DE112023005086T5 - Al-Legierungs-Bonddraht - Google Patents
Al-Legierungs-BonddrahtInfo
- Publication number
- DE112023005086T5 DE112023005086T5 DE112023005086.4T DE112023005086T DE112023005086T5 DE 112023005086 T5 DE112023005086 T5 DE 112023005086T5 DE 112023005086 T DE112023005086 T DE 112023005086T DE 112023005086 T5 DE112023005086 T5 DE 112023005086T5
- Authority
- DE
- Germany
- Prior art keywords
- wire
- phase
- equal
- section
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/026—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
- G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Die Bonding (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022194009 | 2022-12-05 | ||
| JP2022-194009 | 2022-12-05 | ||
| PCT/JP2023/024324 WO2024122089A1 (ja) | 2022-12-05 | 2023-06-30 | Ａｌ合金ボンディングワイヤ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112023005086T5 true DE112023005086T5 (de) | 2025-10-23 |
Family
ID=91379118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112023005086.4T Pending DE112023005086T5 (de) | 2022-12-05 | 2023-06-30 | Al-Legierungs-Bonddraht |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20250379177A1 (https=) |
| EP (4) | EP4534709A4 (https=) |
| JP (6) | JP7518305B1 (https=) |
| KR (4) | KR20250114537A (https=) |
| CN (4) | CN118660981A (https=) |
| DE (1) | DE112023005086T5 (https=) |
| TW (4) | TW202432852A (https=) |
| WO (8) | WO2024122089A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7600474B1 (ja) * | 2022-12-05 | 2024-12-16 | 日鉄ケミカル＆マテリアル株式会社 | Ａｌ接続材 |
| JP7600475B1 (ja) * | 2022-12-05 | 2024-12-16 | 日鉄ケミカル＆マテリアル株式会社 | Ａｌ接続材 |
| DE112023005086T5 (de) * | 2022-12-05 | 2025-10-23 | Nippon Micrometal Corporation | Al-Legierungs-Bonddraht |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928553A (ja) * | 1982-08-11 | 1984-02-15 | Hitachi Ltd | 耐食性アルミニウム配線材料 |
| JPS5957440A (ja) | 1982-09-27 | 1984-04-03 | Tanaka Kikinzoku Kogyo Kk | 半導体素子用ボンデイング素線の製造方法 |
| JPS5967642A (ja) * | 1982-10-12 | 1984-04-17 | Hitachi Ltd | 半導体装置 |
| JPS59139661A (ja) * | 1983-01-31 | 1984-08-10 | Hitachi Ltd | 半導体装置 |
| JP2766933B2 (ja) * | 1989-06-29 | 1998-06-18 | 株式会社日立製作所 | 電子装置 |
| MY137479A (en) * | 2000-09-18 | 2009-01-30 | Nippon Steel Corp | Bonding wire for semiconductor device and method for producing the same |
| JP4633972B2 (ja) * | 2001-07-17 | 2011-02-16 | 住友電気工業株式会社 | 耐摩耗性アルミニウム合金長尺体およびその製造方法ならびにカーエアコンディショナ用ピストン |
| DE102004043020B3 (de) * | 2004-09-06 | 2006-04-27 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Bonddraht und Bondverbindung |
| JP6272674B2 (ja) | 2012-11-30 | 2018-01-31 | 日本ピストンリング株式会社 | ボンディングワイヤ、接続部構造、並びに半導体装置およびその製造方法 |
| JP5281191B1 (ja) | 2012-12-28 | 2013-09-04 | 田中電子工業株式会社 | パワ−半導体装置用アルミニウム合金細線 |
| CN105331856B (zh) * | 2015-12-04 | 2018-05-22 | 江苏亨通电力特种导线有限公司 | 一种微合金化的Al-Si合金及其铝合金杆的制备方法 |
| WO2019031498A1 (ja) * | 2017-08-09 | 2019-02-14 | 日鉄ケミカル＆マテリアル株式会社 | 半導体装置用Ｃｕ合金ボンディングワイヤ |
| US10790259B2 (en) * | 2017-08-09 | 2020-09-29 | Nippon Steel Chemical & Material Co., Ltd. | Cu alloy bonding wire for semiconductor device |
