DE1255204B - Verfahren zur Herstellung von vakuumdichten Einschmelzungen in sockelfoermigen Sinterkoerpern fuer elektronische Bauelemente - Google Patents

Verfahren zur Herstellung von vakuumdichten Einschmelzungen in sockelfoermigen Sinterkoerpern fuer elektronische Bauelemente

Info

Publication number
DE1255204B
DE1255204B DEC27742A DEC0027742A DE1255204B DE 1255204 B DE1255204 B DE 1255204B DE C27742 A DEC27742 A DE C27742A DE C0027742 A DEC0027742 A DE C0027742A DE 1255204 B DE1255204 B DE 1255204B
Authority
DE
Germany
Prior art keywords
wire
punch
pressing
mold
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEC27742A
Other languages
German (de)
English (en)
Inventor
Lawrence John Gehl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US132335A external-priority patent/US3149375A/en
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of DE1255204B publication Critical patent/DE1255204B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
    • B30B11/34—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses for coating articles, e.g. tablets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49195—Assembling elongated conductors, e.g., splicing, etc. with end-to-end orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Wire Processing (AREA)
DEC27742A 1961-08-18 1962-08-18 Verfahren zur Herstellung von vakuumdichten Einschmelzungen in sockelfoermigen Sinterkoerpern fuer elektronische Bauelemente Pending DE1255204B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US132335A US3149375A (en) 1961-08-18 1961-08-18 Apparatus and method for molding cup-shaped bodies
US326317A US3259974A (en) 1961-08-18 1963-11-06 Method for molding cup-shaped bodies

Publications (1)

Publication Number Publication Date
DE1255204B true DE1255204B (de) 1967-11-30

Family

ID=26830274

Family Applications (1)

Application Number Title Priority Date Filing Date
DEC27742A Pending DE1255204B (de) 1961-08-18 1962-08-18 Verfahren zur Herstellung von vakuumdichten Einschmelzungen in sockelfoermigen Sinterkoerpern fuer elektronische Bauelemente

Country Status (4)

Country Link
US (1) US3259974A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE1255204B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1007182A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (2) NL281748A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389461A (en) * 1965-04-08 1968-06-25 Ibm Molded insulator base having embedded terminals and method of forming the same
US3444618A (en) * 1965-09-23 1969-05-20 Whirlpool Co Method of forming electrical elements
CN111332055B (zh) * 2020-03-23 2024-08-06 浙江哈尔斯真空器皿股份有限公司 杯或壶的薄壁金属外壳表面连续图案的压制模具

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1648721A (en) * 1925-01-20 1927-11-08 Bound Brook Oil Less Bearing Method of and machine for forming bodies by pressure
US1813576A (en) * 1928-04-24 1931-07-07 Kattwinkel Hans Manufacture of friction bodies for brake and clutch purposes
US1922527A (en) * 1928-03-03 1933-08-15 American Crayon Co Apparatus for molding pencils and the like
US2166205A (en) * 1937-05-29 1939-07-18 Rca Corp Fixed capacitor
GB530275A (en) * 1938-06-20 1940-12-09 Egyesuelt Izzolampa Method of and apparatus for the production, by pressure moulding, of glass bodies provided with current leads
FR1129497A (fr) * 1954-03-27 1957-01-22 Philips Nv Procédé de fabrication d'objets en une matière à mouler thermodurcissable
US2821748A (en) * 1953-05-08 1958-02-04 Baldwin Lima Hamilton Corp Apparatus for compacting and ejecting flanged articles by single plunger action
DE1085262B (de) * 1957-04-24 1960-07-14 Philco Corp Verfahren zur Herstellung von mit vakuumdichten Einschmelzungen versehenen Sinterkoerpern, die als Sockel fuer elektrische Anordnungen, insbesondere Halbleiteranordnungen dienen
US3009578A (en) * 1958-04-15 1961-11-21 Gulf Research Development Co Pre-stressed reinforced ion-exchange membrane and method of making same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2276380A (en) * 1937-12-24 1942-03-17 Du Pont Electric blasting initiator
US2256769A (en) * 1938-10-10 1941-09-23 Imp Molded Products Corp Method and apparatus for molding plastic objects
US2758183A (en) * 1952-03-05 1956-08-07 Seci Process for making electric resistors and electric resistors made with that process

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1648721A (en) * 1925-01-20 1927-11-08 Bound Brook Oil Less Bearing Method of and machine for forming bodies by pressure
US1922527A (en) * 1928-03-03 1933-08-15 American Crayon Co Apparatus for molding pencils and the like
US1813576A (en) * 1928-04-24 1931-07-07 Kattwinkel Hans Manufacture of friction bodies for brake and clutch purposes
US2166205A (en) * 1937-05-29 1939-07-18 Rca Corp Fixed capacitor
GB530275A (en) * 1938-06-20 1940-12-09 Egyesuelt Izzolampa Method of and apparatus for the production, by pressure moulding, of glass bodies provided with current leads
US2821748A (en) * 1953-05-08 1958-02-04 Baldwin Lima Hamilton Corp Apparatus for compacting and ejecting flanged articles by single plunger action
FR1129497A (fr) * 1954-03-27 1957-01-22 Philips Nv Procédé de fabrication d'objets en une matière à mouler thermodurcissable
DE1085262B (de) * 1957-04-24 1960-07-14 Philco Corp Verfahren zur Herstellung von mit vakuumdichten Einschmelzungen versehenen Sinterkoerpern, die als Sockel fuer elektrische Anordnungen, insbesondere Halbleiteranordnungen dienen
US3009578A (en) * 1958-04-15 1961-11-21 Gulf Research Development Co Pre-stressed reinforced ion-exchange membrane and method of making same

Also Published As

Publication number Publication date
GB1007182A (en) 1965-10-13
NL281748A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL122783C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US3259974A (en) 1966-07-12

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