DE1904118B2 - Elektrodenanschluss fuer ein integriertes halbleiterbauelement - Google Patents

Elektrodenanschluss fuer ein integriertes halbleiterbauelement

Info

Publication number
DE1904118B2
DE1904118B2 DE19691904118 DE1904118A DE1904118B2 DE 1904118 B2 DE1904118 B2 DE 1904118B2 DE 19691904118 DE19691904118 DE 19691904118 DE 1904118 A DE1904118 A DE 1904118A DE 1904118 B2 DE1904118 B2 DE 1904118B2
Authority
DE
Germany
Prior art keywords
aluminum
base body
metal
gold
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691904118
Other languages
German (de)
English (en)
Other versions
DE1904118A1 (de
Inventor
Takayuki Kodaira Suzuoka (Japan)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE1904118A1 publication Critical patent/DE1904118A1/de
Publication of DE1904118B2 publication Critical patent/DE1904118B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE19691904118 1968-01-29 1969-01-28 Elektrodenanschluss fuer ein integriertes halbleiterbauelement Pending DE1904118B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1968005484U JPS5026292Y1 (enExample) 1968-01-29 1968-01-29

Publications (2)

Publication Number Publication Date
DE1904118A1 DE1904118A1 (de) 1969-08-28
DE1904118B2 true DE1904118B2 (de) 1972-06-22

Family

ID=11612505

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691904118 Pending DE1904118B2 (de) 1968-01-29 1969-01-28 Elektrodenanschluss fuer ein integriertes halbleiterbauelement

Country Status (6)

Country Link
US (1) US3581166A (enExample)
JP (1) JPS5026292Y1 (enExample)
DE (1) DE1904118B2 (enExample)
FR (1) FR2000900B1 (enExample)
GB (1) GB1191093A (enExample)
NL (1) NL146330B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2334427A1 (de) * 1972-07-10 1974-01-31 Amdahl Corp Baugruppe fuer ein lsi-plaettchen und herstellungsverfahren

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3675090A (en) * 1968-11-04 1972-07-04 Energy Conversion Devices Inc Film deposited semiconductor devices
IN148328B (enExample) * 1977-04-18 1981-01-17 Rca Corp
DE2809883A1 (de) * 1977-10-14 1979-04-19 Plessey Inc Anschlussleiterrahmen fuer gehaeuse von halbleiterbauelementen
US4246697A (en) 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS59125644A (ja) * 1982-12-29 1984-07-20 Fujitsu Ltd 半導体装置
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271635A (en) * 1963-05-06 1966-09-06 Rca Corp Semiconductor devices with silver-gold lead wires attached to aluminum contacts
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2334427A1 (de) * 1972-07-10 1974-01-31 Amdahl Corp Baugruppe fuer ein lsi-plaettchen und herstellungsverfahren

Also Published As

Publication number Publication date
JPS5026292Y1 (enExample) 1975-08-06
DE1904118A1 (de) 1969-08-28
FR2000900A1 (enExample) 1969-09-19
GB1191093A (en) 1970-05-06
US3581166A (en) 1971-05-25
FR2000900B1 (enExample) 1973-05-25
NL146330B (nl) 1975-06-16
NL6901301A (enExample) 1969-07-31

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971