DE1170554B - Verfahren zum Einbau eines Transistors oder einer Halbleiterdiode in eine Glashuelle - Google Patents

Verfahren zum Einbau eines Transistors oder einer Halbleiterdiode in eine Glashuelle

Info

Publication number
DE1170554B
DE1170554B DEN12901A DEN0012901A DE1170554B DE 1170554 B DE1170554 B DE 1170554B DE N12901 A DEN12901 A DE N12901A DE N0012901 A DEN0012901 A DE N0012901A DE 1170554 B DE1170554 B DE 1170554B
Authority
DE
Germany
Prior art keywords
glass envelope
thickening
transistor
installing
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEN12901A
Other languages
German (de)
English (en)
Inventor
Norman John Chaplin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1170554B publication Critical patent/DE1170554B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • H01J5/40—End-disc seals, e.g. flat header
    • H01J5/42—End-disc seals, e.g. flat header using intermediate part
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0034—Lamp bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DEN12901A 1955-11-05 1956-11-02 Verfahren zum Einbau eines Transistors oder einer Halbleiterdiode in eine Glashuelle Pending DE1170554B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE426887 1955-11-05

Publications (1)

Publication Number Publication Date
DE1170554B true DE1170554B (de) 1964-05-21

Family

ID=3844296

Family Applications (1)

Application Number Title Priority Date Filing Date
DEN12901A Pending DE1170554B (de) 1955-11-05 1956-11-02 Verfahren zum Einbau eines Transistors oder einer Halbleiterdiode in eine Glashuelle

Country Status (4)

Country Link
BE (1) BE542616A (enrdf_load_stackoverflow)
DE (1) DE1170554B (enrdf_load_stackoverflow)
GB (1) GB810361A (enrdf_load_stackoverflow)
NL (2) NL105004C (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB696904A (en) * 1950-05-08 1953-09-09 British Thomson Houston Co Ltd Improvements relating to crystal valves

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB696904A (en) * 1950-05-08 1953-09-09 British Thomson Houston Co Ltd Improvements relating to crystal valves

Also Published As

Publication number Publication date
GB810361A (en) 1959-03-11
NL211911A (enrdf_load_stackoverflow)
NL105004C (enrdf_load_stackoverflow) 1963-01-15
BE542616A (enrdf_load_stackoverflow) 1955-11-30

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