DE112014001884A5 - Lichtemittierendes Halbleiterbauelement - Google Patents

Lichtemittierendes Halbleiterbauelement Download PDF

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Publication number
DE112014001884A5
DE112014001884A5 DE112014001884.8T DE112014001884T DE112014001884A5 DE 112014001884 A5 DE112014001884 A5 DE 112014001884A5 DE 112014001884 T DE112014001884 T DE 112014001884T DE 112014001884 A5 DE112014001884 A5 DE 112014001884A5
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DE
Germany
Prior art keywords
light emitting
semiconductor device
emitting semiconductor
light
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112014001884.8T
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English (en)
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DE112014001884B4 (de
Inventor
Tobias Gebuhr
Christian Ziereis
Michael Zitzlsperger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of DE112014001884A5 publication Critical patent/DE112014001884A5/de
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Publication of DE112014001884B4 publication Critical patent/DE112014001884B4/de
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
DE112014001884.8T 2013-04-09 2014-04-09 Optoelektronisches Bauelement, Trägerverbund zur Herstellung optoelektronischer Bauelemente und Verfahren zur Herstellung optoelektronischer Bauelemente Active DE112014001884B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013206186.2 2013-04-09
DE102013206186.2A DE102013206186A1 (de) 2013-04-09 2013-04-09 Optoelektronisches Bauelement
PCT/EP2014/057196 WO2014167021A1 (de) 2013-04-09 2014-04-09 Lichtemittierendes halbleiterbauelement

Publications (2)

Publication Number Publication Date
DE112014001884A5 true DE112014001884A5 (de) 2015-12-24
DE112014001884B4 DE112014001884B4 (de) 2024-05-02

Family

ID=50479169

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013206186.2A Withdrawn DE102013206186A1 (de) 2013-04-09 2013-04-09 Optoelektronisches Bauelement
DE112014001884.8T Active DE112014001884B4 (de) 2013-04-09 2014-04-09 Optoelektronisches Bauelement, Trägerverbund zur Herstellung optoelektronischer Bauelemente und Verfahren zur Herstellung optoelektronischer Bauelemente

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013206186.2A Withdrawn DE102013206186A1 (de) 2013-04-09 2013-04-09 Optoelektronisches Bauelement

Country Status (6)

Country Link
US (1) US9614134B2 (de)
JP (1) JP6223544B2 (de)
KR (1) KR20150140369A (de)
CN (1) CN105264679B (de)
DE (2) DE102013206186A1 (de)
WO (1) WO2014167021A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015107660A1 (de) * 2015-05-15 2016-11-17 Osram Opto Semiconductors Gmbh Elektronisches Bauteil sowie Verfahren zur Herstellung eines elektronischen Bauteils
DE102015112757A1 (de) * 2015-08-04 2017-02-09 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE102016114571A1 (de) * 2016-08-05 2018-02-08 Osram Opto Semiconductors Gmbh Filament mit einem träger
US11677059B2 (en) 2017-04-26 2023-06-13 Samsung Electronics Co., Ltd. Light-emitting device package including a lead frame
KR102335216B1 (ko) * 2017-04-26 2021-12-03 삼성전자 주식회사 발광소자 패키지
JP7089167B2 (ja) 2018-04-23 2022-06-22 日亜化学工業株式会社 発光装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2697743B2 (ja) * 1989-05-29 1998-01-14 富士通株式会社 樹脂封止型半導体装置
JPH0498858A (ja) * 1990-08-16 1992-03-31 Nec Kyushu Ltd 半導体装置用リードフレーム
JP2761193B2 (ja) * 1994-03-10 1998-06-04 日本モトローラ株式会社 外部リードを固定したリードフレーム及びこれを利用した半導体装置並びにその製造方法
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10214121C1 (de) * 2002-03-28 2003-12-24 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit mehreren Halbleiterchips
JP2004193294A (ja) * 2002-12-11 2004-07-08 Shinko Electric Ind Co Ltd 半導体用中空樹脂パッケージ
JP4341832B2 (ja) * 2003-12-08 2009-10-14 鈴鹿富士ゼロックス株式会社 Ｌｅｄプリントヘッドの製造方法
JP2006237289A (ja) * 2005-02-25 2006-09-07 Toppan Printing Co Ltd リードフレーム構造体及びその製造方法
DE202007018552U1 (de) * 2007-08-15 2008-10-23 Zender, Arnold Verformbares Beleuchtungsmodul
DE102008053489A1 (de) * 2008-10-28 2010-04-29 Osram Opto Semiconductors Gmbh Trägerkörper für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines Trägerkörpers
DE102009031008A1 (de) 2009-06-29 2010-12-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
KR101114197B1 (ko) 2010-08-09 2012-02-22 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
WO2012049854A1 (ja) * 2010-10-14 2012-04-19 パナソニック株式会社 発光装置及びこれを用いた面光源装置
US8933548B2 (en) 2010-11-02 2015-01-13 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
DE102011056810B4 (de) * 2011-12-21 2022-01-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement

Also Published As

Publication number Publication date
WO2014167021A1 (de) 2014-10-16
DE102013206186A1 (de) 2014-10-09
KR20150140369A (ko) 2015-12-15
CN105264679B (zh) 2018-09-18
US9614134B2 (en) 2017-04-04
JP2016516309A (ja) 2016-06-02
CN105264679A (zh) 2016-01-20
JP6223544B2 (ja) 2017-11-01
DE112014001884B4 (de) 2024-05-02
US20160043291A1 (en) 2016-02-11

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