * | 2003-09-22 | 2005-03-24 | Mershon Jayne L. | Connecting a component with an embedded optical fiber |
KR20050040589A (ko) | 2003-10-29 | 2005-05-03 | 삼성전기주식회사 | 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법 |
KR20050046356A (ko) * | 2003-11-14 | 2005-05-18 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
JP2005195651A (ja) * | 2003-12-26 | 2005-07-21 | Internatl Business Mach Corp <Ibm> | 光接続基板、光伝送システム、及び製造方法 |
EP1723456B1 (de) * | 2004-02-18 | 2021-08-04 | Color Chip (Israel) Ltd. | System und verfahren zur herstellung eines elektrooptischen moduls |
IL160952A (en) * | 2004-03-18 | 2008-04-13 | Rafael Advanced Defense Sys | Connecting a motherboard using fiber optics |
FR2871244A1 (fr) * | 2004-06-07 | 2005-12-09 | Fci Sa | Dispositif de couplage optique |
KR100679253B1 (ko) * | 2004-09-10 | 2007-02-06 | 한국정보통신대학교 산학협력단 | 광 피씨비, 광 피씨비용 송수신 모듈 및 광연결블록연결구조 |
JP2006235031A (ja) * | 2005-02-23 | 2006-09-07 | Fuji Xerox Co Ltd | マルチチップモジュールおよびその実装方法 |
JP4468210B2 (ja) * | 2005-02-28 | 2010-05-26 | 株式会社東芝 | Lsiパッケージ用インターフェイスモジュール及びlsi実装体 |
JP4961129B2 (ja) | 2005-10-18 | 2012-06-27 | 株式会社アドバンテスト | 光伝送手段付き密封部材,光電子装置及び光伝送方法 |
KR100787101B1 (ko) | 2005-11-15 | 2007-12-21 | 중앙대학교 산학협력단 | 광신호 접속체 및 이를 이용한 광 인쇄회로기판 |
JP4711895B2 (ja) * | 2006-02-03 | 2011-06-29 | ホシデン株式会社 | 光電フレキシブル配線板の接続構造、並びにコネクタ及び光電フレキシブル配線板 |
EP1860474B1 (de) * | 2006-05-25 | 2014-10-15 | Xyratex Technology Limited | Rohling für eine optische Leiterplatte, Bausatz und Verfahren zur Herstelllung einer optischen Leiterplatte |
JP4564474B2 (ja) * | 2006-07-26 | 2010-10-20 | 大成建設株式会社 | ケーブル敷設機 |
JP4882644B2 (ja) * | 2006-08-10 | 2012-02-22 | パナソニック電工株式会社 | 光電気変換装置 |
JP4903120B2 (ja) * | 2007-10-03 | 2012-03-28 | 株式会社フジクラ | 光路変更部材 |
JP5549853B2 (ja) * | 2010-01-26 | 2014-07-16 | 日立化成株式会社 | マルチワイヤ配線板及びその製造方法 |
US20110206379A1 (en) * | 2010-02-25 | 2011-08-25 | International Business Machines Corporation | Opto-electronic module with improved low power, high speed electrical signal integrity |
TW201211606A (en) * | 2010-09-03 | 2012-03-16 | Univ Nat Central | Optical transmission module with optical waveguide structure |
EP2616859A1 (de) * | 2010-09-14 | 2013-07-24 | Fci | Optische kopplungsvorrichtung, optisches system und montageverfahren |
US9435963B2 (en) | 2012-03-30 | 2016-09-06 | Corning Cable Systems Llc | Misalignment-tolerant total-internal-reflection fiber optic interface modules and assemblies with high coupling efficiency |
US8913858B2 (en) | 2012-03-30 | 2014-12-16 | Corning Cable Systems Llc | Total-internal-reflection fiber optic interface modules and assemblies |
US9052478B2 (en) | 2012-03-30 | 2015-06-09 | Corning Cable Systems Llc | Total-internal-reflection fiber optic interface modules with different optical paths and assemblies using same |
US9134494B2 (en) | 2012-05-29 | 2015-09-15 | 3M Innovative Properties Company | Optical interconnect |
