DE1905958A1 - Verfahren zur Verbesserung der Bindefestigkeit einer Kupferfolie mit einer matten Oberflaeche - Google Patents
Verfahren zur Verbesserung der Bindefestigkeit einer Kupferfolie mit einer matten OberflaecheInfo
- Publication number
- DE1905958A1 DE1905958A1 DE19691905958 DE1905958A DE1905958A1 DE 1905958 A1 DE1905958 A1 DE 1905958A1 DE 19691905958 DE19691905958 DE 19691905958 DE 1905958 A DE1905958 A DE 1905958A DE 1905958 A1 DE1905958 A1 DE 1905958A1
- Authority
- DE
- Germany
- Prior art keywords
- copper foil
- matt surface
- coating
- substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70325368A | 1968-02-06 | 1968-02-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1905958A1 true DE1905958A1 (de) | 1969-08-21 |
Family
ID=24824652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19691905958 Pending DE1905958A1 (de) | 1968-02-06 | 1969-02-06 | Verfahren zur Verbesserung der Bindefestigkeit einer Kupferfolie mit einer matten Oberflaeche |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5343555B1 (xx) |
BE (1) | BE727909A (xx) |
DE (1) | DE1905958A1 (xx) |
FR (1) | FR2001410A1 (xx) |
GB (1) | GB1211494A (xx) |
LU (1) | LU57916A1 (xx) |
NL (2) | NL6901906A (xx) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2616865A1 (de) * | 1976-04-15 | 1977-10-27 | Schaefer Gmbh Fritz | Grossraum-muellbehaelter mit schwebend verlagerbarem deckel |
JPS546701B1 (xx) * | 1972-03-21 | 1979-03-30 | ||
DE3321317A1 (de) * | 1983-06-13 | 1984-12-13 | Fritz Schäfer GmbH, 5908 Neunkirchen | Grossraum-muellbehaelter mit einem mulden- oder kuebelartigen aufnahmegefaess |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56155592A (en) * | 1980-04-03 | 1981-12-01 | Furukawa Circuit Foil | Copper foil for printed circuit and method of manufacturing same |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
JPS5932206U (ja) * | 1982-08-25 | 1984-02-28 | 松下精工株式会社 | 石英管ヒ−タ−の保持装置 |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4490218A (en) * | 1983-11-07 | 1984-12-25 | Olin Corporation | Process and apparatus for producing surface treated metal foil |
JPS6113688A (ja) * | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
US4551210A (en) * | 1984-11-13 | 1985-11-05 | Olin Corporation | Dendritic treatment of metallic surfaces for improving adhesive bonding |
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
US5057193A (en) * | 1989-04-05 | 1991-10-15 | Olin Corporation | Anti-tarnish treatment of metal foil |
US4961828A (en) * | 1989-04-05 | 1990-10-09 | Olin Corporation | Treatment of metal foil |
-
0
- NL NL144810D patent/NL144810C/xx not_active IP Right Cessation
-
1969
- 1969-02-04 LU LU57916D patent/LU57916A1/xx unknown
- 1969-02-04 BE BE727909D patent/BE727909A/xx not_active IP Right Cessation
- 1969-02-05 JP JP698207A patent/JPS5343555B1/ja active Pending
- 1969-02-05 GB GB6137/69A patent/GB1211494A/en not_active Expired
- 1969-02-06 NL NL6901906A patent/NL6901906A/xx unknown
- 1969-02-06 FR FR6902639A patent/FR2001410A1/fr active Pending
- 1969-02-06 DE DE19691905958 patent/DE1905958A1/de active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS546701B1 (xx) * | 1972-03-21 | 1979-03-30 | ||
DE2616865A1 (de) * | 1976-04-15 | 1977-10-27 | Schaefer Gmbh Fritz | Grossraum-muellbehaelter mit schwebend verlagerbarem deckel |
DE3321317A1 (de) * | 1983-06-13 | 1984-12-13 | Fritz Schäfer GmbH, 5908 Neunkirchen | Grossraum-muellbehaelter mit einem mulden- oder kuebelartigen aufnahmegefaess |
Also Published As
Publication number | Publication date |
---|---|
BE727909A (xx) | 1969-07-16 |
NL144810C (xx) | |
GB1211494A (en) | 1970-11-04 |
NL6901906A (xx) | 1969-08-08 |
FR2001410A1 (xx) | 1969-09-26 |
LU57916A1 (xx) | 1969-05-21 |
JPS5343555B1 (xx) | 1978-11-21 |
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