GB810361A - Improvements in or relating to semi-conductor devices - Google Patents

Improvements in or relating to semi-conductor devices

Info

Publication number
GB810361A
GB810361A GB3351956A GB3351956A GB810361A GB 810361 A GB810361 A GB 810361A GB 3351956 A GB3351956 A GB 3351956A GB 3351956 A GB3351956 A GB 3351956A GB 810361 A GB810361 A GB 810361A
Authority
GB
United Kingdom
Prior art keywords
semi
relating
conductor devices
nov
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3351956A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB810361A publication Critical patent/GB810361A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • H01J5/40—End-disc seals, e.g. flat header
    • H01J5/42—End-disc seals, e.g. flat header using intermediate part
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0034—Lamp bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

810,361. Sealed envelopes for semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. Nov. 2, 1956 [Nov. 5, 1955], No. 33519/56. Class 37. A semi-conductor device is sealed in a cylindrical glass envelope by providing the supply wires with metal flanges equal in diameter to the internal diameter of the envelope. These leads are also provided with notches near the flanges so that they may be broken off at a suitable point after the sealing has been accomplished.
GB3351956A 1955-11-05 1956-11-02 Improvements in or relating to semi-conductor devices Expired GB810361A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE426887 1955-11-05

Publications (1)

Publication Number Publication Date
GB810361A true GB810361A (en) 1959-03-11

Family

ID=3844296

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3351956A Expired GB810361A (en) 1955-11-05 1956-11-02 Improvements in or relating to semi-conductor devices

Country Status (4)

Country Link
BE (1) BE542616A (en)
DE (1) DE1170554B (en)
GB (1) GB810361A (en)
NL (2) NL105004C (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL79631C (en) * 1950-05-08

Also Published As

Publication number Publication date
DE1170554B (en) 1964-05-21
NL105004C (en) 1963-01-15
NL211911A (en)
BE542616A (en) 1955-11-30

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