DE112015002777T5 - Sensor für eine physikalische Grösse - Google Patents

Sensor für eine physikalische Grösse Download PDF

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Publication number
DE112015002777T5
DE112015002777T5 DE112015002777.7T DE112015002777T DE112015002777T5 DE 112015002777 T5 DE112015002777 T5 DE 112015002777T5 DE 112015002777 T DE112015002777 T DE 112015002777T DE 112015002777 T5 DE112015002777 T5 DE 112015002777T5
Authority
DE
Germany
Prior art keywords
sensor
angular velocity
section
acceleration sensor
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112015002777.7T
Other languages
German (de)
English (en)
Inventor
Takeru KANAZAWA
Minekazu Sakai
Naoki Yoshida
Kiyomasa Sugimoto
Nobuaki KUZUYA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE112015002777T5 publication Critical patent/DE112015002777T5/de
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5628—Manufacturing; Trimming; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/071—Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
DE112015002777.7T 2014-06-12 2015-06-11 Sensor für eine physikalische Grösse Ceased DE112015002777T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-121688 2014-06-12
JP2014121688A JP6311469B2 (ja) 2014-06-12 2014-06-12 物理量センサ
PCT/JP2015/002921 WO2015190105A1 (ja) 2014-06-12 2015-06-11 物理量センサ

Publications (1)

Publication Number Publication Date
DE112015002777T5 true DE112015002777T5 (de) 2017-03-02

Family

ID=54833216

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112015002777.7T Ceased DE112015002777T5 (de) 2014-06-12 2015-06-11 Sensor für eine physikalische Grösse

Country Status (6)

Country Link
US (2) US20170074653A1 (enExample)
JP (1) JP6311469B2 (enExample)
CN (1) CN106662601A (enExample)
DE (1) DE112015002777T5 (enExample)
MY (1) MY186015A (enExample)
WO (1) WO2015190105A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6464749B2 (ja) * 2015-01-06 2019-02-06 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP6641878B2 (ja) * 2015-10-21 2020-02-05 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
US10352960B1 (en) * 2015-10-30 2019-07-16 Garmin International, Inc. Free mass MEMS accelerometer
US10495663B2 (en) * 2016-02-19 2019-12-03 The Regents Of The University Of Michigan High aspect-ratio low noise multi-axis accelerometers
JP2019120559A (ja) * 2017-12-28 2019-07-22 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、物理量センサーデバイス、電子機器および移動体
US11754591B2 (en) * 2019-11-07 2023-09-12 Honeywell International Inc. Vibrating beam accelerometer with pressure damping

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4332944A1 (de) * 1993-09-28 1995-03-30 Bosch Gmbh Robert Sensor mit einer Quarz-Stimmgabel
CN101189489B (zh) * 2005-06-09 2011-12-07 松下电器产业株式会社 复合传感器
JP4534912B2 (ja) * 2005-08-30 2010-09-01 株式会社デンソー 角速度センサの取付構造
JP2007248328A (ja) * 2006-03-17 2007-09-27 Matsushita Electric Ind Co Ltd 複合センサ
JP2008082812A (ja) * 2006-09-27 2008-04-10 Denso Corp センサ装置およびその製造方法
CN101796374A (zh) * 2007-09-03 2010-08-04 松下电器产业株式会社 惯性力传感器
JP2009092545A (ja) * 2007-10-10 2009-04-30 Panasonic Corp 角速度および加速度検出用複合センサ
JP4973443B2 (ja) * 2007-10-22 2012-07-11 株式会社デンソー センサ装置
JP2011117858A (ja) * 2009-12-04 2011-06-16 Seiko Epson Corp 物理量検出装置
DE112011103465B4 (de) * 2010-10-15 2015-07-09 Hitachi Automotive Systems, Ltd. Detektor für physikalische Größe
US9231119B2 (en) * 2011-03-11 2016-01-05 Panasonic Intellectual Property Management Co., Ltd. Sensor
JP2014021038A (ja) * 2012-07-23 2014-02-03 Seiko Epson Corp 振動片、振動片の製造方法、振動子、電子デバイス、電子機器、および移動体

Also Published As

Publication number Publication date
CN106662601A (zh) 2017-05-10
US20170074653A1 (en) 2017-03-16
JP6311469B2 (ja) 2018-04-18
US20190301866A1 (en) 2019-10-03
MY186015A (en) 2021-06-14
WO2015190105A1 (ja) 2015-12-17
JP2016001156A (ja) 2016-01-07

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