TW293984B - - Google Patents

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Publication number
TW293984B
TW293984B TW084110519A TW84110519A TW293984B TW 293984 B TW293984 B TW 293984B TW 084110519 A TW084110519 A TW 084110519A TW 84110519 A TW84110519 A TW 84110519A TW 293984 B TW293984 B TW 293984B
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TW
Taiwan
Prior art keywords
precious metal
ionic
patent application
metal solution
copper
Prior art date
Application number
TW084110519A
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English (en)
Original Assignee
Motorola Inc
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Publication date
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Publication of TW293984B publication Critical patent/TW293984B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

五 、發明説明（1 ) A7 B7 經濟部中央樣準局員工消費合作社印製 本發明大體上有關金屬化物質之範疇，尤其有關一種降 低無電浴電鍍溶液之起始時間之方法。 美國專利第5, 162, 144號（與本發明屬同一讓受人）描述— 種選擇性地將電路板金屬化之方法且在此供作參考。如美 國專利第5,260，170(與本發明屬同一讓受人）所述，荜法同 時使用介電質積層、後續加工之電路板。該種電路板加工 需依序澱積並于兩種樹脂中感光界定開口。第一種樹脂， 稱爲樹脂A，充填著本發明爲填料之物質，其于活化時，以 金屬促進無電電鍍，第二種樹脂稱爲樹脂B，不含該填料。 當各樹脂在樹脂B疊于樹脂A上地依序感光化學性地形成圖 形時，樹脂B中所產生之開口界定稱爲"通道"之區域，而于 樹脂A及樹脂B中產生之重疊開口形成開口面向下方之金屬 層之稱爲的較深區域。當該結構進行調整成活化樹 脂A表面中或之上所含之粒子的加工時，通道及井洞可塗以 無電電鍍金屬而形成金屬零件 '，諸如墊片、通孔及導體。 目前之製造環境中，還原法流通時間嚴格。粒子于電路 板上活化後，產生無電電鍍。無電電鍍之一般特色係起始 時間，定義爲該板置入無電解浴中開始產生電鍍之時間。 高活性無電解溶具有快速之起始時間，但可， 鍍。愈穩定之浴化學產生愈長之起始時 興（ 阳呼間。此外，已發現 較長之起始時間產生起始及枯著部位部古^、之較粗链毛 衣纸張尺度適用中國國家揉準（CNS ) A4規格（2!0X297公) (請先閱讀背面之注意事項再填寫本頁)
'1T 線 _ η_ A7 B7 ^^〇9S4 五、發明説明（2 澱積。 因此需要-種降低穩定無電解浴之起始時間的方法。此 外，需要一種產生較佳澱積之方法。 較佳實例描述 製造介電層疊、依序加工之電路板時，于樹脂中感光化 學地界定導體、通孔及塾片。此程序曝露出需要導體、通 孔或墊片所需之樹脂A。隨後曝露樹脂A表面上之金馮氧化 物小粒子。随後將電路板浸潰（或噴灑）于還原溶液中， 而于金屬氧化物粒子周圍產生小型之觸媒島狀物。該島狀 物具有活性金屬薄層❶例如，較佳實例中之金屬氧化物粒 子係。一旦曝于還原溶液，則形成CuI1，Cu〇或 类。基次’將該板置入無電解浴中，產生 孓量觸媒島1物_底則.形成固體銅.。 穩定之無電解浴的起始時間可長達15分鐘。爲降低起始 時間，于無電電鍍電路板前需要以！金屬鹽溶液漫溃或噴 灑電路板之額外步骤。此舉造成金屬置應，其中铜褚 龛J.置換。僅有朝了I端薄.層發.生該種.1换。 此貴金屬層係催化性’亦保護以銅爲底質之觸媒島狀物 以防止氧化。因爲沒有需移除之氧化物，無電解浴幾乎可 立即開始電鍍。即使立即移至無電解浴仍產生銅氧化物， 但隨任何延遲而增加。ij爲貴兔聲處麗使所製之所有觸媒 保持活性，故保持選擇性電鍍需要控制觸媒膜生長。觸媒 ，膜之生長可锋操縱孝原溶液濃度及還原時間而控制。 -5 - 木纸法尺度適用中關轉準（〇^)八4祕（21()/297公釐) ' (請先閱讀背面之注意事項再填寫本頁) -丁 -'9 經濟部中央標準局員工消費合作社印製 2咖84 A7 B7 五、發明説明（3 ) 實施例 1. 根據美國專利第5,260, 170號製備兩個介電要層、依序 加工之電路板試樣。該試樣于1_〇莫耳濃度硼氫化物及〇25 莫耳濃度之EDTA溶液中還原5分鐘。以去離子水淋洗該試 樣。其中一試樣置入離子性紅溶液中10秒鐘。而第二種拭 樣則另外乾燥。兩試樣隨後置入Shipley 4500無電解銅浴 中兩分鐘。然後以掃描式電子顯微鏡探視試樣。 第二種試樣僅顯示單離之電鍍’而第—種試樣則部連續 電鍍。 2. 根據美國專利第5,260, 1 70號製備兩個雙介電要層、依 序加工之電路板之試樣。該試樣曝于離子化鈀溶液1〇秒鐘 隨後于去離子水中漂洗試樣並置入Shipley 4500無電解 銅浴中兩分鐘。于掃描式電子顯微鏡下檢視該試樣。該試 樣顯7F並無電鍍發生。故增加之電鍍並非因爲夢于怿靶琛 附于試樣樹脂上。 、 總而τ之，本發明提供一種降低起兮時間、增加枯著部 度及废低位于電路板之導體、墊片及通孔之電鍍哿 之粒彳空的方法。 — —.IL------V------訂------5 (請先閱讀背面之注意事項再填寫本頁} 經濟部中央榡準局貝工消費合作·社印«.

