DE1811837A1 - Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator - Google Patents

Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator

Info

Publication number
DE1811837A1
DE1811837A1 DE19681811837 DE1811837A DE1811837A1 DE 1811837 A1 DE1811837 A1 DE 1811837A1 DE 19681811837 DE19681811837 DE 19681811837 DE 1811837 A DE1811837 A DE 1811837A DE 1811837 A1 DE1811837 A1 DE 1811837A1
Authority
DE
Germany
Prior art keywords
component
strip
electrical
capacitor
platelets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681811837
Other languages
German (de)
English (en)
Inventor
Jean-Claude Asscher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR78003493A external-priority patent/FR94659E/fr
Application filed by Individual filed Critical Individual
Publication of DE1811837A1 publication Critical patent/DE1811837A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE19681811837 1967-11-29 1968-11-29 Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator Pending DE1811837A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR130093 1967-11-29
FR78003486 1968-03-29
FR78003493A FR94659E (fr) 1967-11-29 1968-04-16 Procédé de fabrication de composants électriques ou électroniques, notamment de condensateurs au tantale.

Publications (1)

Publication Number Publication Date
DE1811837A1 true DE1811837A1 (de) 1969-07-10

Family

ID=27244694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681811837 Pending DE1811837A1 (de) 1967-11-29 1968-11-29 Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator

Country Status (6)

Country Link
US (1) US3550228A (cg-RX-API-DMAC10.html)
BE (1) BE723634A (cg-RX-API-DMAC10.html)
DE (1) DE1811837A1 (cg-RX-API-DMAC10.html)
GB (1) GB1212899A (cg-RX-API-DMAC10.html)
LU (1) LU57287A1 (cg-RX-API-DMAC10.html)
NL (1) NL6816790A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134617A1 (de) * 1981-09-01 1983-03-17 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Folien-kondensator in chip-bauweise und verfahren zu seiner herstellung
DE3329886A1 (de) * 1982-08-20 1984-02-23 Matsuo Electric Co., Ltd., Toyonaka, Osaka Verfahren zum herstellen von trocken-elektrolyt-kondensatoren
DE2167079C2 (de) * 1970-02-25 1985-09-26 Union Carbide Corp., New York, N.Y. Verfahren zum Herstellen von mit Kunststoff vergossenen elektrischen Bauelementen

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1805174A1 (de) * 1968-10-25 1970-05-14 Telefunken Patent Verfahren zum Aufbringen von Einzelkoerpern auf einen Grundkoerper
JPS5121454B1 (cg-RX-API-DMAC10.html) * 1971-05-24 1976-07-02
JPS4857652U (cg-RX-API-DMAC10.html) * 1971-11-02 1973-07-23
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3828227A (en) * 1973-04-09 1974-08-06 Sprague Electric Co Solid tantalum capacitor with end cap terminals
US4173062A (en) * 1976-08-16 1979-11-06 Corning Glass Works Method of forming a quadriplanar component
US4097915A (en) * 1976-08-16 1978-06-27 Corning Glass Works Quadriplanar capacitor
US4282645A (en) * 1978-07-31 1981-08-11 Sprague Electric Company Method of assembling an encapsulated chip capacitor
US4288842A (en) * 1979-06-11 1981-09-08 Emhart Industries, Inc. Solid chip capacitor and method of manufacture
JPS58196829U (ja) * 1982-06-24 1983-12-27 松尾電機株式会社 固体電解コンデンサ
US4463407A (en) * 1982-09-27 1984-07-31 Northern Telecom Limited Surface mounted electronic components having pre-applied solder
GB2141583A (en) * 1983-06-17 1984-12-19 Standard Telephones Cables Ltd Leadless capacitors
US4497012A (en) * 1983-11-14 1985-01-29 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4491895A (en) * 1983-11-14 1985-01-01 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4511951A (en) * 1983-11-14 1985-04-16 Rogers Corporation Multilayer decoupling capacitor and method of manufacture thereof
US4578736A (en) * 1984-08-28 1986-03-25 At&T Technologies, Inc. Surface mounted electrical components and method of fabrication
US4648006A (en) * 1985-03-26 1987-03-03 Illinois Tool Works Inc. Plastic chip capacitor for surface mounting
US4757610A (en) * 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
EP0242149B1 (en) * 1986-04-16 1992-02-12 Micropore International Limited Method of enclosing an object within a homogeneous block (2)
US4725806A (en) * 1987-05-21 1988-02-16 Standex International Corporation Contact elements for miniature inductor
EP0359856B1 (de) * 1988-04-09 1993-12-22 Georg Sillner Verfahren sowie Vorrichtung zum Umformen von Zylindrischen elektrischen Bauteilen
DE3927690C2 (de) * 1988-08-26 2001-12-13 Dale Electronics Oberflächenmontierbarer Widerstand
US4926542A (en) * 1988-08-26 1990-05-22 Dale Electronic, Inc. Method of making a surface mount wirewound resistor
FR2640825B1 (fr) * 1988-12-20 1991-01-25 Europ Composants Electron Composant electrique a report direct
JPH04273112A (ja) * 1991-02-28 1992-09-29 Murata Mfg Co Ltd モールド型チップ電子部品
TWM250321U (en) * 2004-01-14 2004-11-11 Optimum Care Int Tech Inc Lead frame unit structure of chip with hidden position
ITPC20050004U1 (it) * 2005-03-10 2006-09-11 Electrica Srl Rele' voltmetrico con aggancio migliorato dei terminali
EP2372733B1 (en) * 2008-12-29 2018-10-17 Showa Denko K.K. Solid electrolytic capacitor
JP6694235B2 (ja) * 2015-01-29 2020-05-13 Tdk株式会社 電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2167079C2 (de) * 1970-02-25 1985-09-26 Union Carbide Corp., New York, N.Y. Verfahren zum Herstellen von mit Kunststoff vergossenen elektrischen Bauelementen
DE3134617A1 (de) * 1981-09-01 1983-03-17 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Folien-kondensator in chip-bauweise und verfahren zu seiner herstellung
DE3329886A1 (de) * 1982-08-20 1984-02-23 Matsuo Electric Co., Ltd., Toyonaka, Osaka Verfahren zum herstellen von trocken-elektrolyt-kondensatoren

Also Published As

Publication number Publication date
LU57287A1 (cg-RX-API-DMAC10.html) 1969-02-25
NL6816790A (cg-RX-API-DMAC10.html) 1969-06-02
GB1212899A (en) 1970-11-18
BE723634A (cg-RX-API-DMAC10.html) 1969-04-16
US3550228A (en) 1970-12-29

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