DE112018006465A5 - Verfahren zur herstellung eines konversionselements und konversionselement - Google Patents

Verfahren zur herstellung eines konversionselements und konversionselement Download PDF

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Publication number
DE112018006465A5
DE112018006465A5 DE112018006465.4T DE112018006465T DE112018006465A5 DE 112018006465 A5 DE112018006465 A5 DE 112018006465A5 DE 112018006465 T DE112018006465 T DE 112018006465T DE 112018006465 A5 DE112018006465 A5 DE 112018006465A5
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DE
Germany
Prior art keywords
conversion element
manufacturing
conversion
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112018006465.4T
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English (en)
Inventor
Luca Haiberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Oled GmbH
Original Assignee
Osram Oled GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Oled GmbH filed Critical Osram Oled GmbH
Publication of DE112018006465A5 publication Critical patent/DE112018006465A5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112018006465.4T 2017-12-19 2018-12-05 Verfahren zur herstellung eines konversionselements und konversionselement Pending DE112018006465A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017130574.2 2017-12-19
DE102017130574.2A DE102017130574A1 (de) 2017-12-19 2017-12-19 Verfahren zur Herstellung eines Konversionselements und Konversionselement
PCT/EP2018/083660 WO2019121020A1 (de) 2017-12-19 2018-12-05 Verfahren zur herstellung eines konversionselements und konversionselement

Publications (1)

Publication Number Publication Date
DE112018006465A5 true DE112018006465A5 (de) 2020-08-27

Family

ID=64870397

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102017130574.2A Withdrawn DE102017130574A1 (de) 2017-12-19 2017-12-19 Verfahren zur Herstellung eines Konversionselements und Konversionselement
DE112018006465.4T Pending DE112018006465A5 (de) 2017-12-19 2018-12-05 Verfahren zur herstellung eines konversionselements und konversionselement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102017130574.2A Withdrawn DE102017130574A1 (de) 2017-12-19 2017-12-19 Verfahren zur Herstellung eines Konversionselements und Konversionselement

Country Status (5)

Country Link
US (1) US12009460B2 (de)
JP (1) JP7317831B2 (de)
CN (1) CN111512450B (de)
DE (2) DE102017130574A1 (de)
WO (1) WO2019121020A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7349294B2 (ja) 2019-08-29 2023-09-22 株式会社ジャパンディスプレイ Ｌｅｄモジュール及び表示装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006068141A1 (ja) * 2004-12-24 2006-06-29 Kabushiki Kaisha Toshiba 白色ｌｅｄおよびそれを用いたバックライト並びに液晶表示装置
US7935975B2 (en) * 2005-09-29 2011-05-03 Kabushiki Kaisha Toshiba White LED lamp and backlight using the same, and liquid crystal display device using the backlight
EP2363896A4 (de) 2008-11-28 2013-08-28 Koito Mfg Co Ltd Lichtemissionsmodul, verfahren zur herstellung eines lichtemissionsmoduls und lampeneinheit
DE102010054280A1 (de) * 2010-12-13 2012-06-14 Osram Opto Semiconductors Gmbh Verfahren zum Erzeugen einer Lumineszenzkonversionsstoffschicht, Zusammensetzung hierfür und Bauelement umfassend eine solche Lumineszenzkonversionsstoffschicht
KR101219106B1 (ko) 2011-08-01 2013-01-11 삼성전자주식회사 발광소자 패키지 및 그 제조방법
DE102012110957A1 (de) 2012-11-14 2014-05-28 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement zur Emission von mischfarbiger Strahlung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
WO2014091914A1 (ja) 2012-12-10 2014-06-19 シチズンホールディングス株式会社 Ｌｅｄ装置及びその製造方法
KR102264061B1 (ko) * 2013-09-13 2021-06-14 루미리즈 홀딩 비.브이. 플립-칩 ｌｅｄ를 위한 프레임 기반 패키지
DE102014102293A1 (de) * 2014-02-21 2015-08-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung optoelektronischer Halbleiterbauteile und optoelektronisches Halbleiterbauteil
WO2016039593A1 (ko) * 2014-09-12 2016-03-17 주식회사 세미콘라이트 반도체 발광소자의 제조 방법
DE102015103571A1 (de) 2015-03-11 2016-09-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl an Konversionselementen, Konversionselement und optoelektronisches Bauelement
US11127887B2 (en) 2015-08-03 2021-09-21 Lumileds Llc Semiconductor light emitting device with reflective side coating
TWI655791B (zh) * 2015-11-10 2019-04-01 億光電子工業股份有限公司 發光二極體裝置與其製作方法
CN107275459B (zh) 2017-06-16 2024-02-02 万澄林置业(深圳)有限公司 封装元件及其制造方法

Also Published As

Publication number Publication date
WO2019121020A1 (de) 2019-06-27
US12009460B2 (en) 2024-06-11
DE102017130574A1 (de) 2019-06-19
JP2021507527A (ja) 2021-02-22
JP7317831B2 (ja) 2023-07-31
US20200388729A1 (en) 2020-12-10
CN111512450B (zh) 2024-05-31
CN111512450A (zh) 2020-08-07

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