BE727717A - - Google Patents
Info
- Publication number
- BE727717A BE727717A BE727717DA BE727717A BE 727717 A BE727717 A BE 727717A BE 727717D A BE727717D A BE 727717DA BE 727717 A BE727717 A BE 727717A
- Authority
- BE
- Belgium
Links
Classifications
-
- H10W72/00—
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- H10W76/136—
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- H10W76/40—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/926—Elongated lead extending axially through another elongated lead
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1968S0114041 DE1639402B2 (de) | 1968-02-08 | 1968-02-08 | Steuerbares halbleiterbauelement |
| DE19681639402 DE1639402C3 (cg-RX-API-DMAC10.html) | 1968-02-08 | 1968-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE727717A true BE727717A (cg-RX-API-DMAC10.html) | 1969-07-01 |
Family
ID=25754003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE727717D BE727717A (cg-RX-API-DMAC10.html) | 1968-02-08 | 1969-01-31 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3559004A (cg-RX-API-DMAC10.html) |
| BE (1) | BE727717A (cg-RX-API-DMAC10.html) |
| CH (1) | CH484515A (cg-RX-API-DMAC10.html) |
| DE (1) | DE1639402B2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2001524A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3869703A (en) * | 1970-03-16 | 1975-03-04 | Philips Corp | Semiconductor device having an improved supply lead support |
| US3708722A (en) * | 1970-12-18 | 1973-01-02 | Erie Technological Prod Inc | Semiconductor device with soldered terminals and plastic housing and method of making the same |
| US4249034A (en) * | 1978-11-27 | 1981-02-03 | General Electric Company | Semiconductor package having strengthening and sealing upper chamber |
| JPS62269322A (ja) * | 1986-05-17 | 1987-11-21 | Toshiba Corp | 電力用半導体装置 |
| US6040625A (en) * | 1997-09-25 | 2000-03-21 | I/O Sensors, Inc. | Sensor package arrangement |
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1968
- 1968-02-08 DE DE1968S0114041 patent/DE1639402B2/de active Granted
-
1969
- 1969-01-16 CH CH53869A patent/CH484515A/de not_active IP Right Cessation
- 1969-01-28 US US3559004D patent/US3559004A/en not_active Expired - Lifetime
- 1969-01-31 BE BE727717D patent/BE727717A/xx unknown
- 1969-02-04 FR FR6902481A patent/FR2001524A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2001524A1 (cg-RX-API-DMAC10.html) | 1969-09-26 |
| DE1639402A1 (de) | 1970-02-26 |
| US3559004A (en) | 1971-01-26 |
| DE1639402B2 (de) | 1976-12-16 |
| CH484515A (de) | 1970-01-15 |