DE112020004265T5 - Vorgangskoordinierungsvorrichtung, Vorgangskoordinierungsverfahren und Steuer-bzw. Regelprogramm - Google Patents

Vorgangskoordinierungsvorrichtung, Vorgangskoordinierungsverfahren und Steuer-bzw. Regelprogramm Download PDF

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Publication number
DE112020004265T5
DE112020004265T5 DE112020004265.0T DE112020004265T DE112020004265T5 DE 112020004265 T5 DE112020004265 T5 DE 112020004265T5 DE 112020004265 T DE112020004265 T DE 112020004265T DE 112020004265 T5 DE112020004265 T5 DE 112020004265T5
Authority
DE
Germany
Prior art keywords
soldering
work
information
identification information
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020004265.0T
Other languages
German (de)
English (en)
Inventor
Kenji Matsuzaki
Kenta Nakamura
Hitoshi Takeuchi
Kosho Karino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hakko Corp
Original Assignee
Hakko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hakko Corp filed Critical Hakko Corp
Publication of DE112020004265T5 publication Critical patent/DE112020004265T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE112020004265.0T 2019-09-10 2020-09-07 Vorgangskoordinierungsvorrichtung, Vorgangskoordinierungsverfahren und Steuer-bzw. Regelprogramm Pending DE112020004265T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962898302P 2019-09-10 2019-09-10
US62/898,302 2019-09-10
PCT/JP2020/033725 WO2021049446A1 (ja) 2019-09-10 2020-09-07 作業管理装置、作業管理方法及び制御プログラム

Publications (1)

Publication Number Publication Date
DE112020004265T5 true DE112020004265T5 (de) 2022-06-02

Family

ID=74866608

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020004265.0T Pending DE112020004265T5 (de) 2019-09-10 2020-09-07 Vorgangskoordinierungsvorrichtung, Vorgangskoordinierungsverfahren und Steuer-bzw. Regelprogramm

Country Status (4)

Country Link
US (1) US11849260B2 (https=)
JP (1) JP7276917B2 (https=)
DE (1) DE112020004265T5 (https=)
WO (1) WO2021049446A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220226918A1 (en) * 2021-01-15 2022-07-21 Ok International, Inc. Soldering iron including temperature profiling and method of use
DE102023101710A1 (de) * 2023-01-24 2024-07-25 Ersa Gmbh Verfahren zur automatisierten Überwachung eines Lötvorgangs, Lötgerät mit Überwachungseinrichtung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019056622A (ja) 2017-09-21 2019-04-11 株式会社日立製作所 接合工程ライン監視システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388340A (ja) 1989-08-31 1991-04-12 Fujitsu Ltd 高電子移動度トランジスタ
US5140730A (en) * 1989-10-20 1992-08-25 Blakell Systems Limited Printed circuit board assembly apparatus
JP2539095Y2 (ja) * 1989-12-22 1997-06-18 株式会社ロゼフテクノロジー Ｉｃ基板用作業台
SG45278A1 (en) * 1991-11-07 1998-01-16 Omron Tateisi Electronics Co Automatic soldering apparatus apparatus and method for teaching same soldering inspection apparatus and method and apparatus and method for automatically correcting soldering
JP2003046299A (ja) * 2001-08-02 2003-02-14 Fuji Mach Mfg Co Ltd 回路基板作業システムおよび状態設定方法
JP2005242418A (ja) * 2004-02-24 2005-09-08 Matsushita Electric Works Ltd 作業評価装置、作業評価方法をコンピュータに実現させる作業評価プログラムおよび当該作業評価プログラムを記憶した記憶媒体
JP4851855B2 (ja) * 2006-06-09 2012-01-11 株式会社日立製作所 作業実績収集システム
JP5446626B2 (ja) 2009-09-07 2014-03-19 ソニー株式会社 センサ装置及び情報処理装置
JP5352483B2 (ja) * 2010-01-13 2013-11-27 株式会社日立製作所 作業画像管理システム
JP6550082B2 (ja) * 2017-01-17 2019-07-24 白光株式会社 半田付装置
JP6546642B2 (ja) * 2017-01-17 2019-07-17 白光株式会社 溶融制御装置及びプログラム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019056622A (ja) 2017-09-21 2019-04-11 株式会社日立製作所 接合工程ライン監視システム

Also Published As

Publication number Publication date
JP7276917B2 (ja) 2023-05-18
JPWO2021049446A1 (https=) 2021-03-18
US20220201255A1 (en) 2022-06-23
WO2021049446A1 (ja) 2021-03-18
US11849260B2 (en) 2023-12-19

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