DE112022003096T5 - Verbundsubstrat und Verfahren zur Herstellung eines Verbundsubstrats - Google Patents
Verbundsubstrat und Verfahren zur Herstellung eines Verbundsubstrats Download PDFInfo
- Publication number
- DE112022003096T5 DE112022003096T5 DE112022003096.8T DE112022003096T DE112022003096T5 DE 112022003096 T5 DE112022003096 T5 DE 112022003096T5 DE 112022003096 T DE112022003096 T DE 112022003096T DE 112022003096 T5 DE112022003096 T5 DE 112022003096T5
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- Prior art keywords
- composite substrate
- piezoelectric
- piezoelectric film
- substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021139135 | 2021-08-27 | ||
| JP2021-139135 | 2021-08-27 | ||
| PCT/JP2022/030873 WO2023026888A1 (ja) | 2021-08-27 | 2022-08-15 | 複合基板および複合基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112022003096T5 true DE112022003096T5 (de) | 2024-04-18 |
Family
ID=85321925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112022003096.8T Pending DE112022003096T5 (de) | 2021-08-27 | 2022-08-15 | Verbundsubstrat und Verfahren zur Herstellung eines Verbundsubstrats |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240251682A1 (https=) |
| JP (1) | JP7727740B2 (https=) |
| CN (1) | CN117859417A (https=) |
| DE (1) | DE112022003096T5 (https=) |
| WO (1) | WO2023026888A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024209756A1 (ja) * | 2023-04-03 | 2024-10-10 | 株式会社デンソー | 圧電薄膜デバイスおよびその製造方法 |
| CN121264198A (zh) * | 2023-05-24 | 2026-01-02 | 日本碍子株式会社 | 复合基板及复合基板的制造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086400A (ja) | 2012-10-26 | 2014-05-12 | Mitsubishi Heavy Ind Ltd | 高速原子ビーム源およびそれを用いた常温接合装置 |
| JP5525351B2 (ja) | 2010-06-29 | 2014-06-18 | 太平洋セメント株式会社 | 圧電発音体 |
| WO2017043383A1 (ja) | 2015-09-11 | 2017-03-16 | 住友精密工業株式会社 | 圧電素子および圧電素子の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088442A (ja) | 2005-08-23 | 2007-04-05 | Canon Inc | 圧電体素子、それを用いた液体吐出ヘッド、および液体吐出装置 |
| WO2007023985A1 (ja) * | 2005-08-23 | 2007-03-01 | Canon Kabushiki Kaisha | 圧電体素子、それを用いた液体吐出ヘッド、および液体吐出装置 |
| JP4755919B2 (ja) | 2006-02-23 | 2011-08-24 | 富士フイルム株式会社 | ジルコンチタン酸鉛系組成物とその製造方法、圧電体、及び圧電素子 |
| JP2011251866A (ja) | 2010-06-01 | 2011-12-15 | Ngk Insulators Ltd | 圧電／電歪セラミックス焼結体及び圧電／電歪素子 |
| JP5861404B2 (ja) | 2011-11-18 | 2016-02-16 | コニカミノルタ株式会社 | 圧電素子およびその製造方法 |
| JP2013128006A (ja) | 2011-12-16 | 2013-06-27 | Ngk Insulators Ltd | 圧電／電歪体膜の製造方法 |
| JP2014187094A (ja) | 2013-03-22 | 2014-10-02 | Hitachi Metals Ltd | 圧電体薄膜積層基板、圧電体薄膜素子、およびそれらの製造方法 |
| JP2015216195A (ja) | 2014-05-09 | 2015-12-03 | セイコーエプソン株式会社 | 超音波プローブ |
| DE112018005935T5 (de) | 2017-11-22 | 2020-08-06 | Murata Manufacturing Co., Ltd. | Piezoelektrisches Bauelement und Verfahren zur Herstellung eines piezoelektrischen Bauelements |
| JP7015411B2 (ja) | 2020-01-10 | 2022-02-02 | 日本碍子株式会社 | 圧電振動基板および圧電振動素子 |
-
2022
- 2022-08-15 JP JP2023543818A patent/JP7727740B2/ja active Active
- 2022-08-15 CN CN202280056274.5A patent/CN117859417A/zh active Pending
- 2022-08-15 WO PCT/JP2022/030873 patent/WO2023026888A1/ja not_active Ceased
- 2022-08-15 DE DE112022003096.8T patent/DE112022003096T5/de active Pending
-
2024
- 2024-02-26 US US18/586,617 patent/US20240251682A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5525351B2 (ja) | 2010-06-29 | 2014-06-18 | 太平洋セメント株式会社 | 圧電発音体 |
| JP2014086400A (ja) | 2012-10-26 | 2014-05-12 | Mitsubishi Heavy Ind Ltd | 高速原子ビーム源およびそれを用いた常温接合装置 |
| WO2017043383A1 (ja) | 2015-09-11 | 2017-03-16 | 住友精密工業株式会社 | 圧電素子および圧電素子の製造方法 |
Non-Patent Citations (1)
| Title |
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| Kanno et al. / Sensors and Actuators A 107 (2003), 68-74 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202316692A (zh) | 2023-04-16 |
| US20240251682A1 (en) | 2024-07-25 |
| WO2023026888A1 (ja) | 2023-03-02 |
| CN117859417A (zh) | 2024-04-09 |
| JPWO2023026888A1 (https=) | 2023-03-02 |
| JP7727740B2 (ja) | 2025-08-21 |
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