KR910007395A - 프린트회로판, 그 제조방법 및 제조장치 - Google Patents

프린트회로판, 그 제조방법 및 제조장치 Download PDF

Info

Publication number
KR910007395A
KR910007395A KR1019900014175A KR900014175A KR910007395A KR 910007395 A KR910007395 A KR 910007395A KR 1019900014175 A KR1019900014175 A KR 1019900014175A KR 900014175 A KR900014175 A KR 900014175A KR 910007395 A KR910007395 A KR 910007395A
Authority
KR
South Korea
Prior art keywords
circuit board
copper
printed circuit
manufacturing
copper oxide
Prior art date
Application number
KR1019900014175A
Other languages
English (en)
Other versions
KR930002910B1 (ko
Inventor
기요노리 고가와
노부아끼 오오끼
마사미 가와구찌
모도요 와지마
하루오 아까호시
아끼라 나가이
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR910007395A publication Critical patent/KR910007395A/ko
Application granted granted Critical
Publication of KR930002910B1 publication Critical patent/KR930002910B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

내용 없음.

Description

프린트회로판, 그 제조방법 및 제조장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도 내지 제 3 도는 본원 발명의 실시예를 도시한 것이며,
제 1 도는 처리되는 구리표면의 단면도.
제 2 도는 다층프린트회로기판의 단면도.
제 3 도는 처리되는 구리표면의 확대개략단면도.
제 4 도는 프린트회로판제조장치의 개략도.

Claims (12)

  1. 절연기판상에 구리회로패턴을 가지며, 이 구리회로패턴의 조화(粗化)된 표면으로서 산화구리를 형성한 후에 환원된 표면상에, 이산적(離散的)으로 분포하는 금속입자를 가진 금속막을 배설하여 구성되는 것을 특징으로 하는 프린트회로판.
  2. 절연기판의 한쪽면 또는 양면에 구리회로패턴을 가지며, 이 구리회로패턴의 조화된 표면으로서 산화구리가 형성된 후에 환원된 표면상에, 이산적으로 분포하는 금속입자를 가진 금속막을 배설하여 구성되는 층상체(層狀體)를 구비하고, 이 층상체를 절연수지층을 통해서 적층함으로써 다층화하여 구성되는 것을 특징으로 하는 다층프린트회로판.
  3. 절연기판상의 구리회로패턴의 조화된 표면에 산화구리를 형성하는 공정과, 상기 산화구리를 환원하는 환원공정과, 상기 산화구리를 환원한 표면상에 이산적으로 분포하는 금속입자를 가진 금속막을 형성하는 도금공정을 가진 것을 특징으로 하는 프린트회로판의 제조방법.
  4. 제 3 항에 있어서, 상기 환원공정은 붕소계환원제에 의해 상기 산화구리를 환원처리하는 공정을 가지며, 상기 도금공정은 팔라듐을 함유하지 않은 니켈 또는 코발트의 붕소계화합물용액에 의해 도금처리하는 공정을 가진 것을 특징으로 하는 프린트회로판의 제조방법.
  5. 제 3 항 또는 제 4 항에 있어서, 상기 환원공정으로부터 상기 도금공정으로 이행하는 경우에 있어서, 물처리를 하지 않는 것을 특징으로 하는 프린트회로판의 제조방법.
  6. 제 3 항 또는 제 4 항에 있어서, 상기 환원공정으로부터 상기 도금공정으로 이행하는 경우에 있어서, 상기 산화구리를 환원한 표면을 상기 붕소계환원제로 피복한 상태로 유지하는 공정을 가진 것을 특징으로 하는 프린트회로판의 제조방법.
  7. 제 3 항 또는 제 4 항에 있어서, 상기 환원공정으로부터 상기 도금공정으로 이행하는 경우에 있어서, 상기 산화구리를 환원한 표면을 비산화가스로 피복한 상태로 유지하는 공정을 가진 것을 특징으로 하는 프린트회로판의 제조방법.
  8. 제 3 항 내지 제 7 항중 어느 한항에 있어서, 상기 환원공정으로부터 상기 도금공정으로 이행하는 경우에 있어서, 상기 산화구리를 환원한 표면에 자연생성된 산화막을 상기 도금공정의 붕소계화합물용액중에서 제거하는 프리딥공정을 가진 것을 특징으로 하는 프린트회로판의 제조방법.
  9. 제 3 항 내지 제 8 항중 어느 한항에 있어서, 상기 붕소계환원제 및 상기 붕소계화합물용액은 디메틸아민, 디에틸아민보란, 암모니아보란 및 붕수소화나트륨으로 이루어지는 군중에서 선택한 1이상의 물질을 함유하는 것을 특징으로 하는 프린트회로판의 제조방법.
  10. 제 4 항 내지 제 9 항중 어느 한항에 있어서, 상기 도금공정의 붕소계화합물용액중의 환원제농도와, 상기 붕소계환원제의 환원제농도가 대략 같은 것을 특징으로 하는 프린트회로판의 제조방법.
  11. 절연기판의 양면의 구리회로패턴의 조화된 표면에 산화구리층을 형성하는 산화공정과, 상기 산화구리층을 환원하여 환원구리층을 형성하는 환원공정과, 상기 환원구리층의 표면상에 이산적으로 분포하는 금속입자를 가진 금속막을 형성하여 층상체를 구성하는 도금공정과, 상기 층상체를 기본단위로 하여, 절연수지층을 통해서 이 기본단위를 적층하여 다층화하는 다층화공정을 가진 것을 특징으로 하는 다층프린트회로판의 제조방법.
  12. 프린트회로판의 절연기판상의 구리회로패턴의 조화된 표면에 산화구리를 형성하는 산화조와, 상기 산화구리를 환원하는 환원조와, 상기 산화구리를 환원한 표면을 도금하는 도금조와, 프린트회로판을 포위하고, 내부를 비산화가스분위기로 하는 용기를 가진 것을 특징으로 하는 프린트회로판이 제조장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900014175A 1989-09-22 1990-09-08 프린트회로판, 그 제조방법 및 제조장치 KR930002910B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP89-247319 1989-09-22
JP1-247319 1989-09-22
JP1247319A JPH069309B2 (ja) 1989-09-22 1989-09-22 プリント回路板、その製造方法および製造装置

