FR2726205B1 - Procede destine a reduire le temps de demarrage dans un bain autocatalytique - Google Patents
Procede destine a reduire le temps de demarrage dans un bain autocatalytiqueInfo
- Publication number
- FR2726205B1 FR2726205B1 FR9511552A FR9511552A FR2726205B1 FR 2726205 B1 FR2726205 B1 FR 2726205B1 FR 9511552 A FR9511552 A FR 9511552A FR 9511552 A FR9511552 A FR 9511552A FR 2726205 B1 FR2726205 B1 FR 2726205B1
- Authority
- FR
- France
- Prior art keywords
- reducing
- time
- autocatalytic bath
- autocatalytic
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33047394A | 1994-10-28 | 1994-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2726205A1 FR2726205A1 (fr) | 1996-05-03 |
FR2726205B1 true FR2726205B1 (fr) | 1997-09-26 |
Family
ID=23289937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9511552A Expired - Fee Related FR2726205B1 (fr) | 1994-10-28 | 1995-10-02 | Procede destine a reduire le temps de demarrage dans un bain autocatalytique |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH08213738A (fr) |
KR (1) | KR960014396A (fr) |
DE (1) | DE19540122C2 (fr) |
FR (1) | FR2726205B1 (fr) |
GB (1) | GB2294476B (fr) |
TW (1) | TW293984B (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2885113B2 (ja) * | 1995-01-30 | 1999-04-19 | 日本電気株式会社 | 印刷配線板およびその製造方法 |
KR101042483B1 (ko) | 2005-03-11 | 2011-06-16 | 히다치 가세고교 가부시끼가이샤 | 구리의 표면 처리 방법 및 구리 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2939804A (en) * | 1958-01-23 | 1960-06-07 | Uarco Inc | Resin particle coated with metal |
GB1003575A (en) * | 1962-04-19 | 1965-09-08 | Sperry Gyroscope Co Ltd | Chemical plating process |
US3372037A (en) * | 1965-06-30 | 1968-03-05 | Ibm | Magnetic materials |
GB1322081A (en) * | 1970-06-03 | 1973-07-04 | Shipley Co | Electroless nickel solution |
US3857724A (en) * | 1971-08-20 | 1974-12-31 | Ibm | Primer for electroless plating |
GB1360592A (en) * | 1973-02-14 | 1974-07-17 | Rca Corp | Electroless cobalt plating bath |
US4640718A (en) * | 1985-10-29 | 1987-02-03 | International Business Machines Corporation | Process for accelerating Pd/Sn seeds for electroless copper plating |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
US5110633A (en) * | 1989-09-01 | 1992-05-05 | Ciba-Geigy Corporation | Process for coating plastics articles |
US5162144A (en) * | 1991-08-01 | 1992-11-10 | Motorola, Inc. | Process for metallizing substrates using starved-reaction metal-oxide reduction |
EP0530144A3 (en) * | 1991-08-23 | 1994-08-24 | Ciba Geigy Ag | Process for metallising plastic articles |
US5212138A (en) * | 1991-09-23 | 1993-05-18 | Applied Electroless Concepts Inc. | Low corrosivity catalyst for activation of copper for electroless nickel plating |
-
1995
- 1995-10-02 FR FR9511552A patent/FR2726205B1/fr not_active Expired - Fee Related
- 1995-10-06 TW TW084110519A patent/TW293984B/zh active
- 1995-10-16 GB GB9521107A patent/GB2294476B/en not_active Expired - Fee Related
- 1995-10-19 KR KR1019950036104A patent/KR960014396A/ko not_active Application Discontinuation
- 1995-10-24 JP JP7298869A patent/JPH08213738A/ja active Pending
- 1995-10-27 DE DE19540122A patent/DE19540122C2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2294476A (en) | 1996-05-01 |
TW293984B (fr) | 1996-12-21 |
DE19540122A1 (de) | 1996-05-02 |
DE19540122C2 (de) | 1997-08-21 |
GB2294476B (en) | 1998-03-11 |
JPH08213738A (ja) | 1996-08-20 |
GB9521107D0 (en) | 1995-12-20 |
KR960014396A (ko) | 1996-05-22 |
FR2726205A1 (fr) | 1996-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |