KR960030756A - 인쇄 배선 보드와 그 형성 방법 - Google Patents

인쇄 배선 보드와 그 형성 방법 Download PDF

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KR960030756A
KR960030756A KR1019960002121A KR19960002121A KR960030756A KR 960030756 A KR960030756 A KR 960030756A KR 1019960002121 A KR1019960002121 A KR 1019960002121A KR 19960002121 A KR19960002121 A KR 19960002121A KR 960030756 A KR960030756 A KR 960030756A
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metal compound
palladium
layer
metal
plating
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KR100235930B1 (ko
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요시쓰구 후나다
고지 마쓰이
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가네꼬 히사시
닛뽕덴끼 가부시끼가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
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  • Parts Printed On Printed Circuit Boards (AREA)
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Abstract

본 발명은 절연 기판을 갖는 새로운 인쇄 배선 보드를 제공한다. 인쇄 배선 보드는 또한 절연 기판상의 표면에 형성된 금속 화합물층을 가지며, 금속 화합물층은 충분한 절연성을 가지며 금속 환원성을 나타내는 금속 화합물로 이루어진다. 금속 화합물층은 금속 화합물층의 상기 금속 화합물의 선택적인 환원에 의해 형성된 금속 배선 패턴을 갖는 표면을 가진다. 인쇄 배선 보드는 또한 금속 배선 패턴상에 형성된 팔라듐 치환 도금층을 가진다. 인쇄 배선 보드는 또한 비전기 도금층을 갖는다.

Description

인쇄 배선 보드와 그 형성 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 절연 기판과, 상기 절연 기판상에 형성되며, 절연성의 금속 화합물로 만들어진 제1층과, 상기 제1층상에 형성되는 금속 배선 패턴과, 상기 금속 배선 패턴상에 형성되는 팔라듐-치환 도금층과, 상기 파라듐-치환 도금층상에 형성되는 비전기 도금층으로 이루어지는 인쇄 배선 보드.
  2. 절연 기판의 표면상에 첨가물을 도포하는 단계와, 상기 절연 기판을 산화제를 함유하는 용액내에 침강시켜 상기 첨가물의 표면을 거칠게 처리하는 단계와, 상기 첨가물의 거친 표면상에 금속 환원성 및 절연성을 나타내는 금속 화합물로 만들어지는 금속 화합물층을 형성하는 단계와, 상기 금속 화합물층상에 도금 레지스트 필름을 선택적으로 형성하는 단계와, 상기 금속 화합물층상에 금속 배선 패턴을 선택적으로 형성하기 위하여, 상기 도금 레지스트 필름을 마스크로 사용하여 상기 금속 화합물층을 선택적으로 환원시키는 단계와, 상기 금속 배선 패턴을 파라듐-치환 도금 처리하여 상기 금속 배선 패터상에 팔라듐-치환 도금층을 형성하는 단계와, 상기 팔라듐-치환 도금층의 팔라듐을 촉매 코아로 사용하여, 상기 팔라듐-치환 도금층을 비전기 도금 처리하여 상기 절연 기판상에 도전 회로를 형성하는 단계로 이루어지는 인쇄 배선 보드 형성 방법.
  3. 절연 기판의 표면상에 충분한 절연성과 금속 환원성을 갖는 금속 화합물 입자로 이루어지는 첨가물을 도포하는 단계와, 상기 절연 기판을 산화제를 함유하는 용액내에 침강시켜 상기 첨가물의 표면을 거칠게 처리 하고, 동시에 상기 첨가물 표면상에 상기 입자의 표면을 노출시켜 상기 금속 화합물층상에 거친 표면을 형성하는 단계와, 상기 금속 화합물층상에 도금 레지스트 필름을 선택적으로 형성하는 단계와, 금속 배선 패턴을 선택적으로 형성하기 위하여, 상기 도금 레지스트 필름을 마스크로 사용하여 상기 금속 화합물층을 선택적으로 환원시키는 단계와, 상기 금속 배선 패턴을 팔랴듐-치환 도금 처리하여 상기 금속 배선 패턴상에 팔라듐-치환 도금층을 형성하는 단계와, 상기 팔라듐-치환 도금층의 팔라듐을 촉매 코아로 사용하여, 상기 팔라듐-치환 도금층을 비전기 도금 처리하여 상기 절연 기판상에 도전 회로를 형성하는 단계로 이루어지는 인쇄 배선 보드 형성 방법.
  4. 충분한 절연성과 금속 환원성을 갖는 금속 화합물 입자를 함유하는 절연 기판을 준비하는 단계와, 상기 절연 기판을 산화제를 함유하는 용액내에 침강시켜 상기 기판의 표면을 거칠게 처리하고, 동시에 상기 기판의 표면상에 상기 금속 화합물 입자의 표면을 노출시켜 상기 금속 화합물층상에 거친 표면을 형성하는 단계와, 상기 금속 화합물층상에 도금 레지스트 필름을 선택적으로 형성하는 단계와, 금속 배선 패턴을 선택적으로 형성하기 위하여, 상기 도금 레지스트 필름을 마스크로 사용하여 상기 금속 화합물층을 선택적으로 환원시키는 단계와, 상기 금속 배선 패턴을 팔라듐-치환 도금 처리하여 상기 금속 배선 패턴상에 팔라듐-치환 도금층을 형성하는 단계와, 상기 팔라듐-치환 도금층의 팔라듐을 촉매 코아로 사용하여, 상기 팔라듐-치환 도금층을 비전기 도금 처리하여 상기 절연 기판상에 도전 회로를 형성하는 단계로 이루어진 인쇄 배선 보드 형성 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960002121A 1995-01-30 1996-01-30 인쇄 배선 보드와 그 형성 방법 KR100235930B1 (ko)

