DE1942810C3 - Integrierte Hall-Effektanordnung - Google Patents

Integrierte Hall-Effektanordnung

Info

Publication number
DE1942810C3
DE1942810C3 DE1942810A DE1942810A DE1942810C3 DE 1942810 C3 DE1942810 C3 DE 1942810C3 DE 1942810 A DE1942810 A DE 1942810A DE 1942810 A DE1942810 A DE 1942810A DE 1942810 C3 DE1942810 C3 DE 1942810C3
Authority
DE
Germany
Prior art keywords
semiconductor body
hall element
hall effect
integrated
hall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1942810A
Other languages
German (de)
English (en)
Other versions
DE1942810A1 (de
DE1942810B2 (de
Inventor
Hendrik Jan Eindhoven Bergmans (Niederlande)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1942810A1 publication Critical patent/DE1942810A1/de
Publication of DE1942810B2 publication Critical patent/DE1942810B2/de
Application granted granted Critical
Publication of DE1942810C3 publication Critical patent/DE1942810C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
DE1942810A 1968-08-31 1969-08-22 Integrierte Hall-Effektanordnung Expired DE1942810C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6812451A NL6812451A (enExample) 1968-08-31 1968-08-31

Publications (3)

Publication Number Publication Date
DE1942810A1 DE1942810A1 (de) 1970-03-05
DE1942810B2 DE1942810B2 (de) 1977-10-06
DE1942810C3 true DE1942810C3 (de) 1978-06-01

Family

ID=19804517

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1942810A Expired DE1942810C3 (de) 1968-08-31 1969-08-22 Integrierte Hall-Effektanordnung

Country Status (12)

Country Link
US (1) US3667000A (enExample)
AT (1) AT308199B (enExample)
BE (1) BE738220A (enExample)
CH (1) CH502703A (enExample)
DE (1) DE1942810C3 (enExample)
DK (1) DK124365B (enExample)
ES (1) ES370984A1 (enExample)
FR (1) FR2017194A1 (enExample)
GB (1) GB1270316A (enExample)
NL (1) NL6812451A (enExample)
NO (1) NO125420B (enExample)
SE (1) SE341226B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305439A1 (de) * 1993-02-23 1994-08-25 Eldo Elektronik Service Gmbh Umkapselung für ein elektronisches Bauelement

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3800193A (en) * 1972-09-05 1974-03-26 Ibm Magnetic sensing device
JPS529515B2 (enExample) * 1972-11-08 1977-03-16
US3845445A (en) * 1973-11-12 1974-10-29 Ibm Modular hall effect device
DE3172553D1 (en) * 1980-11-28 1985-11-07 Toshiba Kk Method for manufacturing a module for a fiber optic link
DE3243039A1 (de) * 1982-11-22 1984-05-24 Telefunken electronic GmbH, 6000 Frankfurt Magnetempfindliches halbleiterbauelement
US5017804A (en) * 1987-07-23 1991-05-21 Siliconix Incorporated Hall sensing of bond wire current
US5587857A (en) * 1994-10-18 1996-12-24 International Business Machines Corporation Silicon chip with an integrated magnetoresistive head mounted on a slider
US5883567A (en) * 1997-10-10 1999-03-16 Analog Devices, Inc. Packaged integrated circuit with magnetic flux concentrator
CN109387681B (zh) * 2018-12-28 2024-08-13 杭州思泰微电子有限公司 基于磁场检测的双通道电流传感器结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1118284A (enExample) *
US2877394A (en) * 1959-03-10 Hall effect device
US3050698A (en) * 1960-02-12 1962-08-21 Bell Telephone Labor Inc Semiconductor hall effect devices
CH385681A (de) * 1960-09-29 1964-12-15 Siemens Ag Einrichtung zur Übermittlung von Steuerbefehlen, insbesondere für Förderanlagen oder dergleichen
US3239786A (en) * 1963-05-09 1966-03-08 Gen Precision Inc Hall generator and method of fabrication
US3413713A (en) * 1965-06-18 1968-12-03 Motorola Inc Plastic encapsulated transistor and method of making same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305439A1 (de) * 1993-02-23 1994-08-25 Eldo Elektronik Service Gmbh Umkapselung für ein elektronisches Bauelement
DE4305439C2 (de) * 1993-02-23 1999-10-21 Eldo Elektronik Service Gmbh Umkapselung für einen elektronischen Sensor zur Feldstärkemessung

Also Published As

Publication number Publication date
CH502703A (de) 1971-01-31
NL6812451A (enExample) 1970-03-03
DE1942810A1 (de) 1970-03-05
DE1942810B2 (de) 1977-10-06
NO125420B (enExample) 1972-09-04
DK124365B (da) 1972-10-09
AT308199B (de) 1973-06-25
BE738220A (enExample) 1970-03-02
GB1270316A (en) 1972-04-12
SE341226B (enExample) 1971-12-20
ES370984A1 (es) 1971-08-01
US3667000A (en) 1972-05-30
FR2017194A1 (enExample) 1970-05-22

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
EHJ Ceased/non-payment of the annual fee