DE1639402B2 - Steuerbares halbleiterbauelement - Google Patents

Steuerbares halbleiterbauelement

Info

Publication number
DE1639402B2
DE1639402B2 DE1968S0114041 DES0114041A DE1639402B2 DE 1639402 B2 DE1639402 B2 DE 1639402B2 DE 1968S0114041 DE1968S0114041 DE 1968S0114041 DE S0114041 A DES0114041 A DE S0114041A DE 1639402 B2 DE1639402 B2 DE 1639402B2
Authority
DE
Germany
Prior art keywords
housing part
semiconductor component
cap
electrically conductive
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1968S0114041
Other languages
German (de)
English (en)
Other versions
DE1639402A1 (de
Inventor
Harry; Kirschner Fritz Dipl.-Ing.; 8000 München Rambeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE1968S0114041 priority Critical patent/DE1639402B2/de
Priority claimed from DE19681639402 external-priority patent/DE1639402C3/de
Priority to CH53869A priority patent/CH484515A/de
Priority to US3559004D priority patent/US3559004A/en
Priority to BE727717D priority patent/BE727717A/xx
Priority to FR6902481A priority patent/FR2001524A1/fr
Publication of DE1639402A1 publication Critical patent/DE1639402A1/de
Publication of DE1639402B2 publication Critical patent/DE1639402B2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W76/136—
    • H10W76/40—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
DE1968S0114041 1968-02-08 1968-02-08 Steuerbares halbleiterbauelement Granted DE1639402B2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE1968S0114041 DE1639402B2 (de) 1968-02-08 1968-02-08 Steuerbares halbleiterbauelement
CH53869A CH484515A (de) 1968-02-08 1969-01-16 Steuerbares Halbleiterbauelement
US3559004D US3559004A (en) 1968-02-08 1969-01-28 Connector structure for housing of pressure-biased semiconductor device
BE727717D BE727717A (cg-RX-API-DMAC10.html) 1968-02-08 1969-01-31
FR6902481A FR2001524A1 (cg-RX-API-DMAC10.html) 1968-02-08 1969-02-04

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1968S0114041 DE1639402B2 (de) 1968-02-08 1968-02-08 Steuerbares halbleiterbauelement
DE19681639402 DE1639402C3 (cg-RX-API-DMAC10.html) 1968-02-08 1968-02-08

Publications (2)

Publication Number Publication Date
DE1639402A1 DE1639402A1 (de) 1970-02-26
DE1639402B2 true DE1639402B2 (de) 1976-12-16

Family

ID=25754003

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1968S0114041 Granted DE1639402B2 (de) 1968-02-08 1968-02-08 Steuerbares halbleiterbauelement

Country Status (5)

Country Link
US (1) US3559004A (cg-RX-API-DMAC10.html)
BE (1) BE727717A (cg-RX-API-DMAC10.html)
CH (1) CH484515A (cg-RX-API-DMAC10.html)
DE (1) DE1639402B2 (cg-RX-API-DMAC10.html)
FR (1) FR2001524A1 (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869703A (en) * 1970-03-16 1975-03-04 Philips Corp Semiconductor device having an improved supply lead support
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
JPS62269322A (ja) * 1986-05-17 1987-11-21 Toshiba Corp 電力用半導体装置
US6040625A (en) * 1997-09-25 2000-03-21 I/O Sensors, Inc. Sensor package arrangement

Also Published As

Publication number Publication date
FR2001524A1 (cg-RX-API-DMAC10.html) 1969-09-26
DE1639402A1 (de) 1970-02-26
BE727717A (cg-RX-API-DMAC10.html) 1969-07-01
CH484515A (de) 1970-01-15
US3559004A (en) 1971-01-26

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee