Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLCfiledCriticalGeneral Electric Co PLC
Priority to ES223978ApriorityCriticalpatent/ES223978A1/en
Publication of ES223978A1publicationCriticalpatent/ES223978A1/en
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Abstract
Improvements in the manufacture of semiconductor devices or method for the manufacture of a semiconductor device provided with a hermetically sealed envelope, characterized in that at least one of the closures made in the envelope after the operation part of the device is mounted thereon, is carried out by means of cold pressure welding. (Machine-translation by Google Translate, not legally binding)
ES223978A1955-09-141955-09-14Improvements in the manufacture of semiconductor devices (Machine-translation by Google Translate, not legally binding)
ExpiredES223978A1
(en)