DE112015002397B4 - Automatische Handhabungsvorrichtung - Google Patents

Automatische Handhabungsvorrichtung

Info

Publication number
DE112015002397B4
DE112015002397B4 DE112015002397.6T DE112015002397T DE112015002397B4 DE 112015002397 B4 DE112015002397 B4 DE 112015002397B4 DE 112015002397 T DE112015002397 T DE 112015002397T DE 112015002397 B4 DE112015002397 B4 DE 112015002397B4
Authority
DE
Germany
Prior art keywords
workpiece
carrier
movable section
receiving opening
suction head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112015002397.6T
Other languages
German (de)
English (en)
Other versions
DE112015002397T5 (de
Inventor
Taichi Yasuda
Tatsuo Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE112015002397T5 publication Critical patent/DE112015002397T5/de
Application granted granted Critical
Publication of DE112015002397B4 publication Critical patent/DE112015002397B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/102—Gears specially adapted therefor, e.g. reduction gears
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE112015002397.6T 2014-06-16 2015-05-13 Automatische Handhabungsvorrichtung Active DE112015002397B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014123518A JP6183301B2 (ja) 2014-06-16 2014-06-16 自動ハンドリング装置
JP2014-123518 2014-06-16
PCT/JP2015/002425 WO2015194092A1 (ja) 2014-06-16 2015-05-13 自動ハンドリング装置

Publications (2)

Publication Number Publication Date
DE112015002397T5 DE112015002397T5 (de) 2017-02-23
DE112015002397B4 true DE112015002397B4 (de) 2026-01-29

Family

ID=54935108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112015002397.6T Active DE112015002397B4 (de) 2014-06-16 2015-05-13 Automatische Handhabungsvorrichtung

Country Status (8)

Country Link
US (1) US9931730B2 (https=)
JP (1) JP6183301B2 (https=)
KR (1) KR102150406B1 (https=)
CN (1) CN106660191B (https=)
DE (1) DE112015002397B4 (https=)
SG (1) SG11201610298XA (https=)
TW (1) TWI594841B (https=)
WO (1) WO2015194092A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6922467B2 (ja) * 2016-07-08 2021-08-18 Ａｇｃ株式会社 被処理部材の位置決め装置、処理装置、位置決め方法およびガラス板の製造方法
CN108561532A (zh) * 2018-04-28 2018-09-21 湖南宇晶机器股份有限公司 分体局部升降式齿圈结构
CN108515450B (zh) * 2018-06-08 2023-08-01 新乡日升数控轴承装备股份有限公司 用于研磨机上料的工装及研磨机的上料方法
JP7162551B2 (ja) * 2019-02-18 2022-10-28 株式会社ディスコ 加工装置
CN111136573B (zh) * 2019-11-27 2021-12-03 常州市瑞得通讯科技有限公司 一种高稳定、低损耗陶瓷滤波器制备流水线
KR102262418B1 (ko) * 2020-03-05 2021-06-08 주식회사 클레버 이차전지 셀의 폴딩 공정용 이차전지 셀 이송 장치
CN112103211B (zh) * 2020-08-21 2024-03-12 大连佳峰自动化股份有限公司 多头芯片拾取绑定机构
CN113427383A (zh) * 2021-07-27 2021-09-24 成都市瑞研光科技有限公司 一种智能抛光机
CN114834898A (zh) * 2022-03-28 2022-08-02 中环领先半导体材料有限公司 磨片下料自动取片装置
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法
CN116000958B (zh) * 2022-12-28 2024-07-19 力鼎智能装备(青岛)集团有限公司 一种手腕设备及夹取方法
CN118875967B (zh) * 2024-09-23 2024-12-13 北京特思迪半导体设备有限公司 一种游星轮外圈滚道装置以及外圈驱动系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243996A (ja) * 2004-02-27 2005-09-08 Shin Etsu Handotai Co Ltd 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944186B2 (ja) * 1982-06-11 1984-10-27 スピ−ドフアム株式会社 平面研削装置
JPS61241060A (ja) * 1985-04-17 1986-10-27 Supiide Fuamu Kk 平面自動研磨装置
JPS6368359A (ja) 1986-09-10 1988-03-28 Otani Reiji ラツピングマシンのキヤリヤ単位ワ−ク同時装填及キヤリヤスライド心出し位置決め方法
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
JPH11179649A (ja) * 1997-12-16 1999-07-06 Speedfam Co Ltd ワークの取出方法及びワーク取出機構付き平面研磨装置
JP2000042913A (ja) * 1998-07-22 2000-02-15 Fujikoshi Mach Corp 両面研磨装置のワーク給排システム
JP2008114342A (ja) * 2006-11-06 2008-05-22 Nakamura Tome Precision Ind Co Ltd 基板加工機のワークローダ
JP4357551B2 (ja) * 2007-08-21 2009-11-04 株式会社春近精密 ワーク搬送装置のワーク搬送方法
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置
JP5493633B2 (ja) * 2009-09-18 2014-05-14 株式会社Ｓｕｍｃｏ 研磨方法及びその装置
JP5872947B2 (ja) 2012-04-05 2016-03-01 光洋機械工業株式会社 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243996A (ja) * 2004-02-27 2005-09-08 Shin Etsu Handotai Co Ltd 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法

Also Published As

Publication number Publication date
CN106660191B (zh) 2018-06-29
TWI594841B (zh) 2017-08-11
KR20170018833A (ko) 2017-02-20
SG11201610298XA (en) 2017-01-27
WO2015194092A1 (ja) 2015-12-23
JP6183301B2 (ja) 2017-08-23
KR102150406B1 (ko) 2020-09-01
US20170190019A1 (en) 2017-07-06
CN106660191A (zh) 2017-05-10
TW201600232A (zh) 2016-01-01
JP2016002612A (ja) 2016-01-12
US9931730B2 (en) 2018-04-03
DE112015002397T5 (de) 2017-02-23

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: B24B0041060000

Ipc: B23Q0007040000

R018 Grant decision by examination section/examining division