JP7276917B2 - 作業管理装置、作業管理方法及び制御プログラム - Google Patents

作業管理装置、作業管理方法及び制御プログラム Download PDF

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Publication number
JP7276917B2
JP7276917B2 JP2021545515A JP2021545515A JP7276917B2 JP 7276917 B2 JP7276917 B2 JP 7276917B2 JP 2021545515 A JP2021545515 A JP 2021545515A JP 2021545515 A JP2021545515 A JP 2021545515A JP 7276917 B2 JP7276917 B2 JP 7276917B2
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Japan
Prior art keywords
soldering
identification information
information
unit
work
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JP2021545515A
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English (en)
Japanese (ja)
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JPWO2021049446A5 (https=
JPWO2021049446A1 (https=
Inventor
憲二 松崎
健太 中村
仁志 竹内
好彰 狩野
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Hakko Corp
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Hakko Corp
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Publication date
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Publication of JPWO2021049446A5 publication Critical patent/JPWO2021049446A5/ja
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021545515A 2019-09-10 2020-09-07 作業管理装置、作業管理方法及び制御プログラム Active JP7276917B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962898302P 2019-09-10 2019-09-10
US62/898,302 2019-09-10
PCT/JP2020/033725 WO2021049446A1 (ja) 2019-09-10 2020-09-07 作業管理装置、作業管理方法及び制御プログラム

Publications (3)

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JPWO2021049446A1 JPWO2021049446A1 (https=) 2021-03-18
JPWO2021049446A5 JPWO2021049446A5 (https=) 2022-04-04
JP7276917B2 true JP7276917B2 (ja) 2023-05-18

Family

ID=74866608

Family Applications (1)

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JP2021545515A Active JP7276917B2 (ja) 2019-09-10 2020-09-07 作業管理装置、作業管理方法及び制御プログラム

Country Status (4)

Country Link
US (1) US11849260B2 (https=)
JP (1) JP7276917B2 (https=)
DE (1) DE112020004265T5 (https=)
WO (1) WO2021049446A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220226918A1 (en) * 2021-01-15 2022-07-21 Ok International, Inc. Soldering iron including temperature profiling and method of use
DE102023101710A1 (de) * 2023-01-24 2024-07-25 Ersa Gmbh Verfahren zur automatisierten Überwachung eines Lötvorgangs, Lötgerät mit Überwachungseinrichtung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005242418A (ja) 2004-02-24 2005-09-08 Matsushita Electric Works Ltd 作業評価装置、作業評価方法をコンピュータに実現させる作業評価プログラムおよび当該作業評価プログラムを記憶した記憶媒体
JP2007328665A (ja) 2006-06-09 2007-12-20 Hitachi Ltd 作業実績収集システム
JP2011145818A (ja) 2010-01-13 2011-07-28 Hitachi Ltd 作業画像管理システム
JP2018114524A (ja) 2017-01-17 2018-07-26 白光株式会社 半田付装置
JP2018114553A (ja) 2017-01-17 2018-07-26 白光株式会社 溶融制御装置及びプログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388340A (ja) 1989-08-31 1991-04-12 Fujitsu Ltd 高電子移動度トランジスタ
US5140730A (en) * 1989-10-20 1992-08-25 Blakell Systems Limited Printed circuit board assembly apparatus
JP2539095Y2 (ja) * 1989-12-22 1997-06-18 株式会社ロゼフテクノロジー Ｉｃ基板用作業台
SG45278A1 (en) * 1991-11-07 1998-01-16 Omron Tateisi Electronics Co Automatic soldering apparatus apparatus and method for teaching same soldering inspection apparatus and method and apparatus and method for automatically correcting soldering
JP2003046299A (ja) * 2001-08-02 2003-02-14 Fuji Mach Mfg Co Ltd 回路基板作業システムおよび状態設定方法
JP5446626B2 (ja) 2009-09-07 2014-03-19 ソニー株式会社 センサ装置及び情報処理装置
JP6954792B2 (ja) 2017-09-21 2021-10-27 株式会社日立製作所 接合工程ライン監視システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005242418A (ja) 2004-02-24 2005-09-08 Matsushita Electric Works Ltd 作業評価装置、作業評価方法をコンピュータに実現させる作業評価プログラムおよび当該作業評価プログラムを記憶した記憶媒体
JP2007328665A (ja) 2006-06-09 2007-12-20 Hitachi Ltd 作業実績収集システム
JP2011145818A (ja) 2010-01-13 2011-07-28 Hitachi Ltd 作業画像管理システム
JP2018114524A (ja) 2017-01-17 2018-07-26 白光株式会社 半田付装置
JP2018114553A (ja) 2017-01-17 2018-07-26 白光株式会社 溶融制御装置及びプログラム

Also Published As

Publication number Publication date
DE112020004265T5 (de) 2022-06-02
JPWO2021049446A1 (https=) 2021-03-18
US20220201255A1 (en) 2022-06-23
WO2021049446A1 (ja) 2021-03-18
US11849260B2 (en) 2023-12-19

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