DE1640502A1 - Verfahren zur Herstellung eines elektrischen Widerstandselements - Google Patents
Verfahren zur Herstellung eines elektrischen WiderstandselementsInfo
- Publication number
- DE1640502A1 DE1640502A1 DE19671640502 DE1640502A DE1640502A1 DE 1640502 A1 DE1640502 A1 DE 1640502A1 DE 19671640502 DE19671640502 DE 19671640502 DE 1640502 A DE1640502 A DE 1640502A DE 1640502 A1 DE1640502 A1 DE 1640502A1
- Authority
- DE
- Germany
- Prior art keywords
- polyimide
- coated
- resistance
- metal
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 36
- 229920001721 polyimide Polymers 0.000 claims description 36
- 229910044991 metal oxide Inorganic materials 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 150000004706 metal oxides Chemical class 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910003445 palladium oxide Inorganic materials 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 6
- 150000003628 tricarboxylic acids Chemical class 0.000 claims description 6
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 claims description 4
- NCYVXEGFNDZQCU-UHFFFAOYSA-N nikethamide Chemical compound CCN(CC)C(=O)C1=CC=CN=C1 NCYVXEGFNDZQCU-UHFFFAOYSA-N 0.000 claims 1
- 229960003226 nikethamide Drugs 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 22
- 229920000642 polymer Polymers 0.000 description 16
- 238000000576 coating method Methods 0.000 description 10
- 150000004985 diamines Chemical class 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229920001568 phenolic resin Polymers 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 229910003437 indium oxide Inorganic materials 0.000 description 6
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000007859 condensation product Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N dimethylformamide Substances CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- -1 tetracarboxylic acid dianhydride Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/307—Other macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US520534A US3411122A (en) | 1966-01-13 | 1966-01-13 | Electrical resistance element and method of fabricating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1640502A1 true DE1640502A1 (de) | 1970-07-16 |
Family
ID=24073016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19671640502 Pending DE1640502A1 (de) | 1966-01-13 | 1967-01-05 | Verfahren zur Herstellung eines elektrischen Widerstandselements |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3411122A (en, 2012) |
| BE (1) | BE692035A (en, 2012) |
| CH (1) | CH482273A (en, 2012) |
| DE (1) | DE1640502A1 (en, 2012) |
| FR (1) | FR1508594A (en, 2012) |
| GB (1) | GB1141397A (en, 2012) |
| NL (1) | NL6700515A (en, 2012) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3660158A (en) * | 1968-12-30 | 1972-05-02 | Gen Electric | Thin film nickel temperature sensor and method of forming |
| US3619733A (en) * | 1969-08-18 | 1971-11-09 | Rca Corp | Semiconductor device with multilevel metalization and method of making the same |
| US3629781A (en) * | 1969-12-04 | 1971-12-21 | Sprague Electric Co | Cylindrically molded metal film resistor |
| US3775725A (en) * | 1970-04-30 | 1973-11-27 | Hokuriku Elect Ind | Printed resistor |
| US3761860A (en) * | 1970-05-20 | 1973-09-25 | Alps Electric Co Ltd | Printed circuit resistor |
| US3645783A (en) * | 1970-06-03 | 1972-02-29 | Infrared Ind Inc | Thin film planar resistor |
| DE2027105C3 (de) * | 1970-06-03 | 1981-03-26 | Robert Bosch Gmbh, 70469 Stuttgart | Verfahren zur Herstellung eines Halbleiterbauelements |
| US3745508A (en) * | 1972-05-25 | 1973-07-10 | Bourns Inc | Selectable fixed impedance device |
| US4001870A (en) * | 1972-08-18 | 1977-01-04 | Hitachi, Ltd. | Isolating protective film for semiconductor devices and method for making the same |
| US4017886A (en) * | 1972-10-18 | 1977-04-12 | Hitachi, Ltd. | Discrete semiconductor device having polymer resin as insulator and method for making the same |
| NL7403106A (en, 2012) * | 1973-04-26 | 1974-10-29 | ||
| JPS5336997B2 (en, 2012) * | 1973-10-12 | 1978-10-05 | ||
| US3940667A (en) * | 1974-03-04 | 1976-02-24 | P. R. Mallory & Co. Inc. | Electrical device and method of making the same |
