DE112022005576T5 - Leiterplatte - Google Patents
Leiterplatte Download PDFInfo
- Publication number
- DE112022005576T5 DE112022005576T5 DE112022005576.6T DE112022005576T DE112022005576T5 DE 112022005576 T5 DE112022005576 T5 DE 112022005576T5 DE 112022005576 T DE112022005576 T DE 112022005576T DE 112022005576 T5 DE112022005576 T5 DE 112022005576T5
- Authority
- DE
- Germany
- Prior art keywords
- holes
- circuit board
- ground structure
- insulating layer
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 184
- 239000004020 conductor Substances 0.000 claims abstract description 89
- 239000012790 adhesive layer Substances 0.000 claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 description 50
- 238000000034 method Methods 0.000 description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 238000007747 plating Methods 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 12
- 238000000059 patterning Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-190207 | 2021-11-24 | ||
| JP2021190207 | 2021-11-24 | ||
| PCT/JP2022/043215 WO2023095798A1 (ja) | 2021-11-24 | 2022-11-22 | プリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112022005576T5 true DE112022005576T5 (de) | 2024-09-19 |
Family
ID=86539493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112022005576.6T Pending DE112022005576T5 (de) | 2021-11-24 | 2022-11-22 | Leiterplatte |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250031299A1 (https=) |
| JP (1) | JPWO2023095798A1 (https=) |
| CN (1) | CN118451790A (https=) |
| DE (1) | DE112022005576T5 (https=) |
| WO (1) | WO2023095798A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118888451B (zh) * | 2024-03-26 | 2025-02-11 | 芯爱科技(南京)有限公司 | 封装基板的制法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006024618A (ja) | 2004-07-06 | 2006-01-26 | Toshiba Corp | 配線基板 |
| JP2021190207A (ja) | 2020-05-27 | 2021-12-13 | トヨタ自動車株式会社 | 膜電極接合体及び固体高分子型燃料電池 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3905546B2 (ja) * | 2003-06-09 | 2007-04-18 | 富士通株式会社 | プリント基板およびプリント基板ユニット |
| JP2010212439A (ja) * | 2009-03-10 | 2010-09-24 | Sumitomo Bakelite Co Ltd | 回路基板 |
| JP6021504B2 (ja) * | 2012-08-08 | 2016-11-09 | キヤノン株式会社 | プリント配線板、プリント回路板及びプリント回路板の製造方法 |
| JP6691495B2 (ja) * | 2017-03-06 | 2020-04-28 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
| JP2018200982A (ja) * | 2017-05-29 | 2018-12-20 | 東洋インキＳｃホールディングス株式会社 | フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器 |
| JP7597800B2 (ja) * | 2020-05-13 | 2024-12-10 | 住友電工プリントサーキット株式会社 | 高周波回路 |
-
2022
- 2022-11-22 JP JP2023563704A patent/JPWO2023095798A1/ja active Pending
- 2022-11-22 US US18/711,599 patent/US20250031299A1/en active Pending
- 2022-11-22 DE DE112022005576.6T patent/DE112022005576T5/de active Pending
- 2022-11-22 CN CN202280077682.9A patent/CN118451790A/zh active Pending
- 2022-11-22 WO PCT/JP2022/043215 patent/WO2023095798A1/ja not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006024618A (ja) | 2004-07-06 | 2006-01-26 | Toshiba Corp | 配線基板 |
| JP2021190207A (ja) | 2020-05-27 | 2021-12-13 | トヨタ自動車株式会社 | 膜電極接合体及び固体高分子型燃料電池 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023095798A1 (ja) | 2023-06-01 |
| US20250031299A1 (en) | 2025-01-23 |
| CN118451790A (zh) | 2024-08-06 |
| JPWO2023095798A1 (https=) | 2023-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69800514T2 (de) | Leiterplatte mit primären und sekundären Durchgangslöchern | |
| DE69117381T2 (de) | Mehrschichtleiterplatte und Verfahren zu ihrer Herstellung | |
| DE2702844C2 (de) | Verfahren zur Herstellung einer vielschichtigen gedruckten Schaltung | |
| DE4002025C2 (de) | Leiterplatte | |
| DE2911620C2 (de) | Verfahren zum Herstellen von leitenden durchgehenden Bohrungen in Schaltungsplatten | |
| DE69325026T2 (de) | Uebergangsvorrichtung für RF-Wellenleitersignale | |
| DE69831467T2 (de) | Mehrschicht-Schaltungsplatte | |
| DE3881973T2 (de) | Mehrschichtschaltungsplatte. | |
| DE3426278C2 (de) | Leiterplatte | |
| DE3812021A1 (de) | Flexible schaltung mit anschlussorganen und verfahren zu ihrer herstellung | |
| DE2816857A1 (de) | Gedruckte schaltung | |
| DE112018004786B4 (de) | Hochfrequenzübertragungsleitung | |
| EP0082216B1 (de) | Mehrschichtiges, keramisches Substrat für integrierte Halbleiterschaltungen mit mehreren Metallisierungsebenen | |
| WO2010072516A2 (de) | Leiterplatte mit aufgewachsener metallschicht in einer biegbaren zone | |
| DE69402288T2 (de) | Steckmatrixbrett | |
| DE10207957A1 (de) | Verfahren für hochdichtes Entkoppeln einer Kondensatorplazierung mit geringer Anzahl von Kontaktlöchern | |
| DE69839006T2 (de) | Leiterplatte mit durchkontaktierungen | |
| DE102018219225A1 (de) | Elektronische Leiterplatte | |
| DE112017000403T5 (de) | Geschirmter, gefalteter Steckverbinder für einen Sensor | |
| DE112017007145T5 (de) | Zwischenplattenverbindungsstruktur | |
| EP2040520B1 (de) | Leiterkarte und Verfahren zum Erhöhen der Widerstandsfähigkeit einer Leiterkarte gegen eine Bildung von leitfähigen Filamenten | |
| DE112022005576T5 (de) | Leiterplatte | |
| DE102016216308B4 (de) | Leiterplatte und Verfahren zu deren Herstellung | |
| DE69836860T2 (de) | Hochfrequenz leiterplattenanordnung mit verbesserter signalübertragungsqualität | |
| DE112022005583T5 (de) | Gedruckte Leiterplatte |