DE112018006202A5 - Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil - Google Patents
Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil Download PDFInfo
- Publication number
- DE112018006202A5 DE112018006202A5 DE112018006202.3T DE112018006202T DE112018006202A5 DE 112018006202 A5 DE112018006202 A5 DE 112018006202A5 DE 112018006202 T DE112018006202 T DE 112018006202T DE 112018006202 A5 DE112018006202 A5 DE 112018006202A5
- Authority
- DE
- Germany
- Prior art keywords
- radiation
- emitting component
- producing
- emitting
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0267—Integrated focusing lens
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00403—Producing compound lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017128824.4 | 2017-12-05 | ||
DE102017128824.4A DE102017128824A1 (de) | 2017-12-05 | 2017-12-05 | Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil |
PCT/EP2018/083029 WO2019110419A1 (de) | 2017-12-05 | 2018-11-29 | Verfahren zur herstellung eines strahlungsemittierenden bauteils und strahlungsemittierendes bauteil |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112018006202A5 true DE112018006202A5 (de) | 2020-09-03 |
DE112018006202B4 DE112018006202B4 (de) | 2022-12-01 |
Family
ID=64572351
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017128824.4A Withdrawn DE102017128824A1 (de) | 2017-12-05 | 2017-12-05 | Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil |
DE112018006202.3T Active DE112018006202B4 (de) | 2017-12-05 | 2018-11-29 | Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017128824.4A Withdrawn DE102017128824A1 (de) | 2017-12-05 | 2017-12-05 | Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil |
Country Status (3)
Country | Link |
---|---|
US (1) | US11686999B2 (de) |
DE (2) | DE102017128824A1 (de) |
WO (1) | WO2019110419A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022122987B3 (de) | 2022-09-09 | 2023-12-07 | Universität Stuttgart, Körperschaft Des Öffentlichen Rechts | Verfahren zur Herstellung einer Mikrooptik |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3932184A (en) * | 1973-05-29 | 1976-01-13 | Bell Telephone Laboratories, Incorporated | Fabrication of microlenses |
JPS58219748A (ja) * | 1982-06-15 | 1983-12-21 | Toshiba Corp | 半導体装置 |
CA1294470C (en) * | 1986-07-26 | 1992-01-21 | Toshihiro Suzuki | Process for the production of optical elements |
JP2586536B2 (ja) * | 1987-12-17 | 1997-03-05 | ソニー株式会社 | 半導体レーザ装置の製造方法 |
CA2071598C (en) * | 1991-06-21 | 1999-01-19 | Akira Eda | Optical device and method of manufacturing the same |
US5912913A (en) * | 1995-12-27 | 1999-06-15 | Hitachi, Ltd. | Vertical cavity surface emitting laser, optical transmitter-receiver module using the laser, and parallel processing system using the laser |
JPH09243869A (ja) * | 1996-03-14 | 1997-09-19 | Hitachi Ltd | 光モジュールの製造方法 |
US6121983A (en) * | 1998-11-19 | 2000-09-19 | Xerox Corporation | Method and apparatus for a solid state laser scanning architecture |
WO2001096915A2 (en) * | 2000-06-15 | 2001-12-20 | 3M Innovative Properties Company | Microfabrication of organic optical elements |
JP2004072004A (ja) * | 2002-08-09 | 2004-03-04 | Keiji Tanaka | マイクロレンズ付発光素子およびその形成方法 |
JP2004118918A (ja) * | 2002-09-25 | 2004-04-15 | Fuji Xerox Co Ltd | 光ヘッドおよびその製造方法 |
JP2007008004A (ja) * | 2005-06-30 | 2007-01-18 | Jsr Corp | 光学部品、光学部品の製造方法及び光学部品用型の製造方法 |
US8968987B2 (en) * | 2012-01-11 | 2015-03-03 | International Business Machines Corporation | Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist |
GB2502313A (en) * | 2012-05-24 | 2013-11-27 | Ibm | Manufacturing three dimensional photonic device by two photon absorption polymerization |
EP2916151B1 (de) * | 2014-03-05 | 2020-01-01 | Corning Optical Communications LLC | Verfahren zur Herstellung einer Faserkopplungsvorrichtung |
US20160072585A1 (en) * | 2014-09-08 | 2016-03-10 | Helios Lightworks, LLC | Method Of Creating An Optical Link Among Devices |
DE102015012980B4 (de) * | 2015-10-07 | 2018-08-16 | Baden-Württemberg Stiftung Ggmbh | Verfahren zur Herstellung von Mikrostrukturen auf optischen Fasern |
DE102016214606B3 (de) * | 2016-08-05 | 2017-08-31 | Karlsruher Institut für Technologie | Verfahren und Vorrichtung zur lithographischen Erzeugung einer Zielstruktur an einer nicht-planaren Ausgangsstruktur |
DE102016221464A1 (de) | 2016-11-02 | 2018-05-03 | Karlsruher Institut für Technologie | Verfahren zur Herstellung eines optischen Systems und optisches System |
-
2017
- 2017-12-05 DE DE102017128824.4A patent/DE102017128824A1/de not_active Withdrawn
-
2018
- 2018-11-29 US US16/769,833 patent/US11686999B2/en active Active
- 2018-11-29 WO PCT/EP2018/083029 patent/WO2019110419A1/de active Application Filing
- 2018-11-29 DE DE112018006202.3T patent/DE112018006202B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
US20200371434A1 (en) | 2020-11-26 |
DE112018006202B4 (de) | 2022-12-01 |
DE102017128824A1 (de) | 2019-06-06 |
WO2019110419A1 (de) | 2019-06-13 |
US11686999B2 (en) | 2023-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R016 | Response to examination communication | ||
R018 | Grant decision by examination section/examining division | ||
R020 | Patent grant now final |