DE112015002785T5 - Sensor für eine physikalische Grösse - Google Patents

Sensor für eine physikalische Grösse Download PDF

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Publication number
DE112015002785T5
DE112015002785T5 DE112015002785.8T DE112015002785T DE112015002785T5 DE 112015002785 T5 DE112015002785 T5 DE 112015002785T5 DE 112015002785 T DE112015002785 T DE 112015002785T DE 112015002785 T5 DE112015002785 T5 DE 112015002785T5
Authority
DE
Germany
Prior art keywords
sensor
angular velocity
section
drive
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112015002785.8T
Other languages
German (de)
English (en)
Inventor
Kiyomasa Sugimoto
Naoki Yoshida
Minekazu Sakai
Nobuaki KUZUYA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE112015002785T5 publication Critical patent/DE112015002785T5/de
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5614—Signal processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5628—Manufacturing; Trimming; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
DE112015002785.8T 2014-06-12 2015-06-11 Sensor für eine physikalische Grösse Pending DE112015002785T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014121690A JP6409351B2 (ja) 2014-06-12 2014-06-12 物理量センサ
JP2014-121690 2014-06-12
PCT/JP2015/002919 WO2015190104A1 (ja) 2014-06-12 2015-06-11 物理量センサ

Publications (1)

Publication Number Publication Date
DE112015002785T5 true DE112015002785T5 (de) 2017-03-02

Family

ID=54833215

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112015002785.8T Pending DE112015002785T5 (de) 2014-06-12 2015-06-11 Sensor für eine physikalische Grösse

Country Status (4)

Country Link
US (1) US10393523B2 (enExample)
JP (1) JP6409351B2 (enExample)
DE (1) DE112015002785T5 (enExample)
WO (1) WO2015190104A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6492739B2 (ja) 2015-02-20 2019-04-03 セイコーエプソン株式会社 回路装置、物理量検出装置、電子機器及び移動体
JP6586735B2 (ja) * 2015-02-20 2019-10-09 セイコーエプソン株式会社 回路装置、物理量検出装置、電子機器及び移動体
KR102437764B1 (ko) 2017-12-20 2022-08-30 삼성전자주식회사 센서 패키지, 센서 패키지의 제조 방법, 및 리드 구조체의 제조 방법
JP6996344B2 (ja) * 2018-02-28 2022-01-17 セイコーエプソン株式会社 センサーデバイス、力検出装置およびロボット

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3123352B2 (ja) 1994-06-29 2001-01-09 株式会社デンソー 漏れ測定方法及びその装置
JPH10206273A (ja) * 1997-01-21 1998-08-07 Toyota Motor Corp 角速度センサの気密性確認方法及び装置
JPH1151802A (ja) * 1997-07-31 1999-02-26 River Eletec Kk 圧電素子用パッケージの気密検査方法
JP3435665B2 (ja) 2000-06-23 2003-08-11 株式会社村田製作所 複合センサ素子およびその製造方法
JP3512004B2 (ja) 2000-12-20 2004-03-29 トヨタ自動車株式会社 力学量検出装置
DE102004027501A1 (de) 2004-06-04 2005-12-22 Robert Bosch Gmbh Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren
JP2006010659A (ja) 2004-06-21 2006-01-12 Microstone Corp 振動ジャイロスコープ
JP4543869B2 (ja) 2004-10-15 2010-09-15 株式会社デンソー 振動型角速度センサにおけるセンサ回路
JP5222457B2 (ja) * 2005-09-26 2013-06-26 株式会社日立製作所 センサおよびセンサモジュール
DE102006016260B4 (de) 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements
EP2187168A4 (en) 2007-09-03 2013-04-03 Panasonic Corp INERTIA FORCE SENSOR
JP5319122B2 (ja) 2008-01-21 2013-10-16 日立オートモティブシステムズ株式会社 慣性センサ
US7800190B2 (en) * 2008-06-16 2010-09-21 Honeywell International Inc. Getter on die in an upper sense plate designed system
JP5321150B2 (ja) 2009-03-05 2013-10-23 セイコーエプソン株式会社 複合センサー
JP2010204061A (ja) * 2009-03-06 2010-09-16 Panasonic Corp 電子部品及びその製造方法
JP5316479B2 (ja) 2009-06-09 2013-10-16 株式会社デンソー 半導体力学量センサの製造方法及び半導体力学量センサ
JP5298047B2 (ja) * 2010-02-26 2013-09-25 日立オートモティブシステムズ株式会社 複合センサの製造方法
US20120142136A1 (en) 2010-12-01 2012-06-07 Honeywell International Inc. Wafer level packaging process for mems devices
DE112011105884T5 (de) * 2011-11-28 2014-08-21 Hitachi Automotive Systems, Ltd. Verbundsensor und Verfahren zu seiner Herstellung
JP2013120179A (ja) * 2011-12-09 2013-06-17 Panasonic Corp 角速度センサ
JP6435631B2 (ja) 2014-04-23 2018-12-12 株式会社デンソー 角速度センサ

Also Published As

Publication number Publication date
JP2016001158A (ja) 2016-01-07
WO2015190104A1 (ja) 2015-12-17
US10393523B2 (en) 2019-08-27
US20170059320A1 (en) 2017-03-02
JP6409351B2 (ja) 2018-10-24

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