DE112022005583T5 - Gedruckte Leiterplatte - Google Patents
Gedruckte Leiterplatte Download PDFInfo
- Publication number
- DE112022005583T5 DE112022005583T5 DE112022005583.9T DE112022005583T DE112022005583T5 DE 112022005583 T5 DE112022005583 T5 DE 112022005583T5 DE 112022005583 T DE112022005583 T DE 112022005583T DE 112022005583 T5 DE112022005583 T5 DE 112022005583T5
- Authority
- DE
- Germany
- Prior art keywords
- pattern
- holes
- circuit board
- conductor
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 196
- 239000010410 layer Substances 0.000 claims abstract description 118
- 239000012790 adhesive layer Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 12
- 238000007747 plating Methods 0.000 description 10
- 238000000059 patterning Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021190210 | 2021-11-24 | ||
| JP2021-190210 | 2021-11-24 | ||
| PCT/JP2022/043213 WO2023095797A1 (ja) | 2021-11-24 | 2022-11-22 | プリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112022005583T5 true DE112022005583T5 (de) | 2024-10-02 |
Family
ID=86539491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112022005583.9T Pending DE112022005583T5 (de) | 2021-11-24 | 2022-11-22 | Gedruckte Leiterplatte |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250016909A1 (https=) |
| JP (1) | JPWO2023095797A1 (https=) |
| CN (1) | CN118303138A (https=) |
| DE (1) | DE112022005583T5 (https=) |
| WO (1) | WO2023095797A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006024618A (ja) | 2004-07-06 | 2006-01-26 | Toshiba Corp | 配線基板 |
| JP2021190210A (ja) | 2020-05-27 | 2021-12-13 | 矢崎総業株式会社 | 導体接続構造 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6133805A (en) * | 1996-10-31 | 2000-10-17 | The Whitaker Corporation | Isolation in multi-layer structures |
| US11101533B2 (en) * | 2016-10-13 | 2021-08-24 | Win Semiconductors Corp. | Radio frequency device |
| JP2018200982A (ja) * | 2017-05-29 | 2018-12-20 | 東洋インキＳｃホールディングス株式会社 | フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器 |
| JP6732723B2 (ja) * | 2017-12-14 | 2020-07-29 | 日本メクトロン株式会社 | 高周波伝送用プリント配線板 |
| JP7597800B2 (ja) * | 2020-05-13 | 2024-12-10 | 住友電工プリントサーキット株式会社 | 高周波回路 |
-
2022
- 2022-11-22 DE DE112022005583.9T patent/DE112022005583T5/de active Pending
- 2022-11-22 WO PCT/JP2022/043213 patent/WO2023095797A1/ja not_active Ceased
- 2022-11-22 CN CN202280077681.4A patent/CN118303138A/zh active Pending
- 2022-11-22 US US18/711,596 patent/US20250016909A1/en active Pending
- 2022-11-22 JP JP2023563703A patent/JPWO2023095797A1/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006024618A (ja) | 2004-07-06 | 2006-01-26 | Toshiba Corp | 配線基板 |
| JP2021190210A (ja) | 2020-05-27 | 2021-12-13 | 矢崎総業株式会社 | 導体接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20250016909A1 (en) | 2025-01-09 |
| WO2023095797A1 (ja) | 2023-06-01 |
| CN118303138A (zh) | 2024-07-05 |
| JPWO2023095797A1 (https=) | 2023-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69117381T2 (de) | Mehrschichtleiterplatte und Verfahren zu ihrer Herstellung | |
| DE69311353T2 (de) | Sockel für integrierte schaltungen mit mehreren anschlussdrähten | |
| DE102006050890B4 (de) | Verfahren zur Herstellung einer Leiterplatte mit feinen Leiterstrukturen und lötaugenfreien Durchkontaktierungen | |
| DE3586532T2 (de) | Mehrschichtleiterplatte mit hoher dichte. | |
| DE68908687T2 (de) | Gedruckte Schaltungsplatte. | |
| DE3812021A1 (de) | Flexible schaltung mit anschlussorganen und verfahren zu ihrer herstellung | |
| DE69800514T2 (de) | Leiterplatte mit primären und sekundären Durchgangslöchern | |
| DE4002025C2 (de) | Leiterplatte | |
| DE3881973T2 (de) | Mehrschichtschaltungsplatte. | |
| DE2911620C2 (de) | Verfahren zum Herstellen von leitenden durchgehenden Bohrungen in Schaltungsplatten | |
| DE69831467T2 (de) | Mehrschicht-Schaltungsplatte | |
| DE69325026T2 (de) | Uebergangsvorrichtung für RF-Wellenleitersignale | |
| DE2816857A1 (de) | Gedruckte schaltung | |
| DE2702844A1 (de) | Verfahren zur herstellung einer vielschichtigen gedruckten schaltung | |
| DE2247902A1 (de) | Gedruckte schaltungsplatte und verfahren zu deren herstellung | |
| DE4134617A1 (de) | Verbindungsvorrichtung mit in gleicher ebene liegenden kontakthoeckern und das verfahren zur herstellung einer derartigen vorrichtung | |
| DE102007060510A1 (de) | Leiterplatten-Herstellungsverfahren, Leiterplatte und elektronische Anordnung | |
| WO2010072516A2 (de) | Leiterplatte mit aufgewachsener metallschicht in einer biegbaren zone | |
| DE102004045719A1 (de) | Gedruckte-Schaltungsplatine-Testzugangspunktstrukturen und Verfahren zum Herstellen derselben | |
| DE112018004786T5 (de) | Hochfrequenzübertragungsleitung | |
| DE10245688A1 (de) | Mehrschichtkeramikelektronikteil, Elektronikteilaggregat und Verfahren zum Herstellen eines Mehrschichtkeramikelektronikteils | |
| DE69300615T2 (de) | Mehrschichtige Leiterplatte und Herstellungsverfahren. | |
| DE102014115655A1 (de) | Umverteilungsschicht und Verfahren zur Bildung einer Umverteilungsschicht | |
| DE112017007145T5 (de) | Zwischenplattenverbindungsstruktur | |
| EP2040520B1 (de) | Leiterkarte und Verfahren zum Erhöhen der Widerstandsfähigkeit einer Leiterkarte gegen eine Bildung von leitfähigen Filamenten |