DE1958684A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1958684A1
DE1958684A1 DE19691958684 DE1958684A DE1958684A1 DE 1958684 A1 DE1958684 A1 DE 1958684A1 DE 19691958684 DE19691958684 DE 19691958684 DE 1958684 A DE1958684 A DE 1958684A DE 1958684 A1 DE1958684 A1 DE 1958684A1
Authority
DE
Germany
Prior art keywords
area
layer
metallic
semiconductor component
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691958684
Other languages
German (de)
English (en)
Inventor
Byrns Jun Carl Joseph
Triggs William Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE1958684A1 publication Critical patent/DE1958684A1/de
Pending legal-status Critical Current

Links

Classifications

    • H10W20/425—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P14/46—
    • H10W72/00—
    • H10W72/60—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
DE19691958684 1968-11-25 1969-11-22 Halbleiterbauelement Pending DE1958684A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77864768A 1968-11-25 1968-11-25

Publications (1)

Publication Number Publication Date
DE1958684A1 true DE1958684A1 (de) 1970-06-18

Family

ID=25114010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691958684 Pending DE1958684A1 (de) 1968-11-25 1969-11-22 Halbleiterbauelement

Country Status (8)

Country Link
US (1) US3599060A (enExample)
BE (1) BE740431A (enExample)
DE (1) DE1958684A1 (enExample)
FR (1) FR2024203A1 (enExample)
GB (1) GB1286834A (enExample)
IE (1) IE33343B1 (enExample)
NL (1) NL6917686A (enExample)
SE (1) SE363192B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3011660A1 (de) * 1980-03-26 1981-10-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtiger ohmscher anschlusskontakt

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE763522A (fr) * 1970-03-03 1971-07-16 Licentia Gmbh Serie de couches de contact pour des elements de construction semi-conducteurs
FR2394894A1 (fr) * 1977-06-17 1979-01-12 Thomson Csf Dispositif de prise de contact sur un element semiconducteur
WO1982003727A1 (fr) * 1981-04-21 1982-10-28 Seiichiro Aigoo Procede de fabrication d'un dispositif a semi-conducteur possedant une electrode saillante plaquee
JPS60119777A (ja) * 1983-11-30 1985-06-27 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ
EP0266093B1 (en) * 1986-10-27 1992-09-23 Electric Power Research Institute, Inc Process of making a high power multi-layer semiconductive switching device with multiple parallel contacts
US5184206A (en) * 1990-10-26 1993-02-02 General Electric Company Direct thermocompression bonding for thin electronic power chips
US5206186A (en) * 1990-10-26 1993-04-27 General Electric Company Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding
KR960008558B1 (en) * 1993-03-02 1996-06-28 Samsung Electronics Co Ltd Low resistance contact structure and manufacturing method of high integrated semiconductor device
US5455195A (en) * 1994-05-06 1995-10-03 Texas Instruments Incorporated Method for obtaining metallurgical stability in integrated circuit conductive bonds
US5989993A (en) * 1996-02-09 1999-11-23 Elke Zakel Method for galvanic forming of bonding pads
US6115281A (en) * 1997-06-09 2000-09-05 Telcordia Technologies, Inc. Methods and structures to cure the effects of hydrogen annealing on ferroelectric capacitors
US6737353B2 (en) * 2001-06-19 2004-05-18 Advanced Semiconductor Engineering, Inc. Semiconductor device having bump electrodes
JP2003059860A (ja) * 2001-08-13 2003-02-28 Mitsubishi Electric Corp 半導体装置
US6586043B1 (en) * 2002-01-09 2003-07-01 Micron Technology, Inc. Methods of electroless deposition of nickel, methods of forming under bump metallurgy, and constructions comprising solder bumps
US6825564B2 (en) * 2002-08-21 2004-11-30 Micron Technology, Inc. Nickel bonding cap over copper metalized bondpads
JP7075847B2 (ja) * 2018-08-28 2022-05-26 株式会社 日立パワーデバイス 半導体装置および電力変換装置
CN114335257B (zh) * 2022-03-11 2022-08-19 浙江爱旭太阳能科技有限公司 太阳能电池的制备方法及太阳能电池组件、发电系统
CN115394864A (zh) * 2022-03-11 2022-11-25 浙江爱旭太阳能科技有限公司 太阳能电池的导电接触结构、组件及发电系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1011317A (fr) * 1949-01-17 1952-06-23 Westinghouse Freins & Signaux Perfectionnements aux procédés de fabrication des cellules photo-électriques à couche d'arrêt et produits industriels nouveaux obtenus
GB1053069A (enExample) * 1963-06-28
BE670213A (enExample) * 1964-09-30 1900-01-01
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3465211A (en) * 1968-02-01 1969-09-02 Friden Inc Multilayer contact system for semiconductors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3011660A1 (de) * 1980-03-26 1981-10-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtiger ohmscher anschlusskontakt

Also Published As

Publication number Publication date
US3599060A (en) 1971-08-10
BE740431A (enExample) 1970-04-17
NL6917686A (enExample) 1970-05-27
IE33343B1 (en) 1974-05-29
GB1286834A (en) 1972-08-23
FR2024203A1 (enExample) 1970-08-28
SE363192B (enExample) 1974-01-07
IE33343L (en) 1970-05-25

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Legal Events

Date Code Title Description
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