SE363192B - - Google Patents
Info
- Publication number
- SE363192B SE363192B SE1591969A SE1591969A SE363192B SE 363192 B SE363192 B SE 363192B SE 1591969 A SE1591969 A SE 1591969A SE 1591969 A SE1591969 A SE 1591969A SE 363192 B SE363192 B SE 363192B
- Authority
- SE
- Sweden
Links
Classifications
-
- H10W20/425—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H10P14/46—
-
- H10W72/00—
-
- H10W72/60—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77864768A | 1968-11-25 | 1968-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE363192B true SE363192B (enExample) | 1974-01-07 |
Family
ID=25114010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE1591969A SE363192B (enExample) | 1968-11-25 | 1969-11-19 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3599060A (enExample) |
| BE (1) | BE740431A (enExample) |
| DE (1) | DE1958684A1 (enExample) |
| FR (1) | FR2024203A1 (enExample) |
| GB (1) | GB1286834A (enExample) |
| IE (1) | IE33343B1 (enExample) |
| NL (1) | NL6917686A (enExample) |
| SE (1) | SE363192B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE763522A (fr) * | 1970-03-03 | 1971-07-16 | Licentia Gmbh | Serie de couches de contact pour des elements de construction semi-conducteurs |
| FR2394894A1 (fr) * | 1977-06-17 | 1979-01-12 | Thomson Csf | Dispositif de prise de contact sur un element semiconducteur |
| DE3011660A1 (de) * | 1980-03-26 | 1981-10-01 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Mehrschichtiger ohmscher anschlusskontakt |
| WO1982003727A1 (fr) * | 1981-04-21 | 1982-10-28 | Seiichiro Aigoo | Procede de fabrication d'un dispositif a semi-conducteur possedant une electrode saillante plaquee |
| JPS60119777A (ja) * | 1983-11-30 | 1985-06-27 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタ |
| EP0266093B1 (en) * | 1986-10-27 | 1992-09-23 | Electric Power Research Institute, Inc | Process of making a high power multi-layer semiconductive switching device with multiple parallel contacts |
| US5184206A (en) * | 1990-10-26 | 1993-02-02 | General Electric Company | Direct thermocompression bonding for thin electronic power chips |
| US5206186A (en) * | 1990-10-26 | 1993-04-27 | General Electric Company | Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding |
| KR960008558B1 (en) * | 1993-03-02 | 1996-06-28 | Samsung Electronics Co Ltd | Low resistance contact structure and manufacturing method of high integrated semiconductor device |
| US5455195A (en) * | 1994-05-06 | 1995-10-03 | Texas Instruments Incorporated | Method for obtaining metallurgical stability in integrated circuit conductive bonds |
| US5989993A (en) * | 1996-02-09 | 1999-11-23 | Elke Zakel | Method for galvanic forming of bonding pads |
| US6115281A (en) * | 1997-06-09 | 2000-09-05 | Telcordia Technologies, Inc. | Methods and structures to cure the effects of hydrogen annealing on ferroelectric capacitors |
| US6737353B2 (en) * | 2001-06-19 | 2004-05-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device having bump electrodes |
| JP2003059860A (ja) * | 2001-08-13 | 2003-02-28 | Mitsubishi Electric Corp | 半導体装置 |
| US6586043B1 (en) * | 2002-01-09 | 2003-07-01 | Micron Technology, Inc. | Methods of electroless deposition of nickel, methods of forming under bump metallurgy, and constructions comprising solder bumps |
| US6825564B2 (en) * | 2002-08-21 | 2004-11-30 | Micron Technology, Inc. | Nickel bonding cap over copper metalized bondpads |
| JP7075847B2 (ja) * | 2018-08-28 | 2022-05-26 | 株式会社 日立パワーデバイス | 半導体装置および電力変換装置 |
| CN114335257B (zh) * | 2022-03-11 | 2022-08-19 | 浙江爱旭太阳能科技有限公司 | 太阳能电池的制备方法及太阳能电池组件、发电系统 |
| CN115394864A (zh) * | 2022-03-11 | 2022-11-25 | 浙江爱旭太阳能科技有限公司 | 太阳能电池的导电接触结构、组件及发电系统 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1011317A (fr) * | 1949-01-17 | 1952-06-23 | Westinghouse Freins & Signaux | Perfectionnements aux procédés de fabrication des cellules photo-électriques à couche d'arrêt et produits industriels nouveaux obtenus |
| GB1053069A (enExample) * | 1963-06-28 | |||
| BE670213A (enExample) * | 1964-09-30 | 1900-01-01 | ||
| US3458925A (en) * | 1966-01-20 | 1969-08-05 | Ibm | Method of forming solder mounds on substrates |
| US3465211A (en) * | 1968-02-01 | 1969-09-02 | Friden Inc | Multilayer contact system for semiconductors |
-
1968
- 1968-11-25 US US3599060D patent/US3599060A/en not_active Expired - Lifetime
-
1969
- 1969-10-13 IE IE1410/69A patent/IE33343B1/xx unknown
- 1969-10-17 BE BE740431D patent/BE740431A/xx unknown
- 1969-10-22 GB GB5184069A patent/GB1286834A/en not_active Expired
- 1969-11-19 SE SE1591969A patent/SE363192B/xx unknown
- 1969-11-22 DE DE19691958684 patent/DE1958684A1/de active Pending
- 1969-11-24 NL NL6917686A patent/NL6917686A/xx unknown
- 1969-11-25 FR FR6940603A patent/FR2024203A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US3599060A (en) | 1971-08-10 |
| BE740431A (enExample) | 1970-04-17 |
| NL6917686A (enExample) | 1970-05-27 |
| DE1958684A1 (de) | 1970-06-18 |
| IE33343B1 (en) | 1974-05-29 |
| GB1286834A (en) | 1972-08-23 |
| FR2024203A1 (enExample) | 1970-08-28 |
| IE33343L (en) | 1970-05-25 |