SG11201610298XA - Automatic handling apparatus - Google Patents

Automatic handling apparatus

Info

Publication number
SG11201610298XA
SG11201610298XA SG11201610298XA SG11201610298XA SG11201610298XA SG 11201610298X A SG11201610298X A SG 11201610298XA SG 11201610298X A SG11201610298X A SG 11201610298XA SG 11201610298X A SG11201610298X A SG 11201610298XA SG 11201610298X A SG11201610298X A SG 11201610298XA
Authority
SG
Singapore
Prior art keywords
handling apparatus
automatic handling
automatic
handling
Prior art date
Application number
SG11201610298XA
Other languages
English (en)
Inventor
Taichi Yasuda
Tatsuo Enomoto
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201610298XA publication Critical patent/SG11201610298XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/102—Gears specially adapted therefor, e.g. reduction gears
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201610298XA 2014-06-16 2015-05-13 Automatic handling apparatus SG11201610298XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014123518A JP6183301B2 (ja) 2014-06-16 2014-06-16 自動ハンドリング装置
PCT/JP2015/002425 WO2015194092A1 (ja) 2014-06-16 2015-05-13 自動ハンドリング装置

Publications (1)

Publication Number Publication Date
SG11201610298XA true SG11201610298XA (en) 2017-01-27

Family

ID=54935108

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610298XA SG11201610298XA (en) 2014-06-16 2015-05-13 Automatic handling apparatus

Country Status (8)

Country Link
US (1) US9931730B2 (https=)
JP (1) JP6183301B2 (https=)
KR (1) KR102150406B1 (https=)
CN (1) CN106660191B (https=)
DE (1) DE112015002397B4 (https=)
SG (1) SG11201610298XA (https=)
TW (1) TWI594841B (https=)
WO (1) WO2015194092A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6922467B2 (ja) * 2016-07-08 2021-08-18 Ａｇｃ株式会社 被処理部材の位置決め装置、処理装置、位置決め方法およびガラス板の製造方法
CN108561532A (zh) * 2018-04-28 2018-09-21 湖南宇晶机器股份有限公司 分体局部升降式齿圈结构
CN108515450B (zh) * 2018-06-08 2023-08-01 新乡日升数控轴承装备股份有限公司 用于研磨机上料的工装及研磨机的上料方法
JP7162551B2 (ja) * 2019-02-18 2022-10-28 株式会社ディスコ 加工装置
CN111136573B (zh) * 2019-11-27 2021-12-03 常州市瑞得通讯科技有限公司 一种高稳定、低损耗陶瓷滤波器制备流水线
KR102262418B1 (ko) * 2020-03-05 2021-06-08 주식회사 클레버 이차전지 셀의 폴딩 공정용 이차전지 셀 이송 장치
CN112103211B (zh) * 2020-08-21 2024-03-12 大连佳峰自动化股份有限公司 多头芯片拾取绑定机构
CN113427383A (zh) * 2021-07-27 2021-09-24 成都市瑞研光科技有限公司 一种智能抛光机
CN114834898A (zh) * 2022-03-28 2022-08-02 中环领先半导体材料有限公司 磨片下料自动取片装置
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法
CN116000958B (zh) * 2022-12-28 2024-07-19 力鼎智能装备(青岛)集团有限公司 一种手腕设备及夹取方法
CN118875967B (zh) * 2024-09-23 2024-12-13 北京特思迪半导体设备有限公司 一种游星轮外圈滚道装置以及外圈驱动系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944186B2 (ja) * 1982-06-11 1984-10-27 スピ−ドフアム株式会社 平面研削装置
JPS61241060A (ja) * 1985-04-17 1986-10-27 Supiide Fuamu Kk 平面自動研磨装置
JPS6368359A (ja) 1986-09-10 1988-03-28 Otani Reiji ラツピングマシンのキヤリヤ単位ワ−ク同時装填及キヤリヤスライド心出し位置決め方法
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
JPH11179649A (ja) * 1997-12-16 1999-07-06 Speedfam Co Ltd ワークの取出方法及びワーク取出機構付き平面研磨装置
JP2000042913A (ja) * 1998-07-22 2000-02-15 Fujikoshi Mach Corp 両面研磨装置のワーク給排システム
JP4492155B2 (ja) * 2004-02-27 2010-06-30 信越半導体株式会社 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法
JP2008114342A (ja) * 2006-11-06 2008-05-22 Nakamura Tome Precision Ind Co Ltd 基板加工機のワークローダ
JP4357551B2 (ja) * 2007-08-21 2009-11-04 株式会社春近精密 ワーク搬送装置のワーク搬送方法
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置
JP5493633B2 (ja) * 2009-09-18 2014-05-14 株式会社Ｓｕｍｃｏ 研磨方法及びその装置
JP5872947B2 (ja) * 2012-04-05 2016-03-01 光洋機械工業株式会社 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Also Published As

Publication number Publication date
KR102150406B1 (ko) 2020-09-01
CN106660191B (zh) 2018-06-29
CN106660191A (zh) 2017-05-10
JP6183301B2 (ja) 2017-08-23
TWI594841B (zh) 2017-08-11
DE112015002397T5 (de) 2017-02-23
TW201600232A (zh) 2016-01-01
WO2015194092A1 (ja) 2015-12-23
KR20170018833A (ko) 2017-02-20
US20170190019A1 (en) 2017-07-06
DE112015002397B4 (de) 2026-01-29
US9931730B2 (en) 2018-04-03
JP2016002612A (ja) 2016-01-12

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