JP7518305B1 - Ａｌ合金ボンディングワイヤ - Google Patents

Ａｌ合金ボンディングワイヤ Download PDF

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Publication number
JP7518305B1
JP7518305B1 JP2023579485A JP2023579485A JP7518305B1 JP 7518305 B1 JP7518305 B1 JP 7518305B1 JP 2023579485 A JP2023579485 A JP 2023579485A JP 2023579485 A JP2023579485 A JP 2023579485A JP 7518305 B1 JP7518305 B1 JP 7518305B1
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JP
Japan
Prior art keywords
wire
phase
section
central axis
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023579485A
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English (en)
Japanese (ja)
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JPWO2024122089A5 (https=
JPWO2024122089A1 (https=
Inventor
哲哉 小山田
智裕 宇野
大造 小田
基稀 江藤
裕弥 須藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micrometal Corp, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Micrometal Corp
Publication of JPWO2024122089A1 publication Critical patent/JPWO2024122089A1/ja
Priority to JP2024107900A priority Critical patent/JP2024138348A/ja
Application granted granted Critical
Publication of JP7518305B1 publication Critical patent/JP7518305B1/ja
Publication of JPWO2024122089A5 publication Critical patent/JPWO2024122089A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/026—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2023579485A 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ Active JP7518305B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024107900A JP2024138348A (ja) 2022-12-05 2024-07-04 Ａｌ合金ボンディングワイヤ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022194009 2022-12-05
JP2022194009 2022-12-05
PCT/JP2023/024324 WO2024122089A1 (ja) 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024107900A Division JP2024138348A (ja) 2022-12-05 2024-07-04 Ａｌ合金ボンディングワイヤ

Publications (3)

Publication Number Publication Date
JPWO2024122089A1 JPWO2024122089A1 (https=) 2024-06-13
JP7518305B1 true JP7518305B1 (ja) 2024-07-17
JPWO2024122089A5 JPWO2024122089A5 (https=) 2024-11-06

Family

ID=91379118

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2023579485A Active JP7518305B1 (ja) 2022-12-05 2023-06-30 Ａｌ合金ボンディングワイヤ
JP2024536442A Active JP7833550B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536441A Active JP7626906B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536440A Active JP7626905B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024107900A Pending JP2024138348A (ja) 2022-12-05 2024-07-04 Ａｌ合金ボンディングワイヤ
JP2025067311A Pending JP2025108597A (ja) 2022-12-05 2025-04-16 Ａｌ接続材

Family Applications After (5)

Application Number Title Priority Date Filing Date
JP2024536442A Active JP7833550B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536441A Active JP7626906B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024536440A Active JP7626905B2 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JP2024107900A Pending JP2024138348A (ja) 2022-12-05 2024-07-04 Ａｌ合金ボンディングワイヤ
JP2025067311A Pending JP2025108597A (ja) 2022-12-05 2025-04-16 Ａｌ接続材

Country Status (8)