Publications (2)

Publication Number Publication Date
KR910007395A true KR910007395A (ko) 1991-04-30
KR930002910B1 KR930002910B1 (ko) 1993-04-15

Family

ID=17161631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900014175A KR930002910B1 (ko) 1989-09-22 1990-09-08 프린트회로판, 그 제조방법 및 제조장치

Country Status (3)

Country Link
US (1) US5472563A (ko)
JP (1) JPH069309B2 (ko)
KR (1) KR930002910B1 (ko)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648125A (en) * 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US5750087B1 (en) * 1996-06-27 1999-12-14 Mine Safety Appliances Co Process for the reduction of copper oxide
US5770032A (en) * 1996-10-16 1998-06-23 Fidelity Chemical Products Corporation Metallizing process
US5792248A (en) * 1996-10-16 1998-08-11 Fidelity Chemical Products Corporation, A Division Of Auric Corporation Sensitizing solution
US5976228A (en) * 1997-09-15 1999-11-02 The Dexter Corporation Reducing agent for forming an acid resistant barrier
US6120639A (en) * 1997-11-17 2000-09-19 Macdermid, Incorporated Method for the manufacture of printed circuit boards
US6188027B1 (en) * 1999-06-30 2001-02-13 International Business Machines Corporation Protection of a plated through hole from chemical attack
US6373137B1 (en) * 2000-03-21 2002-04-16 Micron Technology, Inc. Copper interconnect for an integrated circuit and methods for its fabrication
US6596384B1 (en) 2002-04-09 2003-07-22 International Business Machines Corporation Selectively roughening conductors for high frequency printed wiring boards
KR20030091824A (ko) * 2002-05-28 2003-12-03 쉬플리 캄파니, 엘.엘.씨. 인쇄회로판의 제조방법 및 이 방법에 의해 형성된 회로판
TW200541434A (en) * 2004-04-30 2005-12-16 Hitachi Via Mechanics Ltd Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board
JP2006339270A (ja) * 2005-05-31 2006-12-14 Hitachi Chem Co Ltd 多層プリント配線板の製造方法及び多層プリント配線板
US7551492B2 (en) 2006-03-29 2009-06-23 Mosaid Technologies, Inc. Non-volatile semiconductor memory with page erase
JP5105137B2 (ja) * 2006-04-25 2012-12-19 日立化成工業株式会社 銅箔を有する基板の製造方法及び銅箔を有する基板
US7704562B2 (en) * 2006-08-14 2010-04-27 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
JP5109399B2 (ja) * 2006-09-06 2012-12-26 日立化成工業株式会社 銅の表面処理方法
JP5109400B2 (ja) * 2006-09-08 2012-12-26 日立化成工業株式会社 銅表面処理液セット、これを用いた銅の表面処理方法、銅、配線基板および半導体パッケージ
US7552785B2 (en) 2006-11-02 2009-06-30 Clark Equipment Company Suspension system for track vehicle
JP4689588B2 (ja) * 2006-12-11 2011-05-25 株式会社ヤマヒサ ペット用玩具
US7798260B2 (en) 2007-08-22 2010-09-21 Clark Equipment Company Track vehicle having drive and suspension systems
JP5105162B2 (ja) * 2007-10-01 2012-12-19 日立化成工業株式会社 銅表面の処理方法
KR101268145B1 (ko) * 2008-10-27 2013-05-27 히타치가세이가부시끼가이샤 구리의 표면 처리 방법 및 구리
US8734934B2 (en) * 2008-12-26 2014-05-27 Fujifilm Corporation Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material
US9744745B2 (en) 2011-12-29 2017-08-29 Shengyi Technology Co., Ltd. Circuit substrate and manufacturing method thereof
US20140199497A1 (en) * 2013-01-14 2014-07-17 Tighe A. Spurlin Methods for reducing metal oxide surfaces to modified metal surfaces
US9865501B2 (en) 2013-03-06 2018-01-09 Lam Research Corporation Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US9469912B2 (en) 2014-04-21 2016-10-18 Lam Research Corporation Pretreatment method for photoresist wafer processing
US9472377B2 (en) 2014-10-17 2016-10-18 Lam Research Corporation Method and apparatus for characterizing metal oxide reduction
US10443146B2 (en) 2017-03-30 2019-10-15 Lam Research Corporation Monitoring surface oxide on seed layers during electroplating
WO2020046429A1 (en) * 2018-08-28 2020-03-05 Ploof Lloyd Process for producing nanostructured metal substrates for use in surface enhanced raman spectroscopy or similar applications
US10829846B2 (en) 2018-08-28 2020-11-10 Lloyd Ploof Process for producing nanostructured metal substrates for use in Surface Enhanced Raman Spectroscopy or similar applications

