DE112021003831T5 - Unterdruckversorgungssystem - Google Patents

Unterdruckversorgungssystem Download PDF

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Publication number
DE112021003831T5
DE112021003831T5 DE112021003831.1T DE112021003831T DE112021003831T5 DE 112021003831 T5 DE112021003831 T5 DE 112021003831T5 DE 112021003831 T DE112021003831 T DE 112021003831T DE 112021003831 T5 DE112021003831 T5 DE 112021003831T5
Authority
DE
Germany
Prior art keywords
notification
holding force
control unit
holding
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112021003831.1T
Other languages
German (de)
English (en)
Inventor
Makito NAKAMURA
Masahiro Murota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE112021003831T5 publication Critical patent/DE112021003831T5/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/04—Program control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Program control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D15/00—Control of mechanical force or stress; Control of mechanical pressure
    • G05D15/01—Control of mechanical force or stress; Control of mechanical pressure characterised by the use of electric means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112021003831.1T 2020-07-17 2021-07-12 Unterdruckversorgungssystem Withdrawn DE112021003831T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020122819 2020-07-17
JP2020-122819 2020-07-17
PCT/JP2021/026061 WO2022014509A1 (ja) 2020-07-17 2021-07-12 真空圧供給システム

Publications (1)

Publication Number Publication Date
DE112021003831T5 true DE112021003831T5 (de) 2023-05-04

Family

ID=79555458

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021003831.1T Withdrawn DE112021003831T5 (de) 2020-07-17 2021-07-12 Unterdruckversorgungssystem

Country Status (5)

Country Link
US (1) US20230278173A1 (https=)
JP (1) JPWO2022014509A1 (https=)
CN (1) CN116157230A (https=)
DE (1) DE112021003831T5 (https=)
WO (1) WO2022014509A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006229027A (ja) 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウェハ搬送装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2975097B2 (ja) * 1990-11-29 1999-11-10 キヤノン株式会社 真空吸着基板保持装置の真空配管
JP3332425B2 (ja) * 1992-11-10 2002-10-07 キヤノン株式会社 基板保持装置、並びにこれを用いた露光装置と半導体デバイス製造方法
JP3642696B2 (ja) * 1999-02-26 2005-04-27 大日本スクリーン製造株式会社 基板保持装置およびそれを用いた基板処理装置
JP4681756B2 (ja) * 2001-05-16 2011-05-11 キヤノン株式会社 露光装置およびデバイス製造方法
US6896929B2 (en) * 2001-08-03 2005-05-24 Applied Materials, Inc. Susceptor shaft vacuum pumping
JP2010040847A (ja) * 2008-08-06 2010-02-18 Nikon Corp 露光装置、露光システム及び露光方法並びにデバイス製造方法
JP5491022B2 (ja) * 2008-12-10 2014-05-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法
JP5544911B2 (ja) * 2010-02-10 2014-07-09 株式会社村田製作所 真空度切替方法
TWI656082B (zh) * 2018-06-11 2019-04-11 旭騰股份有限公司 電動吸盤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006229027A (ja) 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウェハ搬送装置

Also Published As

Publication number Publication date
CN116157230A (zh) 2023-05-23
WO2022014509A1 (ja) 2022-01-20
US20230278173A1 (en) 2023-09-07
JPWO2022014509A1 (https=) 2022-01-20

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee