JPWO2022014509A1 - - Google Patents

Info

Publication number
JPWO2022014509A1
JPWO2022014509A1 JP2022536335A JP2022536335A JPWO2022014509A1 JP WO2022014509 A1 JPWO2022014509 A1 JP WO2022014509A1 JP 2022536335 A JP2022536335 A JP 2022536335A JP 2022536335 A JP2022536335 A JP 2022536335A JP WO2022014509 A1 JPWO2022014509 A1 JP WO2022014509A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2022536335A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014509A1 publication Critical patent/JPWO2022014509A1/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D15/00—Control of mechanical force or stress; Control of mechanical pressure
    • G05D15/01—Control of mechanical force or stress; Control of mechanical pressure characterised by the use of electric means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022536335A 2020-07-17 2021-07-12 Withdrawn JPWO2022014509A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020122819 2020-07-17
PCT/JP2021/026061 WO2022014509A1 (ja) 2020-07-17 2021-07-12 真空圧供給システム

Publications (1)

Publication Number Publication Date
JPWO2022014509A1 true JPWO2022014509A1 (ja) 2022-01-20

Family

ID=79555458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536335A Withdrawn JPWO2022014509A1 (ja) 2020-07-17 2021-07-12

Country Status (5)

Country Link
US (1) US20230278173A1 (ja)
JP (1) JPWO2022014509A1 (ja)
CN (1) CN116157230A (ja)
DE (1) DE112021003831T5 (ja)
WO (1) WO2022014509A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2975097B2 (ja) * 1990-11-29 1999-11-10 キヤノン株式会社 真空吸着基板保持装置の真空配管
JP3332425B2 (ja) * 1992-11-10 2002-10-07 キヤノン株式会社 基板保持装置、並びにこれを用いた露光装置と半導体デバイス製造方法
JP3642696B2 (ja) * 1999-02-26 2005-04-27 大日本スクリーン製造株式会社 基板保持装置およびそれを用いた基板処理装置
JP4681756B2 (ja) * 2001-05-16 2011-05-11 キヤノン株式会社 露光装置およびデバイス製造方法
JP2006229027A (ja) 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウェハ搬送装置
JP2010040847A (ja) * 2008-08-06 2010-02-18 Nikon Corp 露光装置、露光システム及び露光方法並びにデバイス製造方法
JP5491022B2 (ja) * 2008-12-10 2014-05-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法
JP5544911B2 (ja) * 2010-02-10 2014-07-09 株式会社村田製作所 真空度切替方法

Also Published As

Publication number Publication date
WO2022014509A1 (ja) 2022-01-20
US20230278173A1 (en) 2023-09-07
DE112021003831T5 (de) 2023-05-04
CN116157230A (zh) 2023-05-23

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Legal Events

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A621 Written request for application examination

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Effective date: 20230207

A761 Written withdrawal of application

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Effective date: 20231115