| DE3212738A1 (de) * | 1982-04-06 | 1983-10-06 | Ind Automation Waege Prozess | Verfahren zur quasihermetischen, rueckwirkungsarmen abdeckung empfindlicher physikalischer strukturen |
| JPS6013565A (ja) * | 1983-07-05 | 1985-01-24 | Oki Electric Ind Co Ltd | サ−マルヘツド |
| US5804870A (en) * | 1992-06-26 | 1998-09-08 | Staktek Corporation | Hermetically sealed integrated circuit lead-on package configuration |
| US5702985A (en) * | 1992-06-26 | 1997-12-30 | Staktek Corporation | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method |
| US6323060B1 (en) | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
| US6262895B1 (en) | 2000-01-13 | 2001-07-17 | John A. Forthun | Stackable chip package with flex carrier |
| US7485951B2 (en) | 2001-10-26 | 2009-02-03 | Entorian Technologies, Lp | Modularized die stacking system and method |
| US7310458B2 (en) | 2001-10-26 | 2007-12-18 | Staktek Group L.P. | Stacked module systems and methods |
| US7371609B2 (en) | 2001-10-26 | 2008-05-13 | Staktek Group L.P. | Stacked module systems and methods |
| US6956284B2 (en) | 2001-10-26 | 2005-10-18 | Staktek Group L.P. | Integrated circuit stacking system and method |
| US6914324B2 (en) | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
| US7202555B2 (en) | 2001-10-26 | 2007-04-10 | Staktek Group L.P. | Pitch change and chip scale stacking system and method |
| US7026708B2 (en) | 2001-10-26 | 2006-04-11 | Staktek Group L.P. | Low profile chip scale stacking system and method |
| US20030234443A1 (en) | 2001-10-26 | 2003-12-25 | Staktek Group, L.P. | Low profile stacking system and method |
| US20060255446A1 (en) | 2001-10-26 | 2006-11-16 | Staktek Group, L.P. | Stacked modules and method |
| US7053478B2 (en) | 2001-10-26 | 2006-05-30 | Staktek Group L.P. | Pitch change and chip scale stacking system |
| US7656678B2 (en) | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
| US6940729B2 (en) | 2001-10-26 | 2005-09-06 | Staktek Group L.P. | Integrated circuit stacking system and method |
| US7081373B2 (en) | 2001-12-14 | 2006-07-25 | Staktek Group, L.P. | CSP chip stack with flex circuit |
| US7542304B2 (en) | 2003-09-15 | 2009-06-02 | Entorian Technologies, Lp | Memory expansion and integrated circuit stacking system and method |
| US8038796B2 (en) | 2004-12-30 | 2011-10-18 | Lam Research Corporation | Apparatus for spatial and temporal control of temperature on a substrate |
| US7309914B2 (en) | 2005-01-20 | 2007-12-18 | Staktek Group L.P. | Inverted CSP stacking system and method |
| US7033861B1 (en) | 2005-05-18 | 2006-04-25 | Staktek Group L.P. | Stacked module systems and method |
| US7417310B2 (en) | 2006-11-02 | 2008-08-26 | Entorian Technologies, Lp | Circuit module having force resistant construction |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2635994A (en) * | 1950-04-27 | 1953-04-21 | Sprague Electric Co | Production of carbon resistors |
| US3179633A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides from meta-phenylene diamine and para-phenylene diamine |
| US3179632A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Process for preparing polyimides by treating polyamide-acids with aromatic monocarboxylic acid anhydrides |
| US3179634A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides and the process for preparing them |
| BE627626A (en, 2012) * | 1962-01-26 | 1900-01-01 | ||
| US3248345A (en) * | 1963-10-01 | 1966-04-26 | Ibm | Electrical resistance compositions, elements and methods of making same |
-
1966
- 1966-01-13 US US520534A patent/US3411122A/en not_active Expired - Lifetime
- 1966-12-05 GB GB54310/66A patent/GB1141397A/en not_active Expired
- 1966-12-30 BE BE692035D patent/BE692035A/xx unknown
-
1967
- 1967-01-05 DE DE19671640502 patent/DE1640502A1/de active Pending
- 1967-01-10 CH CH31467A patent/CH482273A/de not_active IP Right Cessation
- 1967-01-11 FR FR8278A patent/FR1508594A/fr not_active Expired
- 1967-01-12 NL NL6700515A patent/NL6700515A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3411122A (en) | 1968-11-12 |
| CH482273A (de) | 1969-11-30 |
| BE692035A (en, 2012) | 1967-05-29 |
| GB1141397A (en) | 1969-01-29 |
| FR1508594A (fr) | 1968-01-05 |
| NL6700515A (en, 2012) | 1967-07-14 |
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