JPWO2024122382A1 - - Google Patents

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Publication number
JPWO2024122382A1
JPWO2024122382A1 JP2024536442A JP2024536442A JPWO2024122382A1 JP WO2024122382 A1 JPWO2024122382 A1 JP WO2024122382A1 JP 2024536442 A JP2024536442 A JP 2024536442A JP 2024536442 A JP2024536442 A JP 2024536442A JP WO2024122382 A1 JPWO2024122382 A1 JP WO2024122382A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024536442A
Other languages
Japanese (ja)
Other versions
JP7833550B2 (ja
JPWO2024122382A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024122382A1 publication Critical patent/JPWO2024122382A1/ja
Publication of JPWO2024122382A5 publication Critical patent/JPWO2024122382A5/ja
Priority to JP2025067311A priority Critical patent/JP2025108597A/ja
Application granted granted Critical
Publication of JP7833550B2 publication Critical patent/JP7833550B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/026—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2024536442A 2022-12-05 2023-11-27 Ａｌ接続材 Active JP7833550B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025067311A JP2025108597A (ja) 2022-12-05 2025-04-16 Ａｌ接続材

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022194009 2022-12-05
JP2022194009 2022-12-05
PCT/JP2023/024324 WO2024122089A1 (ja) 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ
JPPCT/JP2023/024324 2023-06-30
PCT/JP2023/042371 WO2024122382A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025067311A Division JP2025108597A (ja) 2022-12-05 2025-04-16 Ａｌ接続材

Publications (3)

Publication Number Publication Date
JPWO2024122382A1 true JPWO2024122382A1 (https=) 2024-06-13
JPWO2024122382A5 JPWO2024122382A5 (https=) 2024-11-06
JP7833550B2 JP7833550B2 (ja) 2026-03-19

Family

ID=91379118

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2023579485A Active JP7518305B1 (ja) 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ
JP2024536442A Active JP7833550B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536441A Active JP7626906B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536440A Active JP7626905B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024107900A Pending JP2024138348A (ja) 2022-12-05 2024-07-04 Ａｌ合金ボンディングワイヤ
JP2025067311A Pending JP2025108597A (ja) 2022-12-05 2025-04-16 Ａｌ接続材

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2023579485A Active JP7518305B1 (ja) 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2024536441A Active JP7626906B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536440A Active JP7626905B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024107900A Pending JP2024138348A (ja) 2022-12-05 2024-07-04 Ａｌ合金ボンディングワイヤ
JP2025067311A Pending JP2025108597A (ja) 2022-12-05 2025-04-16 Ａｌ接続材

Country Status (8)

Country Link
US (1) US20250379177A1 (https=)
EP (4) EP4534709A4 (https=)
JP (6) JP7518305B1 (https=)
KR (4) KR20250114537A (https=)
CN (4) CN118660981A (https=)
DE (1) DE112023005086T5 (https=)
TW (4) TW202432852A (https=)
WO (8) WO2024122089A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7600474B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
JP7600475B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置
CN105331856A (zh) * 2015-12-04 2016-02-17 江苏亨通电力特种导线有限公司 一种微合金化的Al-Si合金及其铝合金杆的制备方法
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法
WO2020184655A1 (ja) * 2019-03-13 2020-09-17 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
JP2022533827A (ja) * 2019-05-19 2022-07-26 ノベリス・インコーポレイテッド フラックスレスろう付け用途向けのアルミニウム合金、その製造方法、及びその使用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928553A (ja) * 1982-08-11 1984-02-15 Hitachi Ltd 耐食性アルミニウム配線材料
JPS5957440A (ja) 1982-09-27 1984-04-03 Tanaka Kikinzoku Kogyo Kk 半導体素子用ボンデイング素線の製造方法
JPS5967642A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 半導体装置
JP2766933B2 (ja) * 1989-06-29 1998-06-18 株式会社日立製作所 電子装置
MY137479A (en) * 2000-09-18 2009-01-30 Nippon Steel Corp Bonding wire for semiconductor device and method for producing the same
JP4633972B2 (ja) * 2001-07-17 2011-02-16 住友電気工業株式会社 耐摩耗性アルミニウム合金長尺体およびその製造方法ならびにカーエアコンディショナ用ピストン
DE102004043020B3 (de) * 2004-09-06 2006-04-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Bonddraht und Bondverbindung
JP6272674B2 (ja) 2012-11-30 2018-01-31 日本ピストンリング株式会社 ボンディングワイヤ、接続部構造、並びに半導体装置およびその製造方法
JP5281191B1 (ja) 2012-12-28 2013-09-04 田中電子工業株式会社 パワ−半導体装置用アルミニウム合金細線
WO2019031498A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
US10790259B2 (en) * 2017-08-09 2020-09-29 Nippon Steel Chemical & Material Co., Ltd. Cu alloy bonding wire for semiconductor device
JP2020150116A (ja) 2019-03-13 2020-09-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN110205511A (zh) 2019-06-28 2019-09-06 江西理工大学 一种高强Al-Si合金焊丝及其制备方法
JP7784390B2 (ja) * 2021-02-05 2025-12-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置
CN105331856A (zh) * 2015-12-04 2016-02-17 江苏亨通电力特种导线有限公司 一种微合金化的Al-Si合金及其铝合金杆的制备方法
WO2020184655A1 (ja) * 2019-03-13 2020-09-17 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
JP2022533827A (ja) * 2019-05-19 2022-07-26 ノベリス・インコーポレイテッド フラックスレスろう付け用途向けのアルミニウム合金、その製造方法、及びその使用
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法

Also Published As

Publication number Publication date
JP7518305B1 (ja) 2024-07-17
WO2024122380A1 (ja) 2024-06-13
JP7626905B2 (ja) 2025-02-04
JP7626906B2 (ja) 2025-02-04
KR20250114536A (ko) 2025-07-29
WO2024122381A1 (ja) 2024-06-13
CN118660981A (zh) 2024-09-17
JPWO2024122383A1 (https=) 2024-06-13
JP7833550B2 (ja) 2026-03-19
KR20250114537A (ko) 2025-07-29
TW202432853A (zh) 2024-08-16
WO2024122384A1 (ja) 2024-06-13
EP4534709A4 (en) 2025-07-23
EP4534709A1 (en) 2025-04-09
EP4632092A1 (en) 2025-10-15
WO2025115258A1 (ja) 2025-06-05
TW202438688A (zh) 2024-10-01
KR20250116123A (ko) 2025-07-31
JP2025108597A (ja) 2025-07-23
CN120303422A (zh) 2025-07-11
TW202430658A (zh) 2024-08-01
US20250379177A1 (en) 2025-12-11
CN120303423A (zh) 2025-07-11
WO2024122089A1 (ja) 2024-06-13
TW202503076A (zh) 2025-01-16
JP2024138348A (ja) 2024-10-08
WO2025115257A1 (ja) 2025-06-05
KR20250114535A (ko) 2025-07-29
EP4632091A1 (en) 2025-10-15
CN120435577A (zh) 2025-08-05
WO2024122382A1 (ja) 2024-06-13
JPWO2024122089A1 (https=) 2024-06-13
TW202432852A (zh) 2024-08-16
DE112023005086T5 (de) 2025-10-23
WO2024122383A1 (ja) 2024-06-13
TW202438687A (zh) 2024-10-01
JPWO2024122381A1 (https=) 2024-06-13
EP4632090A1 (en) 2025-10-15

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