| KR102801396B1 (ko) * | 2019-03-13 | 2025-04-30 | 닛데쓰마이크로메탈가부시키가이샤 | Al 본딩 와이어 |
| JP2020150116A (ja) | 2019-03-13 | 2020-09-17 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| CA3138936A1 (en) * | 2019-05-19 | 2020-11-26 | Novelis Inc. | Aluminum alloys for fluxless brazing applications, methods of making the same, and uses thereof |
| CN110205511A (zh) | 2019-06-28 | 2019-09-06 | 江西理工大学 | 一种高强Al-Si合金焊丝及其制备方法 |
| CN110656263A (zh) * | 2019-11-06 | 2020-01-07 | 中国科学院金属研究所 | 含微量La元素的高性能Al-Si系焊丝合金及其制备方法 |
| JP7784390B2 (ja) * | 2021-02-05 | 2025-12-11 | 日鉄マイクロメタル株式会社 | 半導体装置用Ａｌボンディングワイヤ |
| DE112023005086T5 (de) * | 2022-12-05 | 2025-10-23 | Nippon Micrometal Corporation | Al-Legierungs-Bonddraht |
-
2023
- 2023-06-30 DE DE112023005086.4T patent/DE112023005086T5/de active Pending
- 2023-06-30 KR KR1020257021796A patent/KR20250114537A/ko active Pending
- 2023-06-30 JP JP2023579485A patent/JP7518305B1/ja active Active
- 2023-06-30 EP EP23900220.7A patent/EP4534709A4/en active Pending
- 2023-06-30 WO PCT/JP2023/024324 patent/WO2024122089A1/ja not_active Ceased
- 2023-06-30 US US18/874,698 patent/US20250379177A1/en active Pending
- 2023-06-30 CN CN202380020896.7A patent/CN118660981A/zh active Pending
- 2023-11-27 WO PCT/JP2023/042366 patent/WO2024122380A1/ja not_active Ceased
- 2023-11-27 KR KR1020257021989A patent/KR20250116123A/ko active Pending
- 2023-11-27 EP EP23900500.2A patent/EP4632092A1/en active Pending
- 2023-11-27 WO PCT/JP2023/042369 patent/WO2024122381A1/ja not_active Ceased
- 2023-11-27 EP EP23900498.9A patent/EP4632090A1/en active Pending
- 2023-11-27 CN CN202380083564.3A patent/CN120303422A/zh active Pending
- 2023-11-27 EP EP23900499.7A patent/EP4632091A1/en active Pending
- 2023-11-27 JP JP2024536442A patent/JP7833550B2/ja active Active
- 2023-11-27 CN CN202380083554.XA patent/CN120435577A/zh active Pending
- 2023-11-27 KR KR1020257021779A patent/KR20250114535A/ko active Pending
- 2023-11-27 JP JP2024536441A patent/JP7626906B2/ja active Active
- 2023-11-27 JP JP2024536440A patent/JP7626905B2/ja active Active
- 2023-11-27 WO PCT/JP2023/042373 patent/WO2024122383A1/ja not_active Ceased
- 2023-11-27 KR KR1020257021793A patent/KR20250114536A/ko active Pending
- 2023-11-27 WO PCT/JP2023/042371 patent/WO2024122382A1/ja not_active Ceased
- 2023-11-27 WO PCT/JP2023/042374 patent/WO2024122384A1/ja not_active Ceased
- 2023-11-27 CN CN202380083569.6A patent/CN120303423A/zh active Pending
- 2023-12-01 TW TW112146769A patent/TW202432852A/zh unknown
- 2023-12-01 TW TW112146772A patent/TW202503076A/zh unknown
- 2023-12-01 TW TW112146768A patent/TW202430658A/zh unknown
- 2023-12-01 TW TW112146773A patent/TW202432853A/zh unknown
-
2024
- 2024-06-04 WO PCT/JP2024/020313 patent/WO2025115257A1/ja active Pending
- 2024-06-04 WO PCT/JP2024/020314 patent/WO2025115258A1/ja active Pending
- 2024-07-04 JP JP2024107900A patent/JP2024138348A/ja active Pending
-
2025
- 2025-04-16 JP JP2025067311A patent/JP2025108597A/ja active Pending
Also Published As
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed |