DE19680763B4 - Verfahren zur Herstellung einer mikroelektromechanischen Vorrichtung - Google Patents
Verfahren zur Herstellung einer mikroelektromechanischen Vorrichtung Download PDFInfo
- Publication number
- DE19680763B4 DE19680763B4 DE19680763T DE19680763T DE19680763B4 DE 19680763 B4 DE19680763 B4 DE 19680763B4 DE 19680763 T DE19680763 T DE 19680763T DE 19680763 T DE19680763 T DE 19680763T DE 19680763 B4 DE19680763 B4 DE 19680763B4
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- layer
- etching
- erodible material
- microelectromechanical device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 239000004020 conductor Substances 0.000 title abstract description 22
- 238000013500 data storage Methods 0.000 title description 6
- 238000000034 method Methods 0.000 claims description 35
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000001020 plasma etching Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 238000004574 scanning tunneling microscopy Methods 0.000 description 21
- 230000008901 benefit Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000005291 magnetic effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical group [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/0015—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1409—Heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1418—Disposition or mounting of heads or record carriers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1418—Disposition or mounting of heads or record carriers
- G11B9/1427—Disposition or mounting of heads or record carriers with provision for moving the heads or record carriers relatively to each other or for access to indexed parts without effectively imparting a relative movement
- G11B9/1436—Disposition or mounting of heads or record carriers with provision for moving the heads or record carriers relatively to each other or for access to indexed parts without effectively imparting a relative movement with provision for moving the heads or record carriers relatively to each other
- G11B9/1445—Disposition or mounting of heads or record carriers with provision for moving the heads or record carriers relatively to each other or for access to indexed parts without effectively imparting a relative movement with provision for moving the heads or record carriers relatively to each other switching at least one head in operating function; Controlling the relative spacing to keep the head operative, e.g. for allowing a tunnel current flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/07—Data storage devices, static or dynamic memories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/12—STM or AFM microtips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0361—Tips, pillars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0105—Sacrificial layer
- B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
- Y10S977/86—Scanning probe structure
- Y10S977/861—Scanning tunneling probe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/88—Manufacture, treatment, or detection of nanostructure with arrangement, process, or apparatus for testing
- Y10S977/881—Microscopy or spectroscopy, e.g. sem, tem
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/888—Shaping or removal of materials, e.g. etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Micromachines (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50583695A | 1995-07-21 | 1995-07-21 | |
| US08/505,836 | 1995-07-21 | ||
| US08/507,676 | 1995-07-25 | ||
| US08/507,676 US5717631A (en) | 1995-07-21 | 1995-07-25 | Microelectromechanical structure and process of making same |
| PCT/US1996/012003 WO1997004451A1 (en) | 1995-07-21 | 1996-07-19 | Microelectromechanical structure and process of making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19680763T1 DE19680763T1 (de) | 1998-01-08 |
| DE19680763B4 true DE19680763B4 (de) | 2008-08-14 |
Family
ID=27055276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19680763T Expired - Lifetime DE19680763B4 (de) | 1995-07-21 | 1996-07-19 | Verfahren zur Herstellung einer mikroelektromechanischen Vorrichtung |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US5717631A (enExample) |
| JP (1) | JP3998266B2 (enExample) |
| AU (1) | AU6504496A (enExample) |
| DE (1) | DE19680763B4 (enExample) |
| WO (1) | WO1997004451A1 (enExample) |
Families Citing this family (91)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3152182B2 (ja) * | 1997-10-07 | 2001-04-03 | 日立電線株式会社 | ガラス導波路素子及びその製造方法 |
| US6028343A (en) * | 1997-10-24 | 2000-02-22 | Stmicroelectronics, Inc. | Integrated released beam sensor for sensing acceleration and associated methods |
| US6287885B1 (en) | 1998-05-08 | 2001-09-11 | Denso Corporation | Method for manufacturing semiconductor dynamic quantity sensor |
| US6088463A (en) | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
| US6829131B1 (en) * | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
| US6458615B1 (en) | 1999-09-30 | 2002-10-01 | Carnegie Mellon University | Method of fabricating micromachined structures and devices formed therefrom |
| US6479320B1 (en) | 2000-02-02 | 2002-11-12 | Raytheon Company | Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
| US6521477B1 (en) * | 2000-02-02 | 2003-02-18 | Raytheon Company | Vacuum package fabrication of integrated circuit components |
| US6586841B1 (en) | 2000-02-23 | 2003-07-01 | Onix Microsystems, Inc. | Mechanical landing pad formed on the underside of a MEMS device |
| US6887391B1 (en) | 2000-03-24 | 2005-05-03 | Analog Devices, Inc. | Fabrication and controlled release of structures using etch-stop trenches |
| US6788520B1 (en) | 2000-04-10 | 2004-09-07 | Behrang Behin | Capacitive sensing scheme for digital control state detection in optical switches |
