CN106662601A - 物理量传感器 - Google Patents

物理量传感器 Download PDF

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Publication number
CN106662601A
CN106662601A CN201580030809.1A CN201580030809A CN106662601A CN 106662601 A CN106662601 A CN 106662601A CN 201580030809 A CN201580030809 A CN 201580030809A CN 106662601 A CN106662601 A CN 106662601A
Authority
CN
China
Prior art keywords
mentioned
angular
rate sensor
acceleration transducer
physical quantity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580030809.1A
Other languages
English (en)
Chinese (zh)
Inventor
金泽武
酒井峰
酒井峰一
吉田直记
杉本圭正
葛谷伸明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN106662601A publication Critical patent/CN106662601A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5628—Manufacturing; Trimming; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/071—Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
CN201580030809.1A 2014-06-12 2015-06-11 物理量传感器 Pending CN106662601A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-121688 2014-06-12
JP2014121688A JP6311469B2 (ja) 2014-06-12 2014-06-12 物理量センサ
PCT/JP2015/002921 WO2015190105A1 (ja) 2014-06-12 2015-06-11 物理量センサ

Publications (1)

Publication Number Publication Date
CN106662601A true CN106662601A (zh) 2017-05-10

Family

ID=54833216

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580030809.1A Pending CN106662601A (zh) 2014-06-12 2015-06-11 物理量传感器

Country Status (6)

Country Link
US (2) US20170074653A1 (enExample)
JP (1) JP6311469B2 (enExample)
CN (1) CN106662601A (enExample)
DE (1) DE112015002777T5 (enExample)
MY (1) MY186015A (enExample)
WO (1) WO2015190105A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6464749B2 (ja) * 2015-01-06 2019-02-06 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP6641878B2 (ja) * 2015-10-21 2020-02-05 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
US10352960B1 (en) * 2015-10-30 2019-07-16 Garmin International, Inc. Free mass MEMS accelerometer
US10495663B2 (en) * 2016-02-19 2019-12-03 The Regents Of The University Of Michigan High aspect-ratio low noise multi-axis accelerometers
JP2019120559A (ja) * 2017-12-28 2019-07-22 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、物理量センサーデバイス、電子機器および移動体
US11493531B2 (en) * 2019-11-07 2022-11-08 Honeywell International Inc. Resonator electrode configuration to avoid capacitive feedthrough for vibrating beam accelerometers

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531091A (en) * 1993-09-28 1996-07-02 Robert Bosch Gmbh Sensor with quartz tuning fork
JP2008082812A (ja) * 2006-09-27 2008-04-10 Denso Corp センサ装置およびその製造方法
CN101189489A (zh) * 2005-06-09 2008-05-28 松下电器产业株式会社 复合传感器
JP2009103530A (ja) * 2007-10-22 2009-05-14 Denso Corp センサ装置
CN101796374A (zh) * 2007-09-03 2010-08-04 松下电器产业株式会社 惯性力传感器
CN101821586A (zh) * 2007-10-10 2010-09-01 松下电器产业株式会社 角速度及加速度检测用复合传感器
JP2011117858A (ja) * 2009-12-04 2011-06-16 Seiko Epson Corp 物理量検出装置
TW201245725A (en) * 2011-03-11 2012-11-16 Panasonic Corp Sensor
CN103575261A (zh) * 2012-07-23 2014-02-12 精工爱普生株式会社 振动片及其制法、振子、电子装置、电子设备及移动体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4534912B2 (ja) * 2005-08-30 2010-09-01 株式会社デンソー 角速度センサの取付構造
JP2007248328A (ja) * 2006-03-17 2007-09-27 Matsushita Electric Ind Co Ltd 複合センサ
WO2012049825A1 (ja) * 2010-10-15 2012-04-19 日立オートモティブシステムズ株式会社 物理量検出装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531091A (en) * 1993-09-28 1996-07-02 Robert Bosch Gmbh Sensor with quartz tuning fork
CN101189489A (zh) * 2005-06-09 2008-05-28 松下电器产业株式会社 复合传感器
JP2008082812A (ja) * 2006-09-27 2008-04-10 Denso Corp センサ装置およびその製造方法
CN101796374A (zh) * 2007-09-03 2010-08-04 松下电器产业株式会社 惯性力传感器
CN101821586A (zh) * 2007-10-10 2010-09-01 松下电器产业株式会社 角速度及加速度检测用复合传感器
JP2009103530A (ja) * 2007-10-22 2009-05-14 Denso Corp センサ装置
JP2011117858A (ja) * 2009-12-04 2011-06-16 Seiko Epson Corp 物理量検出装置
TW201245725A (en) * 2011-03-11 2012-11-16 Panasonic Corp Sensor
CN103575261A (zh) * 2012-07-23 2014-02-12 精工爱普生株式会社 振动片及其制法、振子、电子装置、电子设备及移动体

Also Published As

Publication number Publication date
JP6311469B2 (ja) 2018-04-18
WO2015190105A1 (ja) 2015-12-17
US20170074653A1 (en) 2017-03-16
JP2016001156A (ja) 2016-01-07
DE112015002777T5 (de) 2017-03-02
US20190301866A1 (en) 2019-10-03
MY186015A (en) 2021-06-14

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Application publication date: 20170510