Claims (1)

  1. A8 B8 C8 D8 經濟部中央棣準局貝工消費合作社印製 ★、申請專利範圍 1. 一種使置于無電解浴中之介電疊層電路板上成長之以銅 爲底質之觸媒膜起始時間降低之方法，此方法包括下列 連續步驟： 于電路板介電層表面上或表面中，由不連續之氧化銅 位置製造以銅爲底質之觸媒性島狀物： 以去離子水淋洗該表面； 以離子性貴金屬溶液處理該表面；及 在將該電路板置入無電解浴中之前，洗除該表面上未 反應之貴金屬溶液。 2. 根據申請專利範圍第1項之方法，其中以離子性貴金屬溶 液處理該表面之步驟，係包括經由觸媒性島狀物表面上 I還原銅之電化學置換，而于覆有以銅爲主之觸媒性島 狀物之區域上選擇性地沈積貴金屬薄膜之副步驟。 3. 根據申請專利範圍第丨項之方法，其中以離子性貴金屬溶 液處理表面之步驟，係包括將該表面漫潰于離子性貴金 屬溶峰中·^ _步琢。 4. 根據申請專利範圍第！項之方法，其中以離子性贵金屬溶 液處理該表面之步驟，係包括將該表面浸潰于該離子性 貴金屬溶液中歷經較佳爲兩分鐘之副步驟。 根據申請專利範圍第之方法，其中以離子性貴金屬溶 液處理A表面之方法，係包括以離子性貴金屬溶液喷凝 該.表面之副步驟。 6.根據中請專利範固第β之方法，其中製造以銅爲底質之 觸媒性島狀物之步驟，係包括下列副步驟： -7 - ·— 本紙張⑭揉準(CNS)八4脉(210><297公,〉
    (請先Μ讀背面之注意事項再填寫本頁} V 訂 ά. A8 ^ B8 C8 D8 六、申請專利範圍 曝露該表面上之不連續氧化銅位置；及 - 以還原溶液處理該表面，以產生活性金屬層。 7. —種具有根據申請專利範圍第1至6項中任一項方法所製 成之選擇性澱積無電解銅之電路板。 (請先閲讀背面之注意事項再填寫本頁) 訂 線 經濟部中央標準局—工消费合作社印裝 本紙張尺度適用中國國家揉準（CNS )八4洗格（210X297公釐）
TW084110519A 1994-10-28 1995-10-06 TW293984B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33047394A 1994-10-28 1994-10-28

Publications (1)

Publication Number Publication Date
TW293984B true TW293984B (zh) 1996-12-21

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ID=23289937

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110519A TW293984B (zh) 1994-10-28 1995-10-06

Country Status (6)

Country Link
JP (1) JPH08213738A (zh)
KR (1) KR960014396A (zh)
DE (1) DE19540122C2 (zh)
FR (1) FR2726205B1 (zh)
GB (1) GB2294476B (zh)
TW (1) TW293984B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2885113B2 (ja) * 1995-01-30 1999-04-19 日本電気株式会社 印刷配線板およびその製造方法
TW200702494A (en) * 2005-03-11 2007-01-16 Hitachi Chemical Co Ltd Surface treatment method for copper and copper

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939804A (en) * 1958-01-23 1960-06-07 Uarco Inc Resin particle coated with metal
GB1003575A (en) * 1962-04-19 1965-09-08 Sperry Gyroscope Co Ltd Chemical plating process
US3372037A (en) * 1965-06-30 1968-03-05 Ibm Magnetic materials
GB1322081A (en) * 1970-06-03 1973-07-04 Shipley Co Electroless nickel solution
US3857724A (en) * 1971-08-20 1974-12-31 Ibm Primer for electroless plating
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US4640718A (en) * 1985-10-29 1987-02-03 International Business Machines Corporation Process for accelerating Pd/Sn seeds for electroless copper plating
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
EP0530144A3 (en) * 1991-08-23 1994-08-24 Ciba Geigy Ag Process for metallising plastic articles
US5212138A (en) * 1991-09-23 1993-05-18 Applied Electroless Concepts Inc. Low corrosivity catalyst for activation of copper for electroless nickel plating

Also Published As

Publication number Publication date
DE19540122A1 (de) 1996-05-02
GB2294476B (en) 1998-03-11
KR960014396A (ko) 1996-05-22
GB9521107D0 (en) 1995-12-20
JPH08213738A (ja) 1996-08-20
DE19540122C2 (de) 1997-08-21
FR2726205A1 (fr) 1996-05-03
FR2726205B1 (fr) 1997-09-26
GB2294476A (en) 1996-05-01

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