US9235018B2 (en) * | 2012-05-30 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical communications card, an optical communications system, and methods and apparatuses for providing high-density mounting of optical communications cards |
US10958348B2 (en) | 2012-12-29 | 2021-03-23 | Zephyr Photonics Inc. | Method for manufacturing modular multi-function active optical cables |
JP2015094835A (ja) * | 2013-11-12 | 2015-05-18 | 三菱電線工業株式会社 | 光ファイバシート及びそれを用いた実装構造体 |
CN104101967B (zh) * | 2014-07-31 | 2016-02-24 | 华进半导体封装先导技术研发中心有限公司 | 一种光通信装置及止动孔的形成方法 |
CN105022341B (zh) * | 2015-08-21 | 2018-01-02 | 中国科学院合肥物质科学研究院 | 一种光纤柔性板自动布纤设备的控制装置与方法 |
US20170075070A1 (en) * | 2015-09-11 | 2017-03-16 | Ccs Technology, Inc. | Optical coupler for coupling light in/out of an optical receiving/emitting structure |
KR102207959B1 (ko) | 2018-03-30 | 2021-01-25 | 박영준 | 전자기파를 이용한 레벨 측정유닛, 이를 포함하는 아스팔트 콘크리트 제조장치 및 아스팔트 콘크리트 제조방법 |
CN111796370B (zh) * | 2019-04-09 | 2021-12-17 | 深南电路股份有限公司 | 光电混合线路板、光电对接装置以及光电传输系统 |
CN110187458A (zh) * | 2019-06-30 | 2019-08-30 | 深南电路股份有限公司 | 光纤线路板及其制造方法、光传输装置及混合光纤线路板 |
US11545487B2 (en) * | 2020-05-20 | 2023-01-03 | Tslc Corporation | Three-dimensional optoelectronic device package and method for manufacturing the same |
CN114126188A (zh) * | 2020-08-28 | 2022-03-01 | 深南电路股份有限公司 | 一种光电混合线路板组件 |
CN114137669B (zh) * | 2020-09-03 | 2023-09-22 | 英业达科技有限公司 | 服务器及光通信元件 |
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DE3834335A1 (de) * | 1988-10-08 | 1990-04-12 | Telefunken Systemtechnik | Halbleiterschaltung |
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JP2969813B2 (ja) | 1990-06-19 | 1999-11-02 | 富士ゼロックス株式会社 | 画像形成装置における出力濃度調整装置 |
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-
1996
- 1996-10-17 JP JP27470096A patent/JP3705873B2/ja not_active Expired - Fee Related
-
1997
- 1997-10-15 CN CN97191452A patent/CN1095084C/zh not_active Expired - Fee Related
- 1997-10-15 WO PCT/JP1997/003715 patent/WO1998018301A1/ja active IP Right Grant
- 1997-10-15 GB GB9812109A patent/GB2322479B/en not_active Expired - Lifetime
- 1997-10-15 US US09/077,989 patent/US6257771B1/en not_active Expired - Fee Related
- 1997-10-15 DE DE19781160T patent/DE19781160B4/de not_active Expired - Fee Related
- 1997-10-16 TW TW086115236A patent/TW363336B/zh not_active IP Right Cessation
- 1997-10-17 KR KR1019980700469A patent/KR100272953B1/ko not_active IP Right Cessation
- 1997-10-17 MY MYPI97004893A patent/MY120706A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1206545A (zh) | 1999-01-27 |
US6257771B1 (en) | 2001-07-10 |
MY120706A (en) | 2005-11-30 |
KR100272953B1 (ko) | 2001-01-15 |
DE19781160B4 (de) | 2005-07-07 |
WO1998018301A1 (fr) | 1998-04-30 |
KR19990035810A (ko) | 1999-05-25 |
GB2322479A (en) | 1998-08-26 |
GB2322479B (en) | 2001-01-31 |
JPH10126018A (ja) | 1998-05-15 |
GB9812109D0 (en) | 1998-08-05 |
TW363336B (en) | 1999-07-01 |
CN1095084C (zh) | 2002-11-27 |
JP3705873B2 (ja) | 2005-10-12 |
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