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2551591A (en) * 1944-11-17 1951-05-08 Int Standard Electric Corp Polyethylene bonded to copper by means of a layer of cuprous oxide integral with copper base
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
US4225379A (en) * 1976-12-13 1980-09-30 Asahi Glass Company, Limited Method of laminating plastic film and shaped metal substrates
US4180608A (en) * 1977-01-07 1979-12-25 Del Joseph A Process for making multi-layer printed circuit boards, and the article resulting therefrom
JPS599050A (ja) * 1982-07-08 1984-01-18 日立電線株式会社 銅張積層板の製造方法
US4554184A (en) * 1984-07-02 1985-11-19 International Business Machines Corporation Method for plating from an electroless plating bath

Also Published As

Publication number Publication date
JPH069309B2 (ja) 1994-02-02
JPH03108795A (ja) 1991-05-08
KR930002910B1 (ko) 1993-04-15
US5472563A (en) 1995-12-05

Similar Documents

Publication Publication Date Title
KR910007395A (ko) 프린트회로판, 그 제조방법 및 제조장치
KR100755192B1 (ko) 폴리이미드 수지의 무기 박막 패턴 형성방법
EP0321067B1 (en) Process for treating copper surface
US6571467B2 (en) Method for producing a doublesided wiring board
TW200704833A (en) Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
US4336100A (en) Method of production of electrically conductive panels and insulating base materials
JPH0114858B2 (ko)
KR920003827A (ko) 다층 인쇄판의 제조방법
TW525418B (en) Process for producing printed wiring board
US20090308645A1 (en) Printed circuit board and manufacturing method thereof
TW402644B (en) Mucrioiriys copper film and electroless copper plating solution therefor
TW200605373A (en) Printed wiring board, production process thereof and semiconductor device
GB1143899A (en) Improvements relating to the manufacture of printed circuits
EP1209958A3 (en) Laminated structure for electronic equipment and method of electroless gold plating
DE60031479D1 (de) Verfahren zur Herstellung elektrolytisch abgeschiedener Kupferfolie, elektrolytisch abgeschiedene Kupfer-Folie, kupferkaschiertes Laminat und Leiterplatte
MY104191A (en) Process for producing multilayer printed wiring board
KR950024971A (ko) 산화구리용 화학적 환원액
JP4646376B2 (ja) ダイレクトプレーティング用アクセレレータ浴液およびダイレクトプレーティング方法
KR20140019174A (ko) 인쇄회로기판의 제조방법
KR960030756A (ko) 인쇄 배선 보드와 그 형성 방법
KR890003270A (ko) 회로 형성법
JPH11256349A (ja) 樹脂基材への高密着性めっき方法およびこれに用いる銅めっき液
KR920002276B1 (ko) 인쇄 배선판의 제조방법
JP2000151096A (ja) プリント配線板の製造方法
JP2004349693A (ja) 銅表面の対樹脂接着層

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20020219

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee