DE112022002280A5 - Bedienelement und verfahren zur herstellung eines bedienelementes - Google Patents
Bedienelement und verfahren zur herstellung eines bedienelementes Download PDFInfo
- Publication number
- DE112022002280A5 DE112022002280A5 DE112022002280.9T DE112022002280T DE112022002280A5 DE 112022002280 A5 DE112022002280 A5 DE 112022002280A5 DE 112022002280 T DE112022002280 T DE 112022002280T DE 112022002280 A5 DE112022002280 A5 DE 112022002280A5
- Authority
- DE
- Germany
- Prior art keywords
- control element
- producing
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0485—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the physical interaction between a user and certain areas located on the lighting device, e.g. a touch sensor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V11/00—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
- F21V11/08—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0418—Constructional details
- G09F13/0427—Constructional details in the form of buttons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
- G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Theoretical Computer Science (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021110363.0A DE102021110363A1 (de) | 2021-04-22 | 2021-04-22 | Bedienelement und verfahren |
DE102021110363.0 | 2021-04-22 | ||
PCT/EP2022/060612 WO2022223726A1 (de) | 2021-04-22 | 2022-04-21 | Bedienelement und verfahren zur herstellung eines bedienelementes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112022002280A5 true DE112022002280A5 (de) | 2024-04-25 |
Family
ID=81750551
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102021110363.0A Withdrawn DE102021110363A1 (de) | 2021-04-22 | 2021-04-22 | Bedienelement und verfahren |
DE112022002280.9T Pending DE112022002280A5 (de) | 2021-04-22 | 2022-04-21 | Bedienelement und verfahren zur herstellung eines bedienelementes |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102021110363.0A Withdrawn DE102021110363A1 (de) | 2021-04-22 | 2021-04-22 | Bedienelement und verfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240191868A1 (de) |
CN (1) | CN117203766A (de) |
DE (2) | DE102021110363A1 (de) |
WO (1) | WO2022223726A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022102368A1 (de) | 2022-02-01 | 2023-08-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bedienelement und verfahren |
DE102022110160A1 (de) | 2022-04-27 | 2023-11-02 | Ams-Osram International Gmbh | Optoelektronisches bauelement |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010118317A2 (en) | 2009-04-09 | 2010-10-14 | Touchsensor Technologies, Llc | Integrated touch sensor electrode and backlight mask |
DE102010062428B4 (de) | 2010-12-03 | 2013-11-21 | BSH Bosch und Siemens Hausgeräte GmbH | Optische Bedien- und/oder Anzeigeeinheit |
JP2012150304A (ja) * | 2011-01-20 | 2012-08-09 | Tokai Rika Co Ltd | 表示装置 |
DE102011050585B4 (de) | 2011-05-24 | 2014-05-08 | Kunststoff Helmbrechts Ag | Verfahren zur Herstellung eines Kunststoffformkörpers als Anzeige- und/oder Funktionselement und Kunststoffformkörper |
DE102016206174B4 (de) * | 2016-04-13 | 2023-10-12 | E.G.O. Elektro-Gerätebau GmbH | Anzeigeelement, Anzeigevorrichtung mit einem solchen Anzeigeelement und Elektrogerät mit einer solchen Anzeigevorrichtung |
EP3508380B1 (de) | 2018-01-04 | 2023-11-08 | Harman Becker Automotive Systems GmbH | Anzeige- und beleuchtungssystem für den fahrzeuginnenraum |
-
2021
- 2021-04-22 DE DE102021110363.0A patent/DE102021110363A1/de not_active Withdrawn
-
2022
- 2022-04-21 US US18/287,845 patent/US20240191868A1/en active Pending
- 2022-04-21 WO PCT/EP2022/060612 patent/WO2022223726A1/de active Application Filing
- 2022-04-21 CN CN202280030343.5A patent/CN117203766A/zh active Pending
- 2022-04-21 DE DE112022002280.9T patent/DE112022002280A5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102021110363A1 (de) | 2022-10-27 |
WO2022223726A1 (de) | 2022-10-27 |
CN117203766A (zh) | 2023-12-08 |
US20240191868A1 (en) | 2024-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed |