DE112021008251T5 - Leistungshalbleitervorrichtung und Verfahren zur Herstellung einer Leistungshalbleitervorrichtung - Google Patents

Leistungshalbleitervorrichtung und Verfahren zur Herstellung einer Leistungshalbleitervorrichtung Download PDF

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Publication number
DE112021008251T5
DE112021008251T5 DE112021008251.5T DE112021008251T DE112021008251T5 DE 112021008251 T5 DE112021008251 T5 DE 112021008251T5 DE 112021008251 T DE112021008251 T DE 112021008251T DE 112021008251 T5 DE112021008251 T5 DE 112021008251T5
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DE
Germany
Prior art keywords
semiconductor device
region
power
heat sink
terminal block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021008251.5T
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German (de)
English (en)
Inventor
Nobuyoshi Kimoto
Mitsunori Aiko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021008251T5 publication Critical patent/DE112021008251T5/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112021008251.5T 2021-09-21 2021-09-21 Leistungshalbleitervorrichtung und Verfahren zur Herstellung einer Leistungshalbleitervorrichtung Pending DE112021008251T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/034527 WO2023047451A1 (ja) 2021-09-21 2021-09-21 電力用半導体装置および電力用半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112021008251T5 true DE112021008251T5 (de) 2024-07-04

Family

ID=85720238

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021008251.5T Pending DE112021008251T5 (de) 2021-09-21 2021-09-21 Leistungshalbleitervorrichtung und Verfahren zur Herstellung einer Leistungshalbleitervorrichtung

Country Status (5)

Country Link
US (1) US20240234237A1 (https=)
JP (1) JP7720918B2 (https=)
CN (1) CN117957648A (https=)
DE (1) DE112021008251T5 (https=)
WO (1) WO2023047451A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11430777B2 (en) * 2020-11-19 2022-08-30 Semiconductor Components Industries, Llc Power module package for direct cooling multiple power modules

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727634Y2 (ja) * 1989-02-03 1995-06-21 富士通株式会社 空冷フィン構造
JPH0831967A (ja) * 1994-07-19 1996-02-02 Fuji Electric Co Ltd 半導体装置のパッケージ構造
JP4062157B2 (ja) 2003-04-10 2008-03-19 株式会社デンソー 半導体モジュール実装構造
JP2009017751A (ja) 2007-07-09 2009-01-22 Sumitomo Electric Ind Ltd コネクタユニット、回転電機のハウジングおよび回転電機
JP2011253950A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp 電力半導体装置
JP5382049B2 (ja) * 2010-06-30 2014-01-08 株式会社デンソー 半導体装置
JP5310660B2 (ja) 2010-07-01 2013-10-09 富士電機株式会社 半導体装置
JP5891616B2 (ja) 2011-06-28 2016-03-23 日産自動車株式会社 半導体装置
JP5971190B2 (ja) 2012-06-07 2016-08-17 株式会社豊田自動織機 半導体装置
JP5714077B2 (ja) * 2013-10-25 2015-05-07 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
WO2015102046A1 (ja) 2014-01-06 2015-07-09 三菱電機株式会社 半導体装置
DE112014006793B4 (de) 2014-07-09 2020-07-23 Mitsubishi Electric Corporation Halbleitervorrichtung
WO2017221730A1 (ja) 2016-06-24 2017-12-28 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
JP6486579B1 (ja) 2018-03-30 2019-03-20 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
WO2023047451A1 (ja) 2023-03-30
CN117957648A (zh) 2024-04-30
JP7720918B2 (ja) 2025-08-08
JPWO2023047451A1 (https=) 2023-03-30
US20240234237A1 (en) 2024-07-11

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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023360000

Ipc: H10W0040200000