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JP95-12532 1995-01-30
JP7012532A JP2885113B2 (ja) 1995-01-30 1995-01-30 印刷配線板およびその製造方法

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KR960030756A true KR960030756A (ko) 1996-08-17
KR100235930B1 KR100235930B1 (ko) 1999-12-15

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EP (1) EP0726697A3 (ko)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100834515B1 (ko) * 2007-03-07 2008-06-02 삼성전기주식회사 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040253386A1 (en) * 2003-06-13 2004-12-16 Sarojini Deevi Preparation of intermetallics by metallo-organic decomposition
JP3960320B2 (ja) * 2004-04-19 2007-08-15 松下電器産業株式会社 配線基板とそれを用いたバランと配線基板の製造方法
KR20070111549A (ko) * 2005-03-11 2007-11-21 히다치 가세고교 가부시끼가이샤 구리의 표면 처리 방법 및 구리
CN102605359A (zh) * 2011-01-25 2012-07-25 台湾上村股份有限公司 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺
KR101942187B1 (ko) * 2017-06-19 2019-01-25 전남대학교산학협력단 가요성 전극 및 이의 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3335050A (en) * 1967-08-08 Plastic bonded copper foil and process of producing same
US2939804A (en) * 1958-01-23 1960-06-07 Uarco Inc Resin particle coated with metal
US4681630A (en) * 1982-09-27 1987-07-21 Learonal, Inc. Method of making copper colloid for activating insulating surfaces
US4535029A (en) * 1983-09-15 1985-08-13 Advanced Technology, Inc. Method of catalyzing metal depositions on ceramic substrates
US4772080A (en) * 1985-07-01 1988-09-20 Raytheon Company Optical elements having buried layers and method of manufacture
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
EP0530144A3 (en) * 1991-08-23 1994-08-24 Ciba Geigy Ag Process for metallising plastic articles
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
FR2726205B1 (fr) * 1994-10-28 1997-09-26 Motorola Inc Procede destine a reduire le temps de demarrage dans un bain autocatalytique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100834515B1 (ko) * 2007-03-07 2008-06-02 삼성전기주식회사 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법

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EP0726697A2 (en) 1996-08-14
JPH08204303A (ja) 1996-08-09
EP0726697A3 (en) 1998-01-07

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