DE112014000774A5 - Monolithisches Halbleiterchip-Array - Google Patents

Monolithisches Halbleiterchip-Array Download PDF

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Publication number
DE112014000774A5
DE112014000774A5 DE112014000774.9T DE112014000774T DE112014000774A5 DE 112014000774 A5 DE112014000774 A5 DE 112014000774A5 DE 112014000774 T DE112014000774 T DE 112014000774T DE 112014000774 A5 DE112014000774 A5 DE 112014000774A5
Authority
DE
Germany
Prior art keywords
semiconductor chip
chip array
monolithic semiconductor
monolithic
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112014000774.9T
Other languages
English (en)
Inventor
Thomas Schlereth
Markus Kirsch
Christian Gärtner
Tony Albrecht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112014000774A5 publication Critical patent/DE112014000774A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE112014000774.9T 2013-02-12 2014-02-05 Monolithisches Halbleiterchip-Array Pending DE112014000774A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013101367.8 2013-02-12
DE102013101367.8A DE102013101367A1 (de) 2013-02-12 2013-02-12 Halbleiterchip
PCT/EP2014/052246 WO2014124853A1 (de) 2013-02-12 2014-02-05 Monolithisches halbleiterchip-array

Publications (1)

Publication Number Publication Date
DE112014000774A5 true DE112014000774A5 (de) 2015-10-22

Family

ID=50033587

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013101367.8A Withdrawn DE102013101367A1 (de) 2013-02-12 2013-02-12 Halbleiterchip
DE112014000774.9T Pending DE112014000774A5 (de) 2013-02-12 2014-02-05 Monolithisches Halbleiterchip-Array

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013101367.8A Withdrawn DE102013101367A1 (de) 2013-02-12 2013-02-12 Halbleiterchip

Country Status (3)

Country Link
US (1) US9379161B2 (de)
DE (2) DE102013101367A1 (de)
WO (1) WO2014124853A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
JP6927970B2 (ja) * 2015-11-20 2021-09-01 ルミレッズ ホールディング ベーフェー 異なる電気的構成を可能にするダイボンドパッド設計
EP3378106B1 (de) * 2015-11-20 2019-10-02 Lumileds Holding B.V. Chipbondpadentwurf zur ermöglichung verschiedener elektrischer konfigurationen
DE102017100716A1 (de) 2017-01-16 2018-07-19 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
DE102018125281A1 (de) * 2018-10-12 2020-04-16 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
WO2022000385A1 (zh) * 2020-07-01 2022-01-06 重庆康佳光电技术研究院有限公司 显示面板的制作方法、显示面板及显示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940683A (en) * 1996-01-18 1999-08-17 Motorola, Inc. LED display packaging with substrate removal and method of fabrication
US6514782B1 (en) * 1999-12-22 2003-02-04 Lumileds Lighting, U.S., Llc Method of making a III-nitride light-emitting device with increased light generating capability
JP3904571B2 (ja) * 2004-09-02 2007-04-11 ローム株式会社 半導体発光装置
US7910395B2 (en) * 2006-09-13 2011-03-22 Helio Optoelectronics Corporation LED structure
DE102008011848A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102008051050A1 (de) * 2008-10-09 2010-04-15 Osram Opto Semiconductors Gmbh Modul mit optoelektronischen Halbleiterelementen
US8207539B2 (en) 2009-06-09 2012-06-26 Epistar Corporation Light-emitting device having a thinned structure and the manufacturing method thereof
EP2445018B1 (de) 2009-06-15 2016-05-11 Panasonic Intellectual Property Management Co., Ltd. Lichtemittierendes halbleiterbauelement, lichtemittierendes modul und beleuchtungsvorrichtung
WO2013016355A1 (en) 2011-07-25 2013-01-31 Cree, Inc. Monolithic multi-junction light emitting devices including multiple groups of light emitting diodes

Also Published As

Publication number Publication date
WO2014124853A1 (de) 2014-08-21
US20150372054A1 (en) 2015-12-24
DE102013101367A1 (de) 2014-08-14
US9379161B2 (en) 2016-06-28

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