JP7720918B2 - 電力用半導体装置および電力用半導体装置の製造方法 - Google Patents

電力用半導体装置および電力用半導体装置の製造方法

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Publication number
JP7720918B2
JP7720918B2 JP2023549185A JP2023549185A JP7720918B2 JP 7720918 B2 JP7720918 B2 JP 7720918B2 JP 2023549185 A JP2023549185 A JP 2023549185A JP 2023549185 A JP2023549185 A JP 2023549185A JP 7720918 B2 JP7720918 B2 JP 7720918B2
Authority
JP
Japan
Prior art keywords
semiconductor device
power
region
power semiconductor
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023549185A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023047451A1 (https=
Inventor
信義 木本
光徳 愛甲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2023047451A1 publication Critical patent/JPWO2023047451A1/ja
Application granted granted Critical
Publication of JP7720918B2 publication Critical patent/JP7720918B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023549185A 2021-09-21 2021-09-21 電力用半導体装置および電力用半導体装置の製造方法 Active JP7720918B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/034527 WO2023047451A1 (ja) 2021-09-21 2021-09-21 電力用半導体装置および電力用半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023047451A1 JPWO2023047451A1 (https=) 2023-03-30
JP7720918B2 true JP7720918B2 (ja) 2025-08-08

Family

ID=85720238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023549185A Active JP7720918B2 (ja) 2021-09-21 2021-09-21 電力用半導体装置および電力用半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20240234237A1 (https=)
JP (1) JP7720918B2 (https=)
CN (1) CN117957648A (https=)
DE (1) DE112021008251T5 (https=)
WO (1) WO2023047451A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11430777B2 (en) * 2020-11-19 2022-08-30 Semiconductor Components Industries, Llc Power module package for direct cooling multiple power modules

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311905A (ja) 2003-04-10 2004-11-04 Denso Corp 半導体モジュール実装構造
JP2009017751A (ja) 2007-07-09 2009-01-22 Sumitomo Electric Ind Ltd コネクタユニット、回転電機のハウジングおよび回転電機
JP2012015349A (ja) 2010-07-01 2012-01-19 Fuji Electric Co Ltd 半導体装置
JP2012033872A (ja) 2010-06-30 2012-02-16 Denso Corp 半導体装置
JP2013012520A (ja) 2011-06-28 2013-01-17 Nissan Motor Co Ltd 半導体装置
JP2014013884A (ja) 2012-06-07 2014-01-23 Toyota Industries Corp 半導体装置
JP2015084609A (ja) 2013-10-25 2015-04-30 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
WO2015102046A1 (ja) 2014-01-06 2015-07-09 三菱電機株式会社 半導体装置
WO2016006054A1 (ja) 2014-07-09 2016-01-14 三菱電機株式会社 半導体装置
WO2017221730A1 (ja) 2016-06-24 2017-12-28 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
WO2019187125A1 (ja) 2018-03-30 2019-10-03 三菱電機株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727634Y2 (ja) * 1989-02-03 1995-06-21 富士通株式会社 空冷フィン構造
JPH0831967A (ja) * 1994-07-19 1996-02-02 Fuji Electric Co Ltd 半導体装置のパッケージ構造
JP2011253950A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp 電力半導体装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311905A (ja) 2003-04-10 2004-11-04 Denso Corp 半導体モジュール実装構造
JP2009017751A (ja) 2007-07-09 2009-01-22 Sumitomo Electric Ind Ltd コネクタユニット、回転電機のハウジングおよび回転電機
JP2012033872A (ja) 2010-06-30 2012-02-16 Denso Corp 半導体装置
JP2012015349A (ja) 2010-07-01 2012-01-19 Fuji Electric Co Ltd 半導体装置
JP2013012520A (ja) 2011-06-28 2013-01-17 Nissan Motor Co Ltd 半導体装置
JP2014013884A (ja) 2012-06-07 2014-01-23 Toyota Industries Corp 半導体装置
JP2015084609A (ja) 2013-10-25 2015-04-30 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
WO2015102046A1 (ja) 2014-01-06 2015-07-09 三菱電機株式会社 半導体装置
WO2016006054A1 (ja) 2014-07-09 2016-01-14 三菱電機株式会社 半導体装置
WO2017221730A1 (ja) 2016-06-24 2017-12-28 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
WO2019187125A1 (ja) 2018-03-30 2019-10-03 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
WO2023047451A1 (ja) 2023-03-30
CN117957648A (zh) 2024-04-30
JPWO2023047451A1 (https=) 2023-03-30
US20240234237A1 (en) 2024-07-11
DE112021008251T5 (de) 2024-07-04

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