| EP1148758A1 (en) * | 2000-04-18 | 2001-10-24 | THOMSON multimedia S.A. | Cabinet for audio devices |
| US6690014B1 (en) | 2000-04-25 | 2004-02-10 | Raytheon Company | Microbolometer and method for forming |
| US20060263888A1 (en) * | 2000-06-02 | 2006-11-23 | Honeywell International Inc. | Differential white blood count on a disposable card |
| US7641856B2 (en) * | 2004-05-14 | 2010-01-05 | Honeywell International Inc. | Portable sample analyzer with removable cartridge |
| US8329118B2 (en) | 2004-09-02 | 2012-12-11 | Honeywell International Inc. | Method and apparatus for determining one or more operating parameters for a microfluidic circuit |
| US8383043B2 (en) * | 2004-05-14 | 2013-02-26 | Honeywell International Inc. | Analyzer system |
| US7420659B1 (en) * | 2000-06-02 | 2008-09-02 | Honeywell Interantional Inc. | Flow control system of a cartridge |
| US7242474B2 (en) * | 2004-07-27 | 2007-07-10 | Cox James A | Cytometer having fluid core stream position control |
| US7630063B2 (en) * | 2000-08-02 | 2009-12-08 | Honeywell International Inc. | Miniaturized cytometer for detecting multiple species in a sample |
| US6970245B2 (en) * | 2000-08-02 | 2005-11-29 | Honeywell International Inc. | Optical alignment detection system |
| US8071051B2 (en) * | 2004-05-14 | 2011-12-06 | Honeywell International Inc. | Portable sample analyzer cartridge |
| US7471394B2 (en) * | 2000-08-02 | 2008-12-30 | Honeywell International Inc. | Optical detection system with polarizing beamsplitter |
| US7215425B2 (en) * | 2000-08-02 | 2007-05-08 | Honeywell International Inc. | Optical alignment for flow cytometry |
| US7061595B2 (en) * | 2000-08-02 | 2006-06-13 | Honeywell International Inc. | Miniaturized flow controller with closed loop regulation |
| US7277166B2 (en) * | 2000-08-02 | 2007-10-02 | Honeywell International Inc. | Cytometer analysis cartridge optical configuration |
| US6445514B1 (en) | 2000-10-12 | 2002-09-03 | Honeywell International Inc. | Micro-positioning optical element |
| US6737648B2 (en) * | 2000-11-22 | 2004-05-18 | Carnegie Mellon University | Micromachined infrared sensitive pixel and infrared imager including same |
| US6888979B2 (en) | 2000-11-29 | 2005-05-03 | Analog Devices, Inc. | MEMS mirrors with precision clamping mechanism |
| US7183633B2 (en) * | 2001-03-01 | 2007-02-27 | Analog Devices Inc. | Optical cross-connect system |
| SE0101182D0 (sv) * | 2001-04-02 | 2001-04-02 | Ericsson Telefon Ab L M | Micro electromechanical switches |
| US6777681B1 (en) | 2001-04-25 | 2004-08-17 | Raytheon Company | Infrared detector with amorphous silicon detector elements, and a method of making it |
| US6813412B2 (en) * | 2001-07-24 | 2004-11-02 | Michael J. Daneman | Mems element having perpendicular portion formed from substrate |
| US6583031B2 (en) | 2001-07-25 | 2003-06-24 | Onix Microsystems, Inc. | Method of making a MEMS element having perpendicular portion formed from substrate |
| WO2003017717A2 (en) * | 2001-08-17 | 2003-02-27 | Carnegie Mellon University | Method and apparatus for reconstruction of soundwaves from digital signals |
| US6635506B2 (en) | 2001-11-07 | 2003-10-21 | International Business Machines Corporation | Method of fabricating micro-electromechanical switches on CMOS compatible substrates |
| EP1454349B1 (en) | 2001-11-09 | 2006-09-27 | WiSpry, Inc. | Trilayered beam mems device and related methods |
| KR100416266B1 (ko) * | 2001-12-18 | 2004-01-24 | 삼성전자주식회사 | 막힌 희생층 지지대를 갖는 멤스 구조물 및 그의 제작방법 |
| US6621392B1 (en) * | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
| US20030210799A1 (en) * | 2002-05-10 | 2003-11-13 | Gabriel Kaigham J. | Multiple membrane structure and method of manufacture |
| US7142682B2 (en) * | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
| US6943448B2 (en) * | 2003-01-23 | 2005-09-13 | Akustica, Inc. | Multi-metal layer MEMS structure and process for making the same |
| US7049051B2 (en) * | 2003-01-23 | 2006-05-23 | Akustica, Inc. | Process for forming and acoustically connecting structures on a substrate |
| CN101069099A (zh) * | 2003-02-24 | 2007-11-07 | 佛罗里达大学 | 微机械加工的集成单片三轴加速度计 |
| US7026184B2 (en) * | 2003-02-26 | 2006-04-11 | Carnegie Mellon University | Method of fabricating microstructures and devices made therefrom |
| US6798029B2 (en) | 2003-05-09 | 2004-09-28 | International Business Machines Corporation | Method of fabricating micro-electromechanical switches on CMOS compatible substrates |
| US6936524B2 (en) * | 2003-11-05 | 2005-08-30 | Akustica, Inc. | Ultrathin form factor MEMS microphones and microspeakers |
| US7041611B2 (en) * | 2004-03-17 | 2006-05-09 | Wisconsin Alumni Research Foundation | Enhancement of fabrication yields of nanomechanical devices by thin film deposition |
| US8323564B2 (en) * | 2004-05-14 | 2012-12-04 | Honeywell International Inc. | Portable sample analyzer system |
| US7630075B2 (en) * | 2004-09-27 | 2009-12-08 | Honeywell International Inc. | Circular polarization illumination based analyzer system |
| US7046539B1 (en) | 2004-11-02 | 2006-05-16 | Sandia Corporation | Mechanical memory |
| CN101438143B (zh) | 2005-04-29 | 2013-06-12 | 霍尼韦尔国际公司 | 血细胞计数器细胞计数和尺寸测量方法 |
| US7354788B2 (en) * | 2005-06-28 | 2008-04-08 | Intel Corporation | Method for processing a MEMS/CMOS cantilever based memory storage device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US5717631A (en) | 1998-02-10 |
| JPH11509953A (ja) | 1999-08-31 |
| AU6504496A (en) | 1997-02-18 |
| WO1997004451A1 (en) | 1997-02-06 |
| DE19680763T1 (de) | 1998-01-08 |
| US5970315A (en) | 1999-10-19 |
| JP3998266B2 (ja) | 2007-10-24 |
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