DE112020002252A5 - Verfahren zur herstellung eines bauelements und bauelement - Google Patents

Verfahren zur herstellung eines bauelements und bauelement Download PDF

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Publication number
DE112020002252A5
DE112020002252A5 DE112020002252.8T DE112020002252T DE112020002252A5 DE 112020002252 A5 DE112020002252 A5 DE 112020002252A5 DE 112020002252 T DE112020002252 T DE 112020002252T DE 112020002252 A5 DE112020002252 A5 DE 112020002252A5
Authority
DE
Germany
Prior art keywords
building element
making
building
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020002252.8T
Other languages
English (en)
Inventor
Alexander F. Pfeuffer
Tobias Berthold
Lutz Höppel
Tobias Meyer
Korbinian Perzlmaier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112020002252A5 publication Critical patent/DE112020002252A5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE112020002252.8T 2019-05-07 2020-05-06 Verfahren zur herstellung eines bauelements und bauelement Pending DE112020002252A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019111816.6A DE102019111816A1 (de) 2019-05-07 2019-05-07 Verfahren zur herstellung eines bauelements und bauelement
DE102019111816.6 2019-05-07
PCT/EP2020/062585 WO2020225304A1 (de) 2019-05-07 2020-05-06 Verfahren zur herstellung eines bauelements und bauelement

Publications (1)

Publication Number Publication Date
DE112020002252A5 true DE112020002252A5 (de) 2022-01-27

Family

ID=70682835

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102019111816.6A Withdrawn DE102019111816A1 (de) 2019-05-07 2019-05-07 Verfahren zur herstellung eines bauelements und bauelement
DE112020002252.8T Pending DE112020002252A5 (de) 2019-05-07 2020-05-06 Verfahren zur herstellung eines bauelements und bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102019111816.6A Withdrawn DE102019111816A1 (de) 2019-05-07 2019-05-07 Verfahren zur herstellung eines bauelements und bauelement

Country Status (4)

Country Link
US (1) US20220238773A1 (de)
CN (1) CN113826221A (de)
DE (2) DE102019111816A1 (de)
WO (1) WO2020225304A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022102367A1 (de) 2022-02-01 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Zielträger, halbleiteranordnung und verfahren zum transferieren eines halbleiterbauelements und haltestruktur

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5796714A (en) * 1994-09-28 1998-08-18 Matsushita Electric Industrial Co., Ltd. Optical module having a vertical-cavity surface-emitting laser
DE102004055677A1 (de) * 2004-11-18 2006-06-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chipträgerverbund und Verfahren zum Herstellen eines Chipträgerverbunds
DE102009009828A1 (de) * 2009-02-19 2010-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteilanordnung und Verfahren zu dessen Herstellung
DE102011011378A1 (de) * 2011-02-16 2012-08-16 Osram Opto Semiconductors Gmbh Trägersubstrat und Verfahren zur Herstellung von Halbleiterchips
DE102014100773A1 (de) * 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE102014103828A1 (de) * 2014-03-20 2015-09-24 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen
FR3044167B1 (fr) * 2015-11-20 2018-01-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoelectronique a diodes electroluminescentes comportant au moins une diode zener
WO2018169968A1 (en) * 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
DE102017113407A1 (de) * 2017-06-19 2018-12-20 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip, Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips und ein Verfahren zur Herstellung einer strahlungsemittierenden Anordnung
CN112020770A (zh) * 2018-04-16 2020-12-01 应用材料公司 使用暂时及永久接合的多层堆叠光学元件

Also Published As

Publication number Publication date
DE102019111816A1 (de) 2020-11-12
US20220238773A1 (en) 2022-07-28
WO2020225304A1 (de) 2020-11-12
CN113826221A (zh) 2021-12-21

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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021580000

Ipc: H01L0033620000

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0033620000

Ipc: H01L0021580000