KR20250114537A - Al 합금 본딩 와이어 - Google Patents

Al 합금 본딩 와이어

Info

Publication number
KR20250114537A
KR20250114537A KR1020257021796A KR20257021796A KR20250114537A KR 20250114537 A KR20250114537 A KR 20250114537A KR 1020257021796 A KR1020257021796 A KR 1020257021796A KR 20257021796 A KR20257021796 A KR 20257021796A KR 20250114537 A KR20250114537 A KR 20250114537A
Authority
KR
South Korea
Prior art keywords
wire
phase
less
cross
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257021796A
Other languages
English (en)
Korean (ko)
Inventor
데츠야 오야마다
도모히로 우노
다이조 오다
모토키 에토
유야 스토
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
닛데쓰마이크로메탈가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤, 닛데쓰마이크로메탈가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20250114537A publication Critical patent/KR20250114537A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/026—Alloys based on aluminium
    • H01L24/45—
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • H01L24/48—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
    • H01L2224/45124—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
  • Manufacturing & Machinery (AREA)
KR1020257021796A 2022-12-05 2023-06-30 Al 합금 본딩 와이어 Pending KR20250114537A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-194009 2022-12-05
JP2022194009 2022-12-05
PCT/JP2023/024324 WO2024122089A1 (ja) 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ

Publications (1)

Publication Number Publication Date
KR20250114537A true KR20250114537A (ko) 2025-07-29

Family

ID=91379118

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020257021796A Pending KR20250114537A (ko) 2022-12-05 2023-06-30 Al 합금 본딩 와이어
KR1020257021989A Pending KR20250116123A (ko) 2022-12-05 2023-11-27 Al 접속재
KR1020257021779A Pending KR20250114535A (ko) 2022-12-05 2023-11-27 Al 접속재
KR1020257021793A Pending KR20250114536A (ko) 2022-12-05 2023-11-27 Al 접속재

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020257021989A Pending KR20250116123A (ko) 2022-12-05 2023-11-27 Al 접속재
KR1020257021779A Pending KR20250114535A (ko) 2022-12-05 2023-11-27 Al 접속재
KR1020257021793A Pending KR20250114536A (ko) 2022-12-05 2023-11-27 Al 접속재

Country Status (8)

Country Link
US (1) US20250379177A1 (https=)
EP (4) EP4534709A4 (https=)
JP (6) JP7518305B1 (https=)
KR (4) KR20250114537A (https=)
CN (4) CN118660981A (https=)
DE (1) DE112023005086T5 (https=)
TW (4) TW202432852A (https=)
WO (8) WO2024122089A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7600474B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
JP7600475B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957440A (ja) 1982-09-27 1984-04-03 Tanaka Kikinzoku Kogyo Kk 半導体素子用ボンデイング素線の製造方法
JP2014131010A (ja) 2012-11-30 2014-07-10 Nippon Piston Ring Co Ltd ボンディングワイヤ、接続部構造、並びに半導体装置およびその製造方法
JP2014129578A (ja) 2012-12-28 2014-07-10 Tanaka Electronics Ind Co Ltd パワ−半導体装置用アルミニウム合金細線

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928553A (ja) * 1982-08-11 1984-02-15 Hitachi Ltd 耐食性アルミニウム配線材料
JPS5967642A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 半導体装置
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置
JP2766933B2 (ja) * 1989-06-29 1998-06-18 株式会社日立製作所 電子装置
MY137479A (en) * 2000-09-18 2009-01-30 Nippon Steel Corp Bonding wire for semiconductor device and method for producing the same
JP4633972B2 (ja) * 2001-07-17 2011-02-16 住友電気工業株式会社 耐摩耗性アルミニウム合金長尺体およびその製造方法ならびにカーエアコンディショナ用ピストン
DE102004043020B3 (de) * 2004-09-06 2006-04-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Bonddraht und Bondverbindung
CN105331856B (zh) * 2015-12-04 2018-05-22 江苏亨通电力特种导线有限公司 一种微合金化的Al-Si合金及其铝合金杆的制备方法
WO2019031498A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
US10790259B2 (en) * 2017-08-09 2020-09-29 Nippon Steel Chemical & Material Co., Ltd. Cu alloy bonding wire for semiconductor device
KR102801396B1 (ko) * 2019-03-13 2025-04-30 닛데쓰마이크로메탈가부시키가이샤 Al 본딩 와이어
JP2020150116A (ja) 2019-03-13 2020-09-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CA3138936A1 (en) * 2019-05-19 2020-11-26 Novelis Inc. Aluminum alloys for fluxless brazing applications, methods of making the same, and uses thereof
CN110205511A (zh) 2019-06-28 2019-09-06 江西理工大学 一种高强Al-Si合金焊丝及其制备方法
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法
JP7784390B2 (ja) * 2021-02-05 2025-12-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957440A (ja) 1982-09-27 1984-04-03 Tanaka Kikinzoku Kogyo Kk 半導体素子用ボンデイング素線の製造方法
JP2014131010A (ja) 2012-11-30 2014-07-10 Nippon Piston Ring Co Ltd ボンディングワイヤ、接続部構造、並びに半導体装置およびその製造方法
JP2014129578A (ja) 2012-12-28 2014-07-10 Tanaka Electronics Ind Co Ltd パワ−半導体装置用アルミニウム合金細線

Also Published As

Publication number Publication date
JP7518305B1 (ja) 2024-07-17
WO2024122380A1 (ja) 2024-06-13
JP7626905B2 (ja) 2025-02-04
JP7626906B2 (ja) 2025-02-04
KR20250114536A (ko) 2025-07-29
WO2024122381A1 (ja) 2024-06-13
CN118660981A (zh) 2024-09-17
JPWO2024122383A1 (https=) 2024-06-13
JP7833550B2 (ja) 2026-03-19
JPWO2024122382A1 (https=) 2024-06-13
TW202432853A (zh) 2024-08-16
WO2024122384A1 (ja) 2024-06-13
EP4534709A4 (en) 2025-07-23
EP4534709A1 (en) 2025-04-09
EP4632092A1 (en) 2025-10-15
WO2025115258A1 (ja) 2025-06-05
TW202438688A (zh) 2024-10-01
KR20250116123A (ko) 2025-07-31
JP2025108597A (ja) 2025-07-23
CN120303422A (zh) 2025-07-11
TW202430658A (zh) 2024-08-01
US20250379177A1 (en) 2025-12-11
CN120303423A (zh) 2025-07-11
WO2024122089A1 (ja) 2024-06-13
TW202503076A (zh) 2025-01-16
JP2024138348A (ja) 2024-10-08
WO2025115257A1 (ja) 2025-06-05
KR20250114535A (ko) 2025-07-29
EP4632091A1 (en) 2025-10-15
CN120435577A (zh) 2025-08-05
WO2024122382A1 (ja) 2024-06-13
JPWO2024122089A1 (https=) 2024-06-13
TW202432852A (zh) 2024-08-16
DE112023005086T5 (de) 2025-10-23
WO2024122383A1 (ja) 2024-06-13
TW202438687A (zh) 2024-10-01
JPWO2024122381A1 (https=) 2024-06-13
EP4632090A1 (en) 2025-10-15

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PA0105 International application

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