Country Link
US (1) US20250379177A1 (https=)
EP (4) EP4534709A4 (https=)
JP (6) JP7518305B1 (https=)
KR (4) KR20250114537A (https=)
CN (4) CN118660981A (https=)
DE (1) DE112023005086T5 (https=)
TW (4) TW202432852A (https=)
WO (8) WO2024122089A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7600474B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
JP7600475B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967642A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 半導体装置
JPH0332033A (ja) * 1989-06-29 1991-02-12 Hitachi Ltd 電子装置
JP2003027171A (ja) * 2001-07-17 2003-01-29 Sumitomo Electric Ind Ltd 耐摩耗性アルミニウム合金長尺体およびその製造方法ならびにカーエアコンディショナ用ピストン
JP2006080518A (ja) * 2004-09-06 2006-03-23 Eupec Europaische Ges Fuer Leistungshalbleiter Mbh ボンディングワイヤおよびボンディング接続構造
JP2013140986A (ja) * 2000-09-18 2013-07-18 Nippon Steel Sumikin Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928553A (ja) * 1982-08-11 1984-02-15 Hitachi Ltd 耐食性アルミニウム配線材料
JPS5957440A (ja) 1982-09-27 1984-04-03 Tanaka Kikinzoku Kogyo Kk 半導体素子用ボンデイング素線の製造方法
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置
JP6272674B2 (ja) 2012-11-30 2018-01-31 日本ピストンリング株式会社 ボンディングワイヤ、接続部構造、並びに半導体装置およびその製造方法
JP5281191B1 (ja) 2012-12-28 2013-09-04 田中電子工業株式会社 パワ−半導体装置用アルミニウム合金細線
CN105331856B (zh) * 2015-12-04 2018-05-22 江苏亨通电力特种导线有限公司 一种微合金化的Al-Si合金及其铝合金杆的制备方法
WO2019031498A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
US10790259B2 (en) * 2017-08-09 2020-09-29 Nippon Steel Chemical & Material Co., Ltd. Cu alloy bonding wire for semiconductor device
KR102801396B1 (ko) * 2019-03-13 2025-04-30 닛데쓰마이크로메탈가부시키가이샤 Al 본딩 와이어
JP2020150116A (ja) 2019-03-13 2020-09-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CA3138936A1 (en) * 2019-05-19 2020-11-26 Novelis Inc. Aluminum alloys for fluxless brazing applications, methods of making the same, and uses thereof
CN110205511A (zh) 2019-06-28 2019-09-06 江西理工大学 一种高强Al-Si合金焊丝及其制备方法
JP7784390B2 (ja) * 2021-02-05 2025-12-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967642A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 半導体装置
JPH0332033A (ja) * 1989-06-29 1991-02-12 Hitachi Ltd 電子装置
JP2013140986A (ja) * 2000-09-18 2013-07-18 Nippon Steel Sumikin Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
JP2003027171A (ja) * 2001-07-17 2003-01-29 Sumitomo Electric Ind Ltd 耐摩耗性アルミニウム合金長尺体およびその製造方法ならびにカーエアコンディショナ用ピストン
JP2006080518A (ja) * 2004-09-06 2006-03-23 Eupec Europaische Ges Fuer Leistungshalbleiter Mbh ボンディングワイヤおよびボンディング接続構造
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法

Also Published As

Publication number Publication date
WO2024122380A1 (ja) 2024-06-13
JP7626905B2 (ja) 2025-02-04
JP7626906B2 (ja) 2025-02-04
KR20250114536A (ko) 2025-07-29
WO2024122381A1 (ja) 2024-06-13
CN118660981A (zh) 2024-09-17
JPWO2024122383A1 (https=) 2024-06-13
JP7833550B2 (ja) 2026-03-19
KR20250114537A (ko) 2025-07-29
JPWO2024122382A1 (https=) 2024-06-13
TW202432853A (zh) 2024-08-16
WO2024122384A1 (ja) 2024-06-13
EP4534709A4 (en) 2025-07-23
EP4534709A1 (en) 2025-04-09
EP4632092A1 (en) 2025-10-15
WO2025115258A1 (ja) 2025-06-05
TW202438688A (zh) 2024-10-01
KR20250116123A (ko) 2025-07-31
JP2025108597A (ja) 2025-07-23
CN120303422A (zh) 2025-07-11
TW202430658A (zh) 2024-08-01
US20250379177A1 (en) 2025-12-11
CN120303423A (zh) 2025-07-11
WO2024122089A1 (ja) 2024-06-13
TW202503076A (zh) 2025-01-16
JP2024138348A (ja) 2024-10-08
WO2025115257A1 (ja) 2025-06-05
KR20250114535A (ko) 2025-07-29
EP4632091A1 (en) 2025-10-15
CN120435577A (zh) 2025-08-05
WO2024122382A1 (ja) 2024-06-13
JPWO2024122089A1 (https=) 2024-06-13
TW202432852A (zh) 2024-08-16
DE112023005086T5 (de) 2025-10-23
WO2024122383A1 (ja) 2024-06-13
TW202438687A (zh) 2024-10-01
JPWO2024122381A1 (https=) 2024-06-13
EP4632090A1 (en) 2025-10-15

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