DE19540122C2 - Verfahren zur stromlosen Metallisierung und seine Anwendung - Google Patents
Verfahren zur stromlosen Metallisierung und seine AnwendungInfo
- Publication number
- DE19540122C2 DE19540122C2 DE19540122A DE19540122A DE19540122C2 DE 19540122 C2 DE19540122 C2 DE 19540122C2 DE 19540122 A DE19540122 A DE 19540122A DE 19540122 A DE19540122 A DE 19540122A DE 19540122 C2 DE19540122 C2 DE 19540122C2
- Authority
- DE
- Germany
- Prior art keywords
- treatment
- areas
- solution containing
- metal ions
- noble metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000007772 electroless plating Methods 0.000 title description 3
- 239000010949 copper Substances 0.000 claims description 10
- 238000001465 metallisation Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010970 precious metal Substances 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000005751 Copper oxide Substances 0.000 claims description 4
- 229910000431 copper oxide Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims 4
- 150000002500 ions Chemical class 0.000 claims 3
- 238000007598 dipping method Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- 239000000243 solution Substances 0.000 description 10
- 230000000977 initiatory effect Effects 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000454 electroless metal deposition Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33047394A | 1994-10-28 | 1994-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19540122A1 DE19540122A1 (de) | 1996-05-02 |
| DE19540122C2 true DE19540122C2 (de) | 1997-08-21 |
Family
ID=23289937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19540122A Expired - Fee Related DE19540122C2 (de) | 1994-10-28 | 1995-10-27 | Verfahren zur stromlosen Metallisierung und seine Anwendung |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH08213738A (https=) |
| KR (1) | KR960014396A (https=) |
| DE (1) | DE19540122C2 (https=) |
| FR (1) | FR2726205B1 (https=) |
| GB (1) | GB2294476B (https=) |
| TW (1) | TW293984B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2885113B2 (ja) * | 1995-01-30 | 1999-04-19 | 日本電気株式会社 | 印刷配線板およびその製造方法 |
| US7588835B2 (en) | 2005-03-11 | 2009-09-15 | Hitachi Chemical Company, Ltd. | Method of treating the surface of copper and copper |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2939804A (en) * | 1958-01-23 | 1960-06-07 | Uarco Inc | Resin particle coated with metal |
| GB1003575A (en) * | 1962-04-19 | 1965-09-08 | Sperry Gyroscope Co Ltd | Chemical plating process |
| US3372037A (en) * | 1965-06-30 | 1968-03-05 | Ibm | Magnetic materials |
| GB1322081A (en) * | 1970-06-03 | 1973-07-04 | Shipley Co | Electroless nickel solution |
| US3857724A (en) * | 1971-08-20 | 1974-12-31 | Ibm | Primer for electroless plating |
| GB1360592A (en) * | 1973-02-14 | 1974-07-17 | Rca Corp | Electroless cobalt plating bath |
| US4640718A (en) * | 1985-10-29 | 1987-02-03 | International Business Machines Corporation | Process for accelerating Pd/Sn seeds for electroless copper plating |
| JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
| US5110633A (en) * | 1989-09-01 | 1992-05-05 | Ciba-Geigy Corporation | Process for coating plastics articles |
| US5162144A (en) * | 1991-08-01 | 1992-11-10 | Motorola, Inc. | Process for metallizing substrates using starved-reaction metal-oxide reduction |
| EP0530144A3 (en) * | 1991-08-23 | 1994-08-24 | Ciba Geigy Ag | Process for metallising plastic articles |
| US5212138A (en) * | 1991-09-23 | 1993-05-18 | Applied Electroless Concepts Inc. | Low corrosivity catalyst for activation of copper for electroless nickel plating |
-
1995
- 1995-10-02 FR FR9511552A patent/FR2726205B1/fr not_active Expired - Fee Related
- 1995-10-06 TW TW084110519A patent/TW293984B/zh active
- 1995-10-16 GB GB9521107A patent/GB2294476B/en not_active Expired - Fee Related
- 1995-10-19 KR KR1019950036104A patent/KR960014396A/ko not_active Ceased
- 1995-10-24 JP JP7298869A patent/JPH08213738A/ja active Pending
- 1995-10-27 DE DE19540122A patent/DE19540122C2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE19540122A1 (de) | 1996-05-02 |
| FR2726205B1 (fr) | 1997-09-26 |
| FR2726205A1 (fr) | 1996-05-03 |
| TW293984B (https=) | 1996-12-21 |
| GB2294476B (en) | 1998-03-11 |
| KR960014396A (ko) | 1996-05-22 |
| GB9521107D0 (en) | 1995-12-20 |
| JPH08213738A (ja) | 1996-08-20 |
| GB2294476A (en) | 1996-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |