CN118451790A - 印刷布线板 - Google Patents

印刷布线板 Download PDF

Info

Publication number
CN118451790A
CN118451790A CN202280077682.9A CN202280077682A CN118451790A CN 118451790 A CN118451790 A CN 118451790A CN 202280077682 A CN202280077682 A CN 202280077682A CN 118451790 A CN118451790 A CN 118451790A
Authority
CN
China
Prior art keywords
holes
ground pattern
wiring board
pattern
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280077682.9A
Other languages
English (en)
Chinese (zh)
Inventor
五十岚俊
桑山一郎
山岸杰
上田宏
木谷聪志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN118451790A publication Critical patent/CN118451790A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09636—Details of adjacent, not connected vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN202280077682.9A 2021-11-24 2022-11-22 印刷布线板 Pending CN118451790A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-190207 2021-11-24
JP2021190207 2021-11-24
PCT/JP2022/043215 WO2023095798A1 (ja) 2021-11-24 2022-11-22 プリント配線板

Publications (1)

Publication Number Publication Date
CN118451790A true CN118451790A (zh) 2024-08-06

Family

ID=86539493

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280077682.9A Pending CN118451790A (zh) 2021-11-24 2022-11-22 印刷布线板

Country Status (5)

Country Link
US (1) US20250031299A1 (https=)
JP (1) JPWO2023095798A1 (https=)
CN (1) CN118451790A (https=)
DE (1) DE112022005576T5 (https=)
WO (1) WO2023095798A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118888451B (zh) * 2024-03-26 2025-02-11 芯爱科技(南京)有限公司 封装基板的制法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3905546B2 (ja) * 2003-06-09 2007-04-18 富士通株式会社 プリント基板およびプリント基板ユニット
JP2006024618A (ja) 2004-07-06 2006-01-26 Toshiba Corp 配線基板
JP2010212439A (ja) * 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
JP6021504B2 (ja) * 2012-08-08 2016-11-09 キヤノン株式会社 プリント配線板、プリント回路板及びプリント回路板の製造方法
JP6691495B2 (ja) * 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP7597800B2 (ja) * 2020-05-13 2024-12-10 住友電工プリントサーキット株式会社 高周波回路
JP7396200B2 (ja) 2020-05-27 2023-12-12 トヨタ自動車株式会社 膜電極接合体及び固体高分子型燃料電池

Also Published As

Publication number Publication date
WO2023095798A1 (ja) 2023-06-01
US20250031299A1 (en) 2025-01-23
DE112022005576T5 (de) 2024-09-19
JPWO2023095798A1 (https=) 2023-06-01

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