JPWO2023095798A1 - - Google Patents

Info

Publication number
JPWO2023095798A1
JPWO2023095798A1 JP2023563704A JP2023563704A JPWO2023095798A1 JP WO2023095798 A1 JPWO2023095798 A1 JP WO2023095798A1 JP 2023563704 A JP2023563704 A JP 2023563704A JP 2023563704 A JP2023563704 A JP 2023563704A JP WO2023095798 A1 JPWO2023095798 A1 JP WO2023095798A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023563704A
Other languages
Japanese (ja)
Other versions
JPWO2023095798A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023095798A1 publication Critical patent/JPWO2023095798A1/ja
Publication of JPWO2023095798A5 publication Critical patent/JPWO2023095798A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09636—Details of adjacent, not connected vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2023563704A 2021-11-24 2022-11-22 Pending JPWO2023095798A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021190207 2021-11-24
PCT/JP2022/043215 WO2023095798A1 (ja) 2021-11-24 2022-11-22 プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2023095798A1 true JPWO2023095798A1 (https=) 2023-06-01
JPWO2023095798A5 JPWO2023095798A5 (https=) 2024-08-06

Family

ID=86539493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023563704A Pending JPWO2023095798A1 (https=) 2021-11-24 2022-11-22

Country Status (5)

Country Link
US (1) US20250031299A1 (https=)
JP (1) JPWO2023095798A1 (https=)
CN (1) CN118451790A (https=)
DE (1) DE112022005576T5 (https=)
WO (1) WO2023095798A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118888451B (zh) * 2024-03-26 2025-02-11 芯爱科技(南京)有限公司 封装基板的制法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3905546B2 (ja) * 2003-06-09 2007-04-18 富士通株式会社 プリント基板およびプリント基板ユニット
JP2006024618A (ja) 2004-07-06 2006-01-26 Toshiba Corp 配線基板
JP2010212439A (ja) * 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
JP6021504B2 (ja) * 2012-08-08 2016-11-09 キヤノン株式会社 プリント配線板、プリント回路板及びプリント回路板の製造方法
JP6691495B2 (ja) * 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP7597800B2 (ja) * 2020-05-13 2024-12-10 住友電工プリントサーキット株式会社 高周波回路
JP7396200B2 (ja) 2020-05-27 2023-12-12 トヨタ自動車株式会社 膜電極接合体及び固体高分子型燃料電池

Also Published As

Publication number Publication date
WO2023095798A1 (ja) 2023-06-01
US20250031299A1 (en) 2025-01-23
CN118451790A (zh) 2024-08-06
DE112022005576T5 (de) 2024-09-19

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