GB2294476B - Method for decreasing the initiation time in an electroless bath - Google Patents

Method for decreasing the initiation time in an electroless bath

Info

Publication number
GB2294476B
GB2294476B GB9521107A GB9521107A GB2294476B GB 2294476 B GB2294476 B GB 2294476B GB 9521107 A GB9521107 A GB 9521107A GB 9521107 A GB9521107 A GB 9521107A GB 2294476 B GB2294476 B GB 2294476B
Authority
GB
United Kingdom
Prior art keywords
decreasing
initiation time
electroless bath
electroless
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9521107A
Other versions
GB9521107D0 (en
GB2294476A (en
Inventor
David Richards
Yaroslaw Magera
Vernon L Brown
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB9521107D0 publication Critical patent/GB9521107D0/en
Publication of GB2294476A publication Critical patent/GB2294476A/en
Application granted granted Critical
Publication of GB2294476B publication Critical patent/GB2294476B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB9521107A 1994-10-28 1995-10-16 Method for decreasing the initiation time in an electroless bath Expired - Fee Related GB2294476B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33047394A 1994-10-28 1994-10-28

Publications (3)

Publication Number Publication Date
GB9521107D0 GB9521107D0 (en) 1995-12-20
GB2294476A GB2294476A (en) 1996-05-01
GB2294476B true GB2294476B (en) 1998-03-11

Family

ID=23289937

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9521107A Expired - Fee Related GB2294476B (en) 1994-10-28 1995-10-16 Method for decreasing the initiation time in an electroless bath

Country Status (6)

Country Link
JP (1) JPH08213738A (en)
KR (1) KR960014396A (en)
DE (1) DE19540122C2 (en)
FR (1) FR2726205B1 (en)
GB (1) GB2294476B (en)
TW (1) TW293984B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2885113B2 (en) * 1995-01-30 1999-04-19 日本電気株式会社 Printed wiring board and manufacturing method thereof
TW200702494A (en) * 2005-03-11 2007-01-16 Hitachi Chemical Co Ltd Surface treatment method for copper and copper

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1003575A (en) * 1962-04-19 1965-09-08 Sperry Gyroscope Co Ltd Chemical plating process
GB1079460A (en) * 1965-06-30 1967-08-16 Ibm Improvements in and relating to the electroless deposition of magnetic materials
GB1322081A (en) * 1970-06-03 1973-07-04 Shipley Co Electroless nickel solution
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US3857724A (en) * 1971-08-20 1974-12-31 Ibm Primer for electroless plating
EP0321067A1 (en) * 1987-12-14 1989-06-21 Hitachi Chemical Co., Ltd. Process for treating copper surface
EP0221359B1 (en) * 1985-10-29 1989-07-26 International Business Machines Corporation A process for accelerating pd/sn seeds for electroless copper plating
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
WO1993002847A1 (en) * 1991-08-01 1993-02-18 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5212138A (en) * 1991-09-23 1993-05-18 Applied Electroless Concepts Inc. Low corrosivity catalyst for activation of copper for electroless nickel plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939804A (en) * 1958-01-23 1960-06-07 Uarco Inc Resin particle coated with metal
EP0530144A3 (en) * 1991-08-23 1994-08-24 Ciba Geigy Ag Process for metallising plastic articles

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1003575A (en) * 1962-04-19 1965-09-08 Sperry Gyroscope Co Ltd Chemical plating process
GB1079460A (en) * 1965-06-30 1967-08-16 Ibm Improvements in and relating to the electroless deposition of magnetic materials
GB1322081A (en) * 1970-06-03 1973-07-04 Shipley Co Electroless nickel solution
US3857724A (en) * 1971-08-20 1974-12-31 Ibm Primer for electroless plating
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
EP0221359B1 (en) * 1985-10-29 1989-07-26 International Business Machines Corporation A process for accelerating pd/sn seeds for electroless copper plating
EP0321067A1 (en) * 1987-12-14 1989-06-21 Hitachi Chemical Co., Ltd. Process for treating copper surface
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
WO1993002847A1 (en) * 1991-08-01 1993-02-18 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5212138A (en) * 1991-09-23 1993-05-18 Applied Electroless Concepts Inc. Low corrosivity catalyst for activation of copper for electroless nickel plating

Also Published As

Publication number Publication date
TW293984B (en) 1996-12-21
JPH08213738A (en) 1996-08-20
KR960014396A (en) 1996-05-22
GB9521107D0 (en) 1995-12-20
FR2726205A1 (en) 1996-05-03
DE19540122A1 (en) 1996-05-02
GB2294476A (en) 1996-05-01
DE19540122C2 (en) 1997-08-21
FR2726205B1 (en) 1997-09-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20001016