KR960014396A - 무전해 배쓰에서 개시 시간을 감소시키는 방법 - Google Patents

무전해 배쓰에서 개시 시간을 감소시키는 방법 Download PDF

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Publication number
KR960014396A
KR960014396A KR1019950036104A KR19950036104A KR960014396A KR 960014396 A KR960014396 A KR 960014396A KR 1019950036104 A KR1019950036104 A KR 1019950036104A KR 19950036104 A KR19950036104 A KR 19950036104A KR 960014396 A KR960014396 A KR 960014396A
Authority
KR
South Korea
Prior art keywords
initiation time
electroless baths
reduce initiation
reduce
electroless
Prior art date
Application number
KR1019950036104A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960014396A publication Critical patent/KR960014396A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1019950036104A 1994-10-28 1995-10-19 무전해 배쓰에서 개시 시간을 감소시키는 방법 KR960014396A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33047394A 1994-10-28 1994-10-28

Publications (1)

Publication Number Publication Date
KR960014396A true KR960014396A (ko) 1996-05-22

Family

ID=23289937

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950036104A KR960014396A (ko) 1994-10-28 1995-10-19 무전해 배쓰에서 개시 시간을 감소시키는 방법

Country Status (6)

Country Link
JP (1) JPH08213738A (ko)
KR (1) KR960014396A (ko)
DE (1) DE19540122C2 (ko)
FR (1) FR2726205B1 (ko)
GB (1) GB2294476B (ko)
TW (1) TW293984B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2885113B2 (ja) * 1995-01-30 1999-04-19 日本電気株式会社 印刷配線板およびその製造方法
EP1878812B1 (en) * 2005-03-11 2012-08-29 Hitachi Chemical Company, Ltd. Copper surface treatment method and thereby surface treated copper

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939804A (en) * 1958-01-23 1960-06-07 Uarco Inc Resin particle coated with metal
GB1003575A (en) * 1962-04-19 1965-09-08 Sperry Gyroscope Co Ltd Chemical plating process
US3372037A (en) * 1965-06-30 1968-03-05 Ibm Magnetic materials
GB1322081A (en) * 1970-06-03 1973-07-04 Shipley Co Electroless nickel solution
US3857724A (en) * 1971-08-20 1974-12-31 Ibm Primer for electroless plating
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US4640718A (en) * 1985-10-29 1987-02-03 International Business Machines Corporation Process for accelerating Pd/Sn seeds for electroless copper plating
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
EP0530144A3 (en) * 1991-08-23 1994-08-24 Ciba Geigy Ag Process for metallising plastic articles
US5212138A (en) * 1991-09-23 1993-05-18 Applied Electroless Concepts Inc. Low corrosivity catalyst for activation of copper for electroless nickel plating

Also Published As

Publication number Publication date
FR2726205B1 (fr) 1997-09-26
FR2726205A1 (fr) 1996-05-03
DE19540122A1 (de) 1996-05-02
TW293984B (ko) 1996-12-21
DE19540122C2 (de) 1997-08-21
JPH08213738A (ja) 1996-08-20
GB2294476A (en) 1996-05-01
GB2294476B (en) 1998-03-11
GB9521107D0 (en) 1995-12-20

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Legal Events

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E902 Notification of reason for refusal
E601 Decision to refuse application