DE1439623C3 - Mehrfachtransistor - Google Patents

Mehrfachtransistor

Info

Publication number
DE1439623C3
DE1439623C3 DE1439623A DE1439623A DE1439623C3 DE 1439623 C3 DE1439623 C3 DE 1439623C3 DE 1439623 A DE1439623 A DE 1439623A DE 1439623 A DE1439623 A DE 1439623A DE 1439623 C3 DE1439623 C3 DE 1439623C3
Authority
DE
Germany
Prior art keywords
common
transistors
multiple transistor
housing
individual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1439623A
Other languages
German (de)
English (en)
Other versions
DE1439623B2 (de
DE1439623A1 (de
Inventor
Reinhard Dr.Rer.Nat. Dahlberg
Dieter Dr. Gerstner
Walter Klossika
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of DE1439623A1 publication Critical patent/DE1439623A1/de
Publication of DE1439623B2 publication Critical patent/DE1439623B2/de
Application granted granted Critical
Publication of DE1439623C3 publication Critical patent/DE1439623C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/401—Resistive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Fuses (AREA)
DE1439623A 1963-03-21 1963-03-21 Mehrfachtransistor Expired DE1439623C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET0023669 1963-03-21

Publications (3)

Publication Number Publication Date
DE1439623A1 DE1439623A1 (de) 1968-11-28
DE1439623B2 DE1439623B2 (de) 1973-06-07
DE1439623C3 true DE1439623C3 (de) 1974-01-03

Family

ID=7551110

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1439623A Expired DE1439623C3 (de) 1963-03-21 1963-03-21 Mehrfachtransistor

Country Status (3)

Country Link
US (1) US3400311A (https=)
DE (1) DE1439623C3 (https=)
GB (1) GB1054513A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594619A (en) * 1967-09-30 1971-07-20 Nippon Electric Co Face-bonded semiconductor device having improved heat dissipation
FR1563879A (https=) * 1968-02-09 1969-04-18
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
DE2154654C3 (de) * 1971-11-03 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Spannungsteilerschaltungsanordnung und Verfahren zu deren Herstellung
JPS4958766A (https=) * 1972-10-04 1974-06-07
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
US6291878B1 (en) * 1993-04-22 2001-09-18 Sundstrand Corporation Package for multiple high power electrical components

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE519804A (https=) * 1952-05-09
US2751545A (en) * 1953-03-10 1956-06-19 Bell Telephone Labor Inc Transistor circuits
US2816964A (en) * 1954-10-27 1957-12-17 Rca Corp Stabilizing means for semi-conductor circuits
US3231794A (en) * 1961-06-05 1966-01-25 Int Rectifier Corp Thermal coupling of parallel connected semiconductor elements
US3226603A (en) * 1961-06-05 1965-12-28 Int Rectifier Corp High current rectifier employing a plurality of wafers having respective fuse elements
US3264531A (en) * 1962-03-29 1966-08-02 Jr Donald C Dickson Rectifier assembly comprising series stacked pn-junction rectifiers

Also Published As

Publication number Publication date
US3400311A (en) 1968-09-03
GB1054513A (https=) 1900-01-01
DE1439623B2 (de) 1973-06-07
DE1439623A1 (de) 1968-11-28

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
C3 Grant after two publication steps (3rd publication)
EHJ Ceased/non-